My Inquiry
My Account
Infineon Technologies CYT3BB5CEBQ0AEEGS
- Part No.:
- CYT3BB5CEBQ0AEEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
CYT3BB5CEBQ0AEEGS.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 100QFP
- Quantity:
- Payment:
- Shipping:
Inventory:475
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT3BB5CEBQ0AEEGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 CPUs (250 MHz), one Arm® Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and LIN (16 channels). It targets high-end body-control units requiring ASIL-B functional safety compliance, secure boot, and hardware cryptography acceleration.
For engineers reviewing the CYT3BB5CEBQ0AEEGS datasheet, CYT3BB5CEBQ0AEEGS pinout, CYT3BB5CEBQ0AEEGS application, or CYT3BB5CEBQ0AEEGS equivalent, this page delivers verified technical context, validated pin-level functionality, real-world automotive use cases, and confirmed alternative parts with documented interface and safety-feature differences.
Technical Context
The device implements a heterogeneous dual-core architecture: two lockstep-capable Cortex-M7 cores for primary control and a dedicated Cortex-M0+ core for peripheral management and security services. Hardware inter-processor communication enables deterministic task partitioning between safety-critical and non-safety domains.
It integrates SECDED ECC on all safety-critical memories (SRAM, flash, TCM), SMPU/PPU/MPU for memory and peripheral protection, and supports ISO 11898-1:2015 CAN FD with up to eight concurrent channels - each capable of 8 Mbps data rate under compliant PHY topology.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for segregated safety/peripheral processing |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash with Read-While-Write and dual-bank FOTA support |
| SRAM | 768 KB with configurable retention granularity for low-power mode optimization |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting 8 Mbps data rate |
| Ethernet Interface | 10/100 Mbps MAC with IEEE-802.3bw, MII/RMII PHY support, and IEEE-1588 PTP timing precision |
| Functional Safety | ASIL-B compliant with MPU, SMPU, PPU, MCWDT, SECDED ECC, and BOD/OVD/LVD monitoring |
| Cryptography Engine | HSM with AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and Galois/Counter Mode (GCM) acceleration |
Pinout & Package
This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm, 0.8-mm ball pitch), optimized for automotive ECU thermal and routing density requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog Power Supply | 1.1-V regulated analog supply for ADCs and comparators; requires separate filtering from digital rails |
| VDDD | Digital Core Power | 1.1-V regulated core supply derived from 2.7–5.5 V input; supports dynamic voltage scaling |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator Input/Output | Supports 1–50 MHz crystal for precise clock source; required for CAN FD bit timing accuracy |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 Differential Transceiver Interface | Direct connection to external CAN FD transceiver; supports ISO 11898-2 physical layer signaling |
| ETH_MDC / ETH_MDIO | Ethernet Management Data Clock/Input-Output | IEEE-802.3-compliant MDIO bus for PHY register configuration and status polling |
| SWDIO / SWCLK | Serial Wire Debug Interface | Two-pin debug interface supporting full JTAG/SWD access, trace, and secure firmware update |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic firmware updates over-the-air without runtime interruption or external memory dependency |
| Hardware Security Module (HSM) | Offloads cryptographic operations (AES, SHA, ECC) from main CPU, reducing latency and attack surface |
| Configurable I/O types (GPIO_STD/ENH/HSIO) | Allows per-pin selection of drive strength, slew rate, and noise immunity for mixed-signal ECU routing |
| Synchronized multi-ADC sampling | Simultaneous capture across three 12-bit SAR ADCs for motor current/voltage sensing with <100 ns skew |
| Smart I/O logic blocks | Five programmable Boolean engines enable hardware-level signal conditioning (debounce, edge detection, masking) without CPU intervention |
Applications
| Body Control Module (BCM) | Advanced Lighting Control Unit |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirrors, and interior lighting in premium vehicles. IC Role / Device Role / Timing Role: Primary MCU executing ASIL-B-compliant safety monitors while managing LIN-based slave nodes and CAN FD gateway functions. Use Value: Dual-core isolation ensures lighting PWM timing remains deterministic even during firmware update or diagnostic communication bursts. | Use Scenario: Adaptive front-lighting system (AFS) with matrix LED arrays and real-time beam shaping. IC Role / Device Role / Timing Role: Real-time motor control for actuator positioning and synchronized PWM dimming of >64 LED segments via TCPWM blocks. Use Value: 75× 16-bit TCPWM channels support independent dead-time insertion and phase-shifted modulation for thermal load balancing. |
| Automotive Gateway ECU | Electric Power Steering (EPS) Support MCU |
Use Scenario: Protocol translation between CAN FD backbone, LIN subnets, and Ethernet AVB audio/video domains. IC Role / Device Role / Timing Role: High-throughput packet routing engine with hardware-accelerated CRC32 and timestamping for IEEE-1588 PTP synchronization. Use Value: Integrated Ethernet MAC and eight CAN FD channels eliminate need for external protocol bridge ICs, reducing BOM count and latency. | Use Scenario: Secondary controller handling sensor fusion (steering angle, torque, motor position) and CAN FD feedback to primary EPS MCU. IC Role / Device Role / Timing Role: Safety-monitoring co-processor running independent diagnostics on ADC inputs and motor phase currents. Use Value: Dedicated Cortex-M0+ core executes ASIL-B watchdog checks and ECC-protected RAM scrubbing without affecting primary control loop timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 @ 320 MHz; no integrated Ethernet MAC; uses external PHY for 100BASE-T1 | Lacks native Ethernet AVB/PTP support; relies on external PHY and switch for time-sensitive networking | Select when CAN FD + LIN + safety is primary requirement and Ethernet is not needed at MAC layer |
| Renesas RH850/U2A | Tri-core (RH850-G3M + dual lockstep); no hardware crypto accelerator; supports CAN FD but limited to 5 Mbps | Focused on powertrain with mature ASIL-D toolchain; lacks HSM and secure boot acceleration | Select for ASIL-D powertrain applications where cryptographic offload is handled externally or omitted |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3BB5CEBQ0AEEGS uniquely combines dual M7 cores, integrated 10/100 Ethernet MAC with PTP, and hardware-accelerated HSM - enabling consolidated gateway + security + timing functions in a single ASIL-B-certified package.
