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Infineon Technologies CYT3BBBCEBQ0BZEGST
- Part No.:
- CYT3BBBCEBQ0BZEGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3BBBCEBQ0BZEGST.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 272BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,035
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Product details
Overview
CYT3BBBCEBQ0BZEGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller with dual Arm® Cortex®-M7 CPUs (250 MHz), one Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and LIN (16 channels); used in high-end body-control units requiring ASIL-B functional safety compliance.
For engineers reviewing the CYT3BBBCEBQ0BZEGST datasheet, CYT3BBBCEBQ0BZEGST pinout, CYT3BBBCEBQ0BZEGST application, or CYT3BBBCEBQ0BZEGST equivalent, key selection criteria include dual-core deterministic real-time execution, hardware-accelerated cryptography (AES-128/192/256, ECC, SHA-512), RWW flash for FOTA updates, SECDED ECC on all safety-critical memories, and configurable low-power modes down to Hibernate.
Technical Context
The device implements a heterogeneous multi-core architecture: two lockstep-capable Cortex-M7 cores handle primary control and signal processing, while the Cortex-M0+ manages peripheral offload and security services including secure boot via digital signature verification and HSM-enforced key lifecycle. Inter-processor communication is handled by dedicated hardware mailboxes and shared memory with SMPU enforcement.
Clocking includes IMO, ILO, ECO, WCO, PLL, and FLL; power management supports five low-power states with granular retention control (e.g., selective SRAM retention), BOD at 2.7 V/3.0 V (VDDD/VDDA) and 1.1 V (VCCD), and wakeup sources including up to 220 GPIOs, RTC alarms, and event generators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for peripheral/security offload |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA updates |
| SRAM | 768 KB with selectable retention granularity per memory block for low-power mode optimization |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; max 8 Mbps data rate |
| Ethernet Interface | 10/100 Mbps MAC supporting MII/RMII PHY interfaces and IEEE-1588 PTP for time-synchronized networking |
| Functional Safety | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC on flash/SRAM/TCM, MCWDT, and CSV clock supervision |
| Analog Peripherals | Three 12-bit SAR ADCs (75 total external channels, 1 Msps max sample rate) with synchronized sampling for motor control |
Pinout & Package
This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm, 0.8-mm ball pitch) with thermal pad. Pinout information is defined in the Infineon CYT3BB/4BB Peripheral I/O Map (Datasheet Rev. *H, Section 6) and includes dedicated balls for VDDIO, VDDD, VDDA, VCCD, reset, JTAG/SWD, CAN FD transceiver interfaces, Ethernet RMII/MII signals, SCB (I²C/SPI/UART), LIN, ADC inputs, and GPIO groups with configurable drive strength and slew rate.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O power supply | Eight independent 1.71–5.5 V domains enabling mixed-voltage interface operation (e.g., 3.3 V CAN, 1.8 V SDIO) |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable GPIO banks | 220 total pins grouped into GPIO_STD, GPIO_ENH, and HSIO_STD types with configurable pull-up/down, drive strength, and interrupt capability |
| CANFD0_TX / CANFD0_RX | CAN FD physical layer interface | Differential pair for first CAN FD channel; requires external transceiver; supports bit rates up to 8 Mbps |
| ETH_RMII_REF_CLK, ETH_RMII_RXD[0:1], ETH_RMII_TXD[0:1] | Ethernet RMII interface | 50-MHz reference clock input and 2-bit RX/TX data paths for 10/100 Mbps operation without MII pin overhead |
| JTAG_TCK / JTAG_TMS / SWDIO / SWCLK | Debug interface | Supports IEEE-1149.1 JTAG and Arm SWD protocols for programming, debugging, and trace (ETM) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two Cortex-M7 cores with independent TCM (16 KB I/D each) and cache (16 KB I/D each) enable time-critical task partitioning without OS interference |
| Hardware crypto acceleration | Dedicated engine supports AES-128/192/256, SHA-512/256/160, ECC, RSA, TRNG, and GCM for secure boot and OTA firmware signing |
| FOTA-ready flash architecture | Code-flash and work-flash support simultaneous read/write; dual-bank mode enables atomic firmware swap without runtime interruption |
| ASIL-B safety mechanisms | MPU/SMPU/PPU, SECDED ECC on all safety-critical memories, MCWDT, and clock supervisor ensure fault detection and containment per ISO 26262 |
| Flexible low-power operation | Five power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable SRAM retention and wakeup via 220 GPIOs or RTC alarm |
Applications
| Body Control Module (BCM) | Advanced Gateway Unit |
|---|---|
Use Scenario: Centralized vehicle body electronics managing lighting, door locks, windows, and climate functions across multiple CAN FD domains. IC Role / Device Role / Timing Role: Primary controller executing real-time body logic, coordinating LIN slave nodes, and routing messages between CAN FD networks and Ethernet backbone. Use Value: Dual Cortex-M7 cores provide deterministic response for safety-critical lock/unlock sequences; CAN FD bandwidth supports rapid diagnostics and configuration updates. | Use Scenario: In-vehicle network gateway aggregating traffic from legacy CAN, LIN, and new CAN FD/Ethernet domains for ADAS and infotainment systems. IC Role / Device Role / Timing Role: Protocol translation hub with hardware-accelerated message filtering, routing, and timestamping using IEEE-1588 PTP for time-coordinated sensor fusion. Use Value: Integrated Ethernet MAC and eight CAN FD channels eliminate external bridge ICs; hardware CRC and ECC reduce software overhead in safety-critical routing paths. |
