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Infineon Technologies CYT3BBBCEBQ0BZSGS
- Part No.:
- CYT3BBBCEBQ0BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3BBBCEBQ0BZSGS.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 272BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,181
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Product details
Overview
CYT3BBBCEBQ0BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller with dual Arm® Cortex®-M7 CPUs (250 MHz), one Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and hardware security (AES-256, ECC, SHA-512). It targets high-end body-control units requiring ASIL-B functional safety compliance.
For engineers reviewing the CYT3BBBCEBQ0BZSGS datasheet, CYT3BBBCEBQ0BZSGS pinout, CYT3BBBCEBQ0BZSGS application, or CYT3BBBCEBQ0BZSGS equivalent, key selection criteria include dual-core deterministic real-time performance, FOTA-ready dual-bank flash architecture, hardware-accelerated crypto for secure boot, and automotive-grade peripheral integration including 8 CAN FD channels and IEEE-1588 PTP-capable Ethernet.
Technical Context
The device implements a heterogeneous dual-CPU subsystem: two lockstep-capable Cortex®-M7 cores operate at 250 MHz with independent 16-KB I/D caches and TCM, while the Cortex®-M0+ handles peripheral offload and security services. Inter-processor communication is implemented via dedicated hardware mailboxes and shared memory with SMPU enforcement.
Clocking includes IMO/ILO/ECO/WCO sources plus PLL/FLL, enabling precise timing control across power modes. Safety-critical memories employ SECDED ECC, and functional safety is enforced by MPU, PPU, MCWDT, BOD/OVD/LVD, and CSV - all certified for ASIL-B per ISO 26262.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for peripheral/security offload |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA updates |
| SRAM | 768 KB with configurable retention granularity for low-power mode optimization |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; max 8 Mbps data rate |
| Ethernet Interface | 10/100 Mbps MAC supporting MII/RMII PHY; IEEE-1588 PTP and AVB (IEEE-802.1BA) compliant |
| Security Engine | HSM with AES-128/192/256, 3DES, RSA/ECC, SHA-1/2/3, TRNG, GCM, and eSHE for secure boot & authentication |
| ADC | Three 12-bit SAR ADCs (75 total external channels); synchronized sampling for motor-sense applications |
| Power Range | 2.7 V to 5.5 V operation with DeepSleep, Hibernate, and five low-power modes for fine-grained energy control |
Pinout & Package
This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm, 0.8-mm ball pitch), optimized for automotive ECU routing density and thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA, VDDD, VCCD | Analog/Digital/Core Power Supplies | Independent 2.7–5.5 V inputs with dedicated BOD thresholds (2.7 V/3.0 V on VDDD/VDDA; 1.1 V on VCCD) |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator Interface | Supports 1–50 MHz ECO for precision clock generation; used with PLL/FLL for system frequency synthesis |
| ETH_RXD[3:0], ETH_TXD[3:0], ETH_REF_CLK | Ethernet PHY Interface Signals | RMII/MII-compatible pins enabling IEEE-802.3bw-compliant 10/100 Mbps operation with PTP timestamping |
| CANFD_[0–7]_TX / RX | CAN FD Transceiver Interfaces | Eight differential pairs supporting ISO 11898-1:2015; each channel independently configurable for classic CAN or CAN FD |
| JTAG_TCK / TMS / TDI / TDO / nTRST | IEEE-1149.1 Debug Interface | Full boundary-scan and SWD-compatible debug access for development, trace, and production programming |
| GPIO[0–219] | Programmable I/O Banks | 220 pins across GPIO_STD, GPIO_ENH, and HSIO_STD types; supports wakeup, Smart I/O logic, and motor-control PWM_DT |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two Cortex®-M7 cores with cache, TCM, and hardware mailbox enable time-critical task partitioning without OS overhead |
| FOTA-ready flash architecture | Dual-bank flash with RWW allows seamless firmware update during runtime without halting safety-critical functions |
| ASIL-B safety mechanisms | MPU/SMPU/PPU, SECDED ECC on SRAM/flash/TCM, MCWDT, and CSV provide hardware-enforced fault containment per ISO 26262 |
| Hardware crypto acceleration | Dedicated HSM engine performs AES-GCM, ECC signing, SHA-512 hashing, and TRNG generation without CPU intervention |
| Automotive network integration | 8 CAN FD + 11 SCB (I²C/SPI/UART) + 16 LIN + 1 Ethernet MAC enables full-vehicle domain controller consolidation |
| Smart I/O programmability | Five blocks support Boolean logic on up to 36 GPIO_STD pins for sensor preprocessing or fail-safe signal conditioning |
Applications
| Body Control Module (BCM) | Gateway ECU |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and climate actuators in premium vehicles. IC Role / Device Role / Timing Role: Primary application processor managing CAN FD backbone, LIN subnets, and secure OTA updates. Use Value: Dual M7 cores execute real-time body logic while M0+ handles LIN protocol stacks and crypto operations, reducing BOM count and latency. | Use Scenario: Aggregation and routing of messages between powertrain, chassis, infotainment, and ADAS domains. IC Role / Device Role / Timing Role: High-throughput gateway MCU with concurrent CAN FD, Ethernet, and secure firewall processing. Use Value: IEEE-1588 PTP synchronization across domains and hardware-accelerated TLS offload enable deterministic inter-domain communication. |
