My Inquiry
My Account
Infineon Technologies CYT3BB7CEBQ0AESGS
- Part No.:
- CYT3BB7CEBQ0AESGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
CYT3BB7CEBQ0AESGS.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 144QFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,351
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT3BB7CEBQ0AESGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller with dual Arm® Cortex®-M7 CPUs (250 MHz), one Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and hardware security (AES-256, ECC, SHA-512). It targets high-end body-control units requiring ASIL-B functional safety compliance.
For engineers reviewing the CYT3BB7CEBQ0AESGS datasheet, CYT3BB7CEBQ0AESGS pinout, CYT3BB7CEBQ0AESGS application, or CYT3BB7CEBQ0AESGS equivalent, key selection considerations include dual-core deterministic real-time execution, RWW flash for FOTA updates, SECDED ECC on all safety-critical memories, and hardware-accelerated cryptographic primitives supporting secure boot and HSM functionality.
Technical Context
The device implements a heterogeneous multi-core architecture: two lockstep-capable Cortex-M7 cores handle primary real-time control and signal processing, while the Cortex-M0+ manages peripheral offload, security services, and inter-processor communication via dedicated hardware mailbox. Memory subsystem includes 4160 KB code-flash with dual-bank RWW support and 768 KB SRAM with configurable retention granularity.
Functional safety is enforced through MPU, SMPU, PPU, MCWDT, BOD/OVD/LVD, CSV, and SECDED ECC on flash, SRAM, and TCM. Communication stack integrates eight CAN FD channels compliant with ISO 11898-1:2015 and IEEE-802.1BA/1588 via its Ethernet MAC with MII/RMII PHY interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for peripheral/security offload |
| Flash Memory | 4160 KB code-flash with Read-While-Write and dual-bank mode for atomic FOTA updates |
| SRAM | 768 KB with selectable retention granularity per memory region |
| CAN FD Channels | 8 independent channels supporting up to 8 Mbps data rate per channel, ISO 11898-1:2015 compliant |
| Ethernet Interface | 10/100 Mbps MAC with MII/RMII PHY support and IEEE-1588 PTP/IEEE-802.1BA AVB compliance |
| Security Engine | Hardware-accelerated AES-128/192/256, SHA-1/2/3 (up to SHA-512), RSA/ECC, TRNG, and GCM mode |
| Safety Certification | ASIL-B compliant with SECDED ECC on flash/SRAM/TCM, SMPU, PPU, MCWDT, and clock supervisor |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm (max), 0.8-mm ball pitch, RoHS-compliant, automotive-grade (AEC-Q100 Grade 2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog Power Supply | 2.7–5.5 V analog domain supply for ADCs, comparators, and reference circuits |
| VDDD | Digital Core Power | 1.1 V nominal core supply generated internally; supports low-power active/sleep modes |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator Input/Output | Supports 1–50 MHz crystal for precision clock source; enables ECO-based timing accuracy |
| ETH_RXD0–3 / ETH_TXD0–3 | Ethernet Data I/O | MII interface pins for 10/100 Mbps Ethernet; require external PHY connection |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 Transceiver Interface | Differential pair for CAN FD physical layer; supports up to 8 Mbps with external transceiver |
| SWDIO / SWCLK | Serial Wire Debug Interface | Two-pin debug port supporting programming, real-time trace, and secure firmware update |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank RWW Flash | Enables seamless in-field firmware updates without halting application execution |
| Hardware Security Module (HSM) | Offloads cryptographic operations (AES, ECC, SHA) and enforces secure boot via digital signature verification |
| ASIL-B Safety Architecture | Includes SMPU, PPU, MCWDT, and SECDED ECC across all safety-critical memories |
| Configurable I/O Types | Three GPIO classes (STD/ENH/HSIO) allow optimized drive strength, slew rate, and noise immunity per signal path |
| Smart I/O Logic Blocks | Five programmable Boolean logic units enable hardware-level signal conditioning and event filtering without CPU intervention |
Applications
| Body Control Module (BCM) | Gateway Controller |
|---|---|
Use Scenario: Centralized management of lighting, door locks, window lifts, and climate controls in premium vehicles. IC Role / Device Role / Timing Role: Primary real-time controller executing deterministic task scheduling and CAN FD message routing. Use Value: Dual Cortex-M7 cores deliver parallel processing for concurrent LIN/CAN FD/Ethernet traffic handling with <10 µs interrupt latency. | Use Scenario: Aggregation and protocol translation between vehicle domains (powertrain, chassis, infotainment) over CAN FD, LIN, and Ethernet. IC Role / Device Role / Timing Role: High-throughput gateway MCU with hardware-accelerated crypto for secure inter-domain messaging. Use Value: Integrated 8-channel CAN FD + 10/100 Ethernet MAC eliminates need for external bridge ICs, reducing BOM count and latency. |
| Advanced Lighting Control | Secure OTA Update Node |