| Electric Power Steering (EPS) Support MCU | Secure Telematics Control Unit |
Use Scenario: Secondary controller in EPS systems handling motor position sensing, torque calculation, and fail-safe actuation coordination with main MCU. IC Role / Device Role / Timing Role: Real-time peripheral processor running motor control algorithms using synchronized 12-bit ADC sampling and TCPWM with dead-time insertion. Use Value: Three SAR ADCs with 75-channel multiplexing and 1 Msps sampling enable precise multi-axis current/voltage feedback; TCPWM blocks support field-oriented control timing. | Use Scenario: Cellular-connected telematics unit performing secure over-the-air updates, remote diagnostics, and encrypted vehicle data logging. IC Role / Device Role / Timing Role: Secure host processor executing signed firmware updates, managing eSIM authentication, and encrypting CAN/Ethernet log data before transmission. Use Value: Hardware HSM enforces key isolation and secure boot; AES-256/GCM ensures confidentiality and integrity of firmware images and telemetry payloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 @ 320 MHz; 4 MB flash; no integrated Ethernet MAC; uses external PHY for 100BASE-T1 | Targeted at chassis/safety domains with CAN FD + FlexRay; lacks native Ethernet for domain controller use cases | Select when FlexRay support and higher CPU clock are prioritized over integrated Ethernet and dual-M7 redundancy |
| Renesas RH850/U2A | Tri-core (4x V850E3 + 1x RH850G3K); 8 MB flash; ASIL-D capable; no native Ethernet MAC | Designed for powertrain and brake ECUs requiring highest ASIL level; lacks CAN FD and modern crypto acceleration | Select for ASIL-D powertrain applications where legacy toolchain compatibility outweighs need for CAN FD bandwidth and FOTA agility |
Compared with CYT3BBBCEBQ0BZEGST, the S32K344 offers higher single-core speed but lacks dual-M7 determinism and integrated Ethernet, while the RH850/U2A achieves ASIL-D but sacrifices CAN FD throughput and modern cryptographic agility required for connected vehicle gateways.
Availability
CYT3BBBCEBQ0BZEGST is available at Aetrix Electronics and suitable for automotive body-control modules, domain gateway units, electric power steering support controllers, and secure telematics systems requiring stable component supply, long-term lifecycle support, and ASIL-B certified silicon.
Supply support for CYT3BBBCEBQ0BZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line delivers scalable, ASIL-B-certified microcontrollers for automotive body, gateway, and domain controller applications, emphasizing real-time performance, functional safety, and secure connectivity.
FAQ
What debug interfaces does CYT3BBBCEBQ0BZEGST support?
CYT3BBBCEBQ0BZEGST supports both IEEE-1149.1-compliant JTAG and Arm Serial Wire Debug (SWD) interfaces. It includes full ETM trace capability for instruction and data flow analysis via JTAG, and data-only trace via SWD. The device is compatible with industry-standard tools including IAR EWARM and Green Hills MULTI for development and certification workflows.
Does CYT3BBBCEBQ0BZEGST support execute-in-place (XIP) from external memory?
Yes - it supports XIP from external memory via its SPI (single/dual/quad/octal) or HYPERBUS™ interface. On-the-fly encryption and decryption are performed in hardware during XIP fetches, ensuring secure code execution directly from external flash without loading into internal RAM, reducing attack surface and memory footprint.
How many CAN FD channels are physically implemented on this specific part?
This variant (CYT3BBBCEBQ0BZEGST) implements eight fully independent CAN FD channels, each compliant with ISO 11898-1:2015 and supporting data rates up to 8 Mbps. All channels feature integrated message RAM, hardware filtering, and error counters, and can operate simultaneously without arbitration contention.
Is the 272-BGA package RoHS and AEC-Q100 qualified?
Yes - the 272-ball BGA package (16 × 16 × 1.7 mm, 0.8-mm pitch) for CYT3BBBCEBQ0BZEGST is RoHS-compliant and qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C ambient), with full qualification documentation available from Infineon's official product change notifications and reliability reports.
CYT3BBBCEBQ0BZEGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 90x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3BBBCEBQ0BZEGST FAQ
1.How can I place an order for CYT3BBBCEBQ0BZEGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3BBBCEBQ0BZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3BBBCEBQ0BZEGST reliable?
The price and inventory of CYT3BBBCEBQ0BZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3BBBCEBQ0BZEGST is usually 5 days.
3.What payment methods are accepted for CYT3BBBCEBQ0BZEGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3BBBCEBQ0BZEGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3BBBCEBQ0BZEGST?
CYT3BBBCEBQ0BZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3BBBCEBQ0BZEGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3BBBCEBQ0BZEGST?
For technical support, including CYT3BBBCEBQ0BZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3BBBCEBQ0BZEGST requirements.
6.How does Aetrix verify that CYT3BBBCEBQ0BZEGST is sourced from the original manufacturer or authorized distributors?
All CYT3BBBCEBQ0BZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3BBBCEBQ0BZEGST meets industry standards.
7.What is the process for return or replacement of CYT3BBBCEBQ0BZEGST?
All CYT3BBBCEBQ0BZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3BBBCEBQ0BZEGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3BBBCEBQ0BZEGST part is unused and in its original packaging.
Return procedure for CYT3BBBCEBQ0BZEGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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