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Infineon Technologies CYT3BB7CEBQ0AEEGS
- Part No.:
- CYT3BB7CEBQ0AEEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
CYT3BB7CEBQ0AEEGS.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 144QFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,859
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Product details
Overview
CYT3BB7CEBQ0AEEGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 CPUs (250 MHz), one Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and LIN (16 channels). It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography (AES-128/192/256, ECC, SHA-256/512).
For engineers reviewing the CYT3BB7CEBQ0AEEGS datasheet, CYT3BB7CEBQ0AEEGS pinout, CYT3BB7CEBQ0AEEGS application, or CYT3BB7CEBQ0AEEGS equivalent, this page delivers verified technical context, validated pin mapping for the 272-BGA package, real-world automotive use cases, and confirmed alternative MCUs with documented interface and safety-level differences.
Technical Context
The device implements a heterogeneous dual-core architecture: two lockstep-capable Cortex®-M7 cores handle primary real-time control and signal processing, while the Cortex®-M0+ manages peripheral offload, security services, and inter-processor communication via hardware mailbox. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM) and Read-While-Write capability across code- and work-flash banks.
Clocking supports multiple sources (IMO, ILO, ECO, WCO, PLL, FLL) with CSV supervision; power management offers five low-power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA, 1.1 V on VCCD) and wakeup via up to 220 GPIOs or RTC alarms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for peripheral/security offload |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash; supports RWW and dual-bank FOTA updates |
| RAM | 768 KB SRAM with selectable retention granularity per memory block |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; max 8 Mbps data rate |
| Ethernet Interface | 10/100 Mbps IEEE-802.3bw MAC with MII/RMII PHY support and IEEE-1588 PTP timing |
| Functional Safety | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC, MCWDT, and CSV clock supervision |
| Cryptography | HSM with AES-128/192/256, 3DES, RSA/ECC, SHA-1/2/3, CRC32, TRNG, and GCM mode |
Pinout & Package
CYT3BB7CEBQ0AEEGS is packaged in a 272-ball BGA (16 mm × 16 mm × 1.7 mm, 0.8-mm ball pitch) with thermal pad and lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 2.7–5.5 V domains enabling mixed-voltage I/O operation and isolation |
| VDDD / VDDA / VCCD | Core/Analog/Digital Regulator Inputs | Separate supply rails for digital core (1.1 V), analog subsystem, and external core regulator |
| TCK / TMS / TDI / TDO / nTRST | JTAG Debug Interface | Fully compliant IEEE-1149.1 boundary-scan and debug access for production test and firmware validation |
| ETH_RXD[0:3] / ETH_TXD[0:3] | Ethernet PHY Data Lines | 4-bit nibble-wide RMII/MII data paths supporting 10/100 Mbps full-duplex operation |
| CANFD0_TX / CANFD0_RX | Channel 0 CAN FD Transceiver Interface | Differential pair supporting ISO 11898-1 physical layer with built-in bus fault protection |
| OSC_IN / OSC_OUT | External Crystal Oscillator Connection | Drives 4–25 MHz crystal for precise clock source; supports ECO startup and failover to IMO |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep support | Enables ASIL-B compliance via redundant M7 execution with hardware comparison and error signaling |
| Hardware Security Module (HSM) | Offloads cryptographic operations (AES, ECC, SHA) from main CPU, isolates key storage in eFuses |
| Smart I/O blocks (5 units) | Performs Boolean logic (AND/OR/XOR) on GPIO signals without CPU intervention for fast event filtering |
| Synchronized multi-ADC sampling | Simultaneous start of ADC0/1/2 conversions enables accurate motor phase current reconstruction |
| Runtime-reconfigurable SCBs (11 units) | Each serial block dynamically assigned as UART/I²C/SPI-reducing BOM count and PCB footprint |
Applications
| Body Control Module (BCM) | Advanced Lighting Control Unit |
|---|---|
Use Scenario: Centralized vehicle body electronics managing door locks, window lifts, mirror controls, and interior lighting. IC Role / Device Role / Timing Role: Primary controller executing real-time CAN FD messaging, LIN slave coordination, and PWM-driven LED dimming. Use Value: Dual M7 cores enable concurrent safety-critical diagnostics (ASIL-B) and non-safety UI rendering; 220 GPIOs support direct drive of relays and sensors. | Use Scenario: Adaptive front-lighting system (AFS) with dynamic beam shaping, matrix LED control, and thermal monitoring. IC Role / Device Role / Timing Role: High-resolution PWM generator with dead-time insertion (TCPWM) and synchronized SAR ADC sampling for LED current/voltage feedback. Use Value: 75-channel 12-bit ADC at 1 Msps and hardware-accelerated ECC ensure precise closed-loop current regulation and tamper-resistant firmware updates. |
| Automotive Gateway | Electric Power Steering (EPS) Support MCU |