Availability
CYT3BB5CEBQ0AEEGS is available at Aetrix Electronics and suitable for automotive body control modules, advanced lighting systems, gateway ECUs, and electric power steering support units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CYT3BB5CEBQ0AEEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with leadership in automotive MCUs and silicon carbide devices.
CYT3BB is part of Infineon's TRAVEO™ T2G family, designed specifically for next-generation automotive domain controllers requiring ASIL-B functional safety, secure over-the-air updates, and multi-protocol connectivity (CAN FD, Ethernet, LIN).
FAQ
What is the maximum CAN FD data rate supported by CYT3BB5CEBQ0AEEGS?
The device supports CAN FD up to 8 Mbps per channel, compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 specifications. Actual achievable rate depends on physical layer topology, transceiver capability, and bus length - with 5 Mbps typical for 10-m harnesses and 2 Mbps for 20-m configurations using standard automotive cabling.
Does CYT3BB5CEBQ0AEEGS include hardware support for IEEE-1588 Precision Time Protocol?
Yes - the integrated Ethernet MAC supports IEEE-1588 PTP timestamping at the MAC layer with hardware-assisted correction for ingress/egress delays. It provides sub-microsecond synchronization accuracy when paired with a compliant PHY and calibrated oscillator, enabling time-sensitive applications like AVB audio bridging and distributed control loops.
How is functional safety implemented for memory subsystems in this MCU?
SECDED (Single Error Correction, Double Error Detection) ECC is applied to all safety-critical memories: SRAM, code-flash, work-flash, and TCM. Each memory block includes dedicated parity generation and correction logic, with automatic error logging and interrupt generation on uncorrectable errors - meeting ASIL-B requirements per ISO 26262 Part 5 Annex D.
Can the dual Cortex-M7 cores operate in lockstep mode for ASIL-D applications?
No - CYT3BB5CEBQ0AEEGS supports lockstep only for individual Cortex-M7 cores (not dual-core lockstep), and is certified for ASIL-B. For ASIL-D, Infineon recommends the CYT4BB variant with enhanced safety mechanisms including dual-core lockstep and additional diagnostic coverage - verified in the CYT4BB safety manual (INFINEON-AN258711).
CYT3BB5CEBQ0AEEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 72
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 55x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3BB5CEBQ0AEEGS FAQ
1.How can I place an order for CYT3BB5CEBQ0AEEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3BB5CEBQ0AEEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3BB5CEBQ0AEEGS reliable?
The price and inventory of CYT3BB5CEBQ0AEEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3BB5CEBQ0AEEGS is usually 5 days.
3.What payment methods are accepted for CYT3BB5CEBQ0AEEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3BB5CEBQ0AEEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3BB5CEBQ0AEEGS?
CYT3BB5CEBQ0AEEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3BB5CEBQ0AEEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3BB5CEBQ0AEEGS?
For technical support, including CYT3BB5CEBQ0AEEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3BB5CEBQ0AEEGS requirements.
6.How does Aetrix verify that CYT3BB5CEBQ0AEEGS is sourced from the original manufacturer or authorized distributors?
All CYT3BB5CEBQ0AEEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3BB5CEBQ0AEEGS meets industry standards.
7.What is the process for return or replacement of CYT3BB5CEBQ0AEEGS?
All CYT3BB5CEBQ0AEEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3BB5CEBQ0AEEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3BB5CEBQ0AEEGS part is unused and in its original packaging.
Return procedure for CYT3BB5CEBQ0AEEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT3BB5CEBQ0AEEGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