| Electric Power Steering (EPS) | Advanced Lighting Control |
Use Scenario: Real-time torque assist calculation, motor phase control, and fault monitoring in steer-by-wire systems. IC Role / Device Role / Timing Role: Safety-certified motor controller with synchronized ADC sampling and PWM_DT for gate driver timing. Use Value: Three SAR ADCs sample current/voltage sensors simultaneously; TCPWM blocks generate dead-time-protected PWM with <100 ns jitter. | Use Scenario: Adaptive LED matrix control with dynamic beam shaping, diagnostics, and thermal management. IC Role / Device Role / Timing Role: High-resolution PWM generator and I²S audio interface for RGBW LED drivers and ambient sound feedback. Use Value: 75-channel ADC monitors thermal sensors and photodiodes; I2S interfaces drive digital audio amplifiers for cabin sound alerts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 @ 320 MHz; 4 MB flash; no integrated Ethernet MAC; uses external PHY for 100BASE-T1 | Lacks native Ethernet PTP support; targets CAN/LIN-only gateways and chassis controllers | Select when Ethernet is not required and higher single-core clock speed is prioritized over multi-domain routing capability |
| Renesas RH850/U2A | Tri-core (4x V850E3 + 1x Cortex®-M4); 6 MB flash; 100 Mbps Ethernet with TSN; no CAN FD | Optimized for powertrain with TSN timing; lacks CAN FD but adds time-sensitive networking for ADAS sync | Select for TSN-based ADAS domain controllers where CAN FD is secondary to deterministic Ethernet scheduling |
Compared with S32K344 and RH850/U2A, CYT3BBBCEBQ0BZSGS uniquely combines dual M7 cores, native CAN FD + PTP Ethernet, and ASIL-B-certified HSM in a single die - enabling consolidated body/gateway functionality without external bridge ICs or security co-processors.
Availability
CYT3BBBCEBQ0BZSGS is available at Aetrix Electronics and suitable for body control modules, vehicle gateways, electric power steering systems, and adaptive lighting control requiring stable component supply and long-term automotive lifecycle support.
Supply support for CYT3BBBCEBQ0BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line delivers scalable, ASIL-B-certified microcontrollers for automotive domain controllers - designed specifically to consolidate body, gateway, and chassis functions onto unified, secure, and time-deterministic platforms.
FAQ
What is the maximum CAN FD data rate supported by CYT3BBBCEBQ0BZSGS?
The device supports up to 8 Mbps CAN FD data rate per channel, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification v1.0. Actual achievable rate depends on physical layer topology and transceiver capabilities, and is validated per ISO 16845:2015 conformance testing.
Does CYT3BBBCEBQ0BZSGS include hardware support for IEEE-1588 Precision Time Protocol?
Yes - the integrated Ethernet MAC supports IEEE-1588 PTP timestamping at the MAC layer, enabling sub-microsecond synchronization across vehicle networks. Hardware timestamp registers and event-triggered capture are accessible via dedicated registers in the ETH block.
How many independent ADC modules does CYT3BBBCEBQ0BZSGS integrate, and what is their resolution?
The MCU integrates three independent 12-bit SAR ADC modules (ADC0, ADC1, ADC2) with up to 75 total external input channels. Each supports 1 Msps sampling rate, sequencer-based autonomous scanning, and synchronized start for motor-sense applications.
Is CYT3BBBCEBQ0BZSGS qualified for automotive temperature grade and reliability standards?
Yes - it is qualified per AEC-Q100 Grade 2 (−40 °C to +105 °C) and supports ASIL-B functional safety per ISO 26262, with hardware safety mechanisms including SECDED ECC, MPUs, watchdog timers, and voltage supervision circuits fully documented in the safety manual.
CYT3BBBCEBQ0BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 90x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3BBBCEBQ0BZSGS FAQ
1.How can I place an order for CYT3BBBCEBQ0BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3BBBCEBQ0BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3BBBCEBQ0BZSGS reliable?
The price and inventory of CYT3BBBCEBQ0BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3BBBCEBQ0BZSGS is usually 5 days.
3.What payment methods are accepted for CYT3BBBCEBQ0BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3BBBCEBQ0BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3BBBCEBQ0BZSGS?
CYT3BBBCEBQ0BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3BBBCEBQ0BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3BBBCEBQ0BZSGS?
For technical support, including CYT3BBBCEBQ0BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3BBBCEBQ0BZSGS requirements.
6.How does Aetrix verify that CYT3BBBCEBQ0BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT3BBBCEBQ0BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3BBBCEBQ0BZSGS meets industry standards.
7.What is the process for return or replacement of CYT3BBBCEBQ0BZSGS?
All CYT3BBBCEBQ0BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3BBBCEBQ0BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3BBBCEBQ0BZSGS part is unused and in its original packaging.
Return procedure for CYT3BBBCEBQ0BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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