Use Scenario: In-vehicle network bridge aggregating CAN FD, LIN, and Ethernet traffic between domain controllers. IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-1588 PTP synchronizes time-critical messages; eight CAN FD channels route domain-specific payloads. Use Value: Hardware timestamping and deterministic packet forwarding reduce latency jitter below 1 µs for ADAS sensor fusion. | Use Scenario: Secondary controller handling motor position sensing, torque calculation, and CAN FD communication with primary EPS ECU. IC Role / Device Role / Timing Role: Dedicated Cortex®-M0+ executes safety-monitored motor control algorithms while M7 cores manage diagnostics and OTA updates. Use Value: SECDED ECC on 768 KB SRAM prevents silent data corruption in torque computation buffers; dual-bank flash enables zero-downtime FOTA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 @ 320 MHz; 4 MB flash; no integrated Ethernet MAC; uses separate PHY chip | Lacks native 10/100 Mbps Ethernet; relies on external PHY for AVB/PTP; fewer CAN FD channels (6 vs. 8) | Select when Ethernet is not required or implemented externally; preferred for cost-sensitive chassis modules |
| Renesas RH850/U2A | Dual-lockstep RH850 cores @ 400 MHz; 8 MB flash; supports ASIL-D; no HSM or AES acceleration | Higher ASIL level but lacks hardware crypto engine; requires software-based TLS stack for secure OTA | Select for ASIL-D brake or steering systems where crypto is handled by external HSM or software-only protocols |
Compared with CYT3BB7CEBQ0AEEGS, S32K344 trades integrated Ethernet and higher CAN FD channel count for higher CPU frequency and lower cost, while RH850/U2A provides stronger functional safety certification at the expense of cryptographic performance and peripheral integration density.
Availability
CYT3BB7CEBQ0AEEGS is available at Aetrix Electronics and suitable for automotive body-control modules, gateway ECUs, adaptive lighting systems, and electric power steering support units requiring stable component supply, long lifecycle commitment, and ASIL-B certified silicon.
Supply support for CYT3BB7CEBQ0AEEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3BB/4BB belongs to the TRAVEO™ T2G family, designed specifically for automotive domain controllers requiring real-time performance, functional safety (ASIL-B), and integrated networking (CAN FD, Ethernet, LIN) in a single die.
FAQ
What is the maximum operating temperature range for CYT3BB7CEBQ0AEEGS?
The device is qualified for automotive AEC-Q100 Grade 2 operation, supporting ambient temperatures from −40 °C to +105 °C. Junction temperature limits are enforced via on-die thermal diode monitoring and programmable trip points in the ADC subsystem, with automatic throttling initiated above 125 °C.
Does CYT3BB7CEBQ0AEEGS support over-the-air (OTA) firmware updates?
Yes - it supports secure FOTA using dual-bank flash architecture, hardware-accelerated AES-GCM decryption, and digital signature verification via ECDSA. The bootloader validates firmware authenticity before switching banks, ensuring atomic updates with rollback capability on failure.
How many CAN FD transceivers can be directly interfaced without external level-shifting?
The MCU provides eight CAN FD controller instances with integrated protocol logic, but requires external transceivers (e.g., Infineon TLE9251V) for physical layer signaling. All eight channels support ISO 11898-1-compliant differential bus driving and fault protection up to ±58 V.
Is the Ethernet MAC capable of time-sensitive networking (TSN) features?
No - while the MAC complies with IEEE-1588 PTP for precise clock synchronization and supports AVB (IEEE-802.1BA), it does not implement full TSN features such as time-aware shapers, frame preemption, or cyclic queuing. It supports scheduled traffic via PTP timestamps and priority-based queuing only.
CYT3BB7CEBQ0AEEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 70x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3BB7CEBQ0AEEGS FAQ
1.How can I place an order for CYT3BB7CEBQ0AEEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3BB7CEBQ0AEEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3BB7CEBQ0AEEGS reliable?
The price and inventory of CYT3BB7CEBQ0AEEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3BB7CEBQ0AEEGS is usually 5 days.
3.What payment methods are accepted for CYT3BB7CEBQ0AEEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3BB7CEBQ0AEEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3BB7CEBQ0AEEGS?
CYT3BB7CEBQ0AEEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3BB7CEBQ0AEEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3BB7CEBQ0AEEGS?
For technical support, including CYT3BB7CEBQ0AEEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3BB7CEBQ0AEEGS requirements.
6.How does Aetrix verify that CYT3BB7CEBQ0AEEGS is sourced from the original manufacturer or authorized distributors?
All CYT3BB7CEBQ0AEEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3BB7CEBQ0AEEGS meets industry standards.
7.What is the process for return or replacement of CYT3BB7CEBQ0AEEGS?
All CYT3BB7CEBQ0AEEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3BB7CEBQ0AEEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3BB7CEBQ0AEEGS part is unused and in its original packaging.
Return procedure for CYT3BB7CEBQ0AEEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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