My Inquiry
My Account
Infineon Technologies CYT3BB8CEBQ0AESGST
- Part No.:
- CYT3BB8CEBQ0AESGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
CYT3BB8CEBQ0AESGST.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 176QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,057
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT3BB8CEBQ0AESGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 CPUs (250 MHz), one Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and hardware security including AES-256, ECC, SHA-512, and TRNG. It supports CAN FD (up to 8 Mbps), 11 configurable SCB channels (I²C/SPI/UART), and Ethernet MAC (10/100 Mbps) for high-end body-control units.
For engineers reviewing the CYT3BB8CEBQ0AESGST datasheet, CYT3BB8CEBQ0AESGST pinout, CYT3BB8CEBQ0AESGST application, or CYT3BB8CEBQ0AESGST equivalent, key selection criteria include ASIL-B functional safety compliance, dual-core deterministic real-time execution, secure boot with digital signature verification, and support for FOTA via dual-bank flash architecture.
Technical Context
The device implements a heterogeneous multi-core architecture: two lockstep-capable Cortex-M7 cores handle primary control and signal processing, while the Cortex-M0+ manages peripheral offload and security services-including eSHE/HSM acceleration and secure boot validation. Inter-processor communication is handled by dedicated hardware mailboxes and shared memory with SMPU protection.
Clocking includes IMO, ILO, ECO, WCO, PLL, and FLL; power management supports five low-power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA, 1.1 V on VCCD) and wakeup sources including up to 220 GPIOs and RTC alarms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for peripheral/security offload |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank firmware update |
| SRAM | 768 KB with selectable retention granularity for low-power state preservation |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; max 8 Mbps data rate |
| Ethernet Interface | 10/100 Mbps MAC supporting MII/RMII PHY interfaces and IEEE-1588 PTP for time-critical networking |
| Security Engine | Hardware-accelerated AES-128/192/256, 3DES, RSA/ECC, SHA-1/2/3, CRC32, TRNG, and GCM mode |
| Functional Safety | ASIL-B compliant with SECDED ECC on SRAM/flash/TCM, MPU/SMPU/PPU, MCWDT, CSV, LVD/BOD/OVD |
Pinout & Package
This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm, 0.8-mm ball pitch) with thermal pad and standard JEDEC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIOx | I/O supply rail | Configurable 1.8 V / 2.5 V / 3.3 V I/O voltage per port group; enables mixed-voltage interfacing |
| VDDD | Digital core supply | 1.1 V nominal regulated core voltage derived from 2.7–5.5 V input; supports dynamic voltage scaling |
| VDDA | Analog supply | Separate 2.7–5.5 V analog rail for SAR ADCs and bandgap reference stability |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–50 MHz crystals for precise clock source; used with ECO block for system timing accuracy |
| TCK / TMS / TDI / TDO / nTRST | JTAG debug interface | IEEE-1149.1-compliant boundary scan and debug access; supports ETM instruction/data trace |
| MDIO / MDC | Ethernet PHY management interface | Enables runtime configuration of external Ethernet PHY registers via SMI protocol |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic firmware updates over-the-air without halting real-time operation or corrupting active code |
| Hardware Security Module (HSM) | Offloads cryptographic operations (RSA/ECC signing, AES-GCM encryption) from application cores to prevent side-channel leakage |
| Smart I/O blocks (5 units) | Performs Boolean logic (AND/OR/XOR) on GPIO signals in hardware-reducing CPU load for sensor fusion or fault monitoring |
| Configurable BOD thresholds | Independent 2.7 V / 3.0 V detection on VDDD/VDDA and 1.1 V on VCCD ensures robust brown-out response across supply domains |
| Synchronized triple SAR ADCs | Simultaneous sampling across all three 12-bit ADCs (75 total channels, 1 Msps each) enables precise motor current/voltage sensing |
Applications
| Body Control Module (BCM) | Advanced Gateway Unit |
|---|---|
Use Scenario: Centralized vehicle body electronics managing lighting, door locks, window lifts, and climate control. IC Role / Device Role / Timing Role: Primary controller executing real-time CAN FD messaging, LIN slave coordination, and secure OTA update orchestration. Use Value: Dual Cortex-M7 cores enable concurrent safety-critical task scheduling and non-safety application layer execution under ASIL-B constraints. | Use Scenario: In-vehicle network gateway bridging CAN FD, LIN, and Ethernet domains for ADAS and infotainment data routing. IC Role / Device Role / Timing Role: Time-synchronized packet forwarding engine using IEEE-1588 PTP and hardware-accelerated crypto for secure inter-domain communication. Use Value: Integrated Ethernet MAC with RMII/MII support eliminates external PHY complexity while maintaining sub-microsecond timestamp resolution. |
| Electric Power Steering (EPS) ECU | Automotive Instrument Cluster |
Use Scenario: Real-time torque assist computation and motor phase control with functional safety monitoring. IC Role / Device Role / Timing Role: Deterministic motor control unit running PWM_DT and quadrature decoding on TCPWM blocks with synchronized ADC sampling. Use Value: Triple SAR ADCs sampled simultaneously at 1 Msps provide phase current and bus voltage feedback with <100 ns inter-channel skew. | Use Scenario: Digital dashboard rendering with graphics acceleration, audio playback, and driver alert integration. IC Role / Device Role / Timing Role: Multimedia host processor managing I²S audio output, SPI-driven TFT display, and secure credential storage via HSM. Use Value: On-chip 768 KB SRAM with retention control allows fast context switching between graphics, audio, and safety-monitoring threads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 @ 320 MHz; no integrated Ethernet MAC; uses external PHY for 100BASE-T1 | Lacks native Ethernet timing features (IEEE-1588, AVB); better suited for CAN/LIN-only gateways | Select when cost-sensitive CAN/LIN gateway design does not require integrated Ethernet or PTP synchronization |
| Renesas RH850/U2A | Tri-core (RH850-G3M + dual lockstep cores); 40 nm process; no hardware AES-GCM or TRNG | Focused on powertrain/safety-critical control; limited multimedia peripheral support (no SDHC/I²S) | Select for ASIL-D powertrain ECUs where cryptographic acceleration is handled externally or omitted |
Compared with S32K344 and RH850/U2A, CYT3BB8CEBQ0AESGST uniquely integrates Ethernet MAC with IEEE-1588 support, dual-bank flash for safe FOTA, and full HSM acceleration-making it optimal for next-gen automotive gateways and body controllers requiring secure, time-synchronized networking.