Use Scenario: Adaptive front-lighting systems (AFS) requiring precise PWM timing, motor position feedback, and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motor control node with synchronized SAR ADC sampling and TCPWM dead-time insertion. Use Value: 75× 16-bit TCPWM blocks and synchronized triple ADC scanning enable sub-microsecond phase-aligned LED dimming and mirror actuation. | Use Scenario: Field-deployed ECU requiring cryptographically signed firmware updates validated before execution. IC Role / Device Role / Timing Role: Secure boot root-of-trust with eFUSE-backed key storage and hardware-accelerated signature verification. Use Value: On-chip HSM performs ECDSA signature validation in <5 ms, enabling authenticated FOTA with zero external security components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 @ 320 MHz; 4 MB flash; no integrated Ethernet MAC; uses external PHY for 100BASE-T1 | Lacks native Ethernet MAC; requires additional PHY and magnetics for automotive Ethernet | Select when Ethernet is not required or when leveraging existing S32K ecosystem tools and AUTOSAR stack |
| Renesas RH850/U2A | Tri-core (RH850-G3M + dual G3KH); 6 MB flash; 100BASE-T1 PHY integrated; no hardware AES/GCM acceleration | Native 100BASE-T1 support but limited cryptographic acceleration; higher power consumption in DeepSleep | Select for legacy RH850 toolchain continuity or where 100BASE-T1 PHY integration outweighs crypto performance needs |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3BB7CEBQ0AESGS uniquely combines dual M7 cores, on-die 10/100 Ethernet MAC with AVB/PTP, and full HSM acceleration - enabling consolidated gateway + security + real-time control in a single die without external PHY or crypto co-processors.
Availability
CYT3BB7CEBQ0AESGS is available at Aetrix Electronics and suitable for automotive body-control modules, domain gateways, adaptive lighting systems, and secure OTA update nodes requiring stable component supply, long lifecycle commitment, and AEC-Q100 Grade 2 qualification.
Supply support for CYT3BB7CEBQ0AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3BB7CEBQ0AESGS belongs to the TRAVEO™ T2G family, designed specifically for next-generation automotive body and gateway applications demanding ASIL-B compliance, multi-protocol connectivity, and hardware-enforced security.
FAQ
What is the maximum CAN FD data rate supported by CYT3BB7CEBQ0AESGS?
CYT3BB7CEBQ0AESGS supports up to 8 Mbps per CAN FD channel, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Actual achievable rate depends on physical layer topology and external transceiver capabilities, not internal controller limitations.
Does CYT3BB7CEBQ0AESGS include an integrated Ethernet PHY?
No. CYT3BB7CEBQ0AESGS integrates a 10/100 Mbps Ethernet MAC only. External PHY devices are required for MII or RMII interface implementation. It does not include a physical-layer transceiver or magnetics.
How is functional safety implemented for ASIL-B compliance?
ASIL-B compliance is achieved via hardware-enforced mechanisms: SECDED ECC on flash/SRAM/TCM, Shared Memory Protection Unit (SMPU), Peripheral Protection Unit (PPU), Multi-Counter Watchdog Timer (MCWDT), Clock Supervisor (CSV), and Brown-Out Detection with dual thresholds (2.7 V and 3.0 V).
Can CYT3BB7CEBQ0AESGS execute code directly from external memory?
Yes. The device supports Execute-in-Place (XIP) from external memory via its SPI (Quad/Octal) or HYPERBUS™ interface, with on-the-fly encryption/decryption enabled by the integrated cryptography engine for secure external code execution.
CYT3BB7CEBQ0AESGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 70x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3BB7CEBQ0AESGS FAQ
1.How can I place an order for CYT3BB7CEBQ0AESGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3BB7CEBQ0AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3BB7CEBQ0AESGS reliable?
The price and inventory of CYT3BB7CEBQ0AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3BB7CEBQ0AESGS is usually 5 days.
3.What payment methods are accepted for CYT3BB7CEBQ0AESGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3BB7CEBQ0AESGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3BB7CEBQ0AESGS?
CYT3BB7CEBQ0AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3BB7CEBQ0AESGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3BB7CEBQ0AESGS?
For technical support, including CYT3BB7CEBQ0AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3BB7CEBQ0AESGS requirements.
6.How does Aetrix verify that CYT3BB7CEBQ0AESGS is sourced from the original manufacturer or authorized distributors?
All CYT3BB7CEBQ0AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3BB7CEBQ0AESGS meets industry standards.
7.What is the process for return or replacement of CYT3BB7CEBQ0AESGS?
All CYT3BB7CEBQ0AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3BB7CEBQ0AESGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3BB7CEBQ0AESGS part is unused and in its original packaging.
Return procedure for CYT3BB7CEBQ0AESGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT3BB7CEBQ0AESGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