Availability
CYT3BB8CEBQ0AESGST is available at Aetrix Electronics and suitable for automotive body control modules, advanced gateways, electric power steering ECUs, and instrument clusters requiring stable component supply across extended temperature ranges (–40°C to +125°C).
Supply support for CYT3BB8CEBQ0AESGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3BB8CEBQ0AESGST belongs to the TRAVEO™ T2G family-designed specifically for automotive domain controllers requiring ASIL-B compliance, secure over-the-air updates, and integrated high-speed networking (CAN FD + Ethernet).
FAQ
What is the maximum operating frequency of the Cortex-M7 cores in CYT3BB8CEBQ0AESGST?
The dual Arm® Cortex®-M7 cores operate at up to 250 MHz each, with independent instruction and data caches (16 KB each), tightly coupled memories (16 KB ITCM + 16 KB DTCM), and single-cycle multiply/FPU support. This frequency is sustained across the full automotive temperature range (–40°C to +125°C) under specified voltage conditions (VDDD = 1.1 V ±5%).
Does CYT3BB8CEBQ0AESGST support secure boot with public-key verification?
Yes. The device implements fast secure boot using digital signature verification with asymmetric cryptography (RSA-2048/3072 or ECC NIST P-256/P-384) accelerated by the on-die vector unit. Boot images must be signed using keys fused into OTP eFuses or stored in protected flash regions, and signature validation occurs before any application code executes.
How many CAN FD channels does CYT3BB8CEBQ0AESGST support, and what is their physical layer compatibility?
CYT3BB8CEBQ0AESGST supports up to eight CAN FD channels compliant with ISO 11898-1:2015 and the Bosch CAN FD Specification v1.0. Each channel operates at data rates up to 8 Mbps (arbitration phase ≤1 Mbps), requiring external CAN FD transceivers. It holds ISO 16845:2015 conformance certification for protocol testing.
Is the Ethernet MAC interface capable of IEEE-1588 Precision Time Protocol operation?
Yes. The integrated 10/100 Mbps Ethernet MAC fully supports IEEE-1588-2008 (PTPv2) with hardware timestamping at the MAC layer, enabling sub-microsecond synchronization accuracy. It supports one-step and two-step clock correction modes and integrates with the internal RTC and event generator for deterministic timestamp insertion and interrupt generation on PTP event packets.
CYT3BB8CEBQ0AESGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 148
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 82x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3BB8CEBQ0AESGST FAQ
1.How can I place an order for CYT3BB8CEBQ0AESGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3BB8CEBQ0AESGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3BB8CEBQ0AESGST reliable?
The price and inventory of CYT3BB8CEBQ0AESGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3BB8CEBQ0AESGST is usually 5 days.
3.What payment methods are accepted for CYT3BB8CEBQ0AESGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3BB8CEBQ0AESGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3BB8CEBQ0AESGST?
CYT3BB8CEBQ0AESGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3BB8CEBQ0AESGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3BB8CEBQ0AESGST?
For technical support, including CYT3BB8CEBQ0AESGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3BB8CEBQ0AESGST requirements.
6.How does Aetrix verify that CYT3BB8CEBQ0AESGST is sourced from the original manufacturer or authorized distributors?
All CYT3BB8CEBQ0AESGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3BB8CEBQ0AESGST meets industry standards.
7.What is the process for return or replacement of CYT3BB8CEBQ0AESGST?
All CYT3BB8CEBQ0AESGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3BB8CEBQ0AESGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3BB8CEBQ0AESGST part is unused and in its original packaging.
Return procedure for CYT3BB8CEBQ0AESGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT3BB8CEBQ0AESGST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
