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Infineon Technologies CYT3BBBCEBQ0BZSGST
- Part No.:
- CYT3BBBCEBQ0BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3BBBCEBQ0BZSGST.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 272BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,225
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Product details
Overview
CYT3BBBCEBQ0BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 CPUs (250 MHz), one Arm® Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and LIN (16 channels). It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography (AES-128/192/256, ECC, SHA-256/512).
For engineers reviewing the CYT3BBBCEBQ0BZSGST datasheet, CYT3BBBCEBQ0BZSGST pinout, CYT3BBBCEBQ0BZSGST application, or CYT3BBBCEBQ0BZSGST equivalent, this page delivers verified technical context, validated package mapping (272-BGA, 0.8-mm pitch), confirmed safety features (SECDED ECC, SMPU, MCWDT), and real-world use cases in automotive domain controllers with FOTA support.
Technical Context
The device implements a heterogeneous dual-core architecture: two lockstep-capable Cortex-M7 cores for primary control and a dedicated Cortex-M0+ core for peripheral management and security offload. Memory subsystem includes RWW flash supporting dual-bank firmware updates and 768 KB SRAM with configurable retention granularity.
Hardware security is enforced via eSHE-compliant HSM, AES/GCM acceleration, TRNG, and SECDED ECC on all safety-critical memories (flash, SRAM, TCM). Functional safety is achieved through MPU, SMPU, PPU, multi-counter watchdog (MCWDT), and ISO 26262 ASIL-B-certified clock/power supervision (CSV, LVD, BOD).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for peripheral/security isolation |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA updates |
| SRAM | 768 KB with selectable retention granularity per memory region for low-power mode optimization |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; max 8 Mbps data rate |
| Ethernet Interface | 10/100 Mbps MAC supporting MII/RMII PHY; IEEE 1588 PTP and AVB (IEEE 802.1BA) compliant |
| ADC System | Three 12-bit SAR ADCs (75 total external channels); synchronized sampling for motor-sense applications |
| Security Engine | HSM with AES-128/192/256, ECC, SHA-256/512, TRNG, and Galois/Counter Mode (GCM) acceleration |
Pinout & Package
This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm, 0.8-mm ball pitch) with thermal pad and standard I/O layout optimized for automotive PCB routing and EMI control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | 1.1-V core analog rail; separate from digital VDDD to reduce noise coupling in ADC/SAR operation |
| VDDD | Digital power supply | 1.1-V digital core rail; regulated internally from 2.7–5.5 V input; supports fine-grained power mode transitions |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–50 MHz crystals for precise clock generation; used with ECO block for system timing stability |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY register configuration and status monitoring |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential pair | High-speed (up to 8 Mbps) CAN FD physical layer interface; requires external transceiver for bus termination |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin debug port supporting full JTAG/SWD functionality including ETM instruction/data trace |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic over-the-air (FOTA) firmware updates without runtime interruption or external memory dependency |
| ASIL-B safety mechanisms | Includes SECDED ECC on all critical memories, SMPU for inter-process memory isolation, and MCWDT with independent clock source |
| Runtime-reconfigurable SCBs | 11 serial communication blocks each configurable as UART/I²C/SPI - reduces peripheral resource contention in mixed-protocol systems |
| Smart I/O logic | Five programmable logic blocks performing Boolean operations on up to 36 GPIO_STD pins - enables hardware-accelerated signal conditioning without CPU load |
| Synchronized ADC sampling | Simultaneous start of conversion across all three SAR ADCs - essential for accurate motor phase current measurement and torque control |
Applications
| Body Control Module (BCM) | Gateway Controller |
|---|---|
Use Scenario: Centralized vehicle body electronics managing lighting, door locks, window lifts, and seat controls. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant BSW and application software with real-time CAN FD/LIN/Ethernet coordination. Use Value: Dual Cortex-M7 cores enable concurrent execution of safety-critical (ASIL-B) and non-safety tasks; 220 GPIOs support direct drive of relays and sensors without external expanders. | Use Scenario: In-vehicle network bridge aggregating CAN FD, LIN, and Ethernet traffic between domain ECUs and central ADAS systems. IC Role / Device Role / Timing Role: High-throughput protocol translator with hardware-accelerated packet filtering, timestamping (IEEE 1588), and secure message routing. Use Value: Integrated Ethernet MAC + 8 CAN FD channels + 16 LIN interfaces eliminate need for discrete bridge ICs; HSM ensures secure OTA update delivery to downstream ECUs. |
| Electric Power Steering (EPS) | Advanced Lighting Control |
Use Scenario: Real-time motor control and fault monitoring in steer-by-wire and column-assist EPS systems. IC Role / Device Role / Timing Role: Safety-certified controller running motor FOC algorithms, sensor fusion (resolver, torque, temperature), and diagnostic monitors. Use Value: Synchronized triple ADC sampling captures simultaneous phase currents; TCPWM blocks generate precise PWM_DT waveforms with <100 ns dead-time control for IGBT/MOSFET gate drivers. | Use Scenario: Adaptive LED headlight control with dynamic beam shaping, matrix dimming, and thermal management. IC Role / Device Role / Timing Role: High-resolution PWM generator and ambient/light-sensor interface with real-time response to camera-based scene analysis. Use Value: 75-channel ADC supports multi-zone ambient light, color, and temperature sensing; Smart I/O blocks implement hardware-level PWM dimming logic independent of CPU scheduling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 @ 320 MHz; 4 MB flash; no integrated Ethernet MAC; uses external PHY for 100BASE-T1 | Targeted at chassis/safety domains with CAN FD + FlexRay; lacks native Ethernet for gateway use | Select when Ethernet is not required and higher single-core performance is prioritized over multi-protocol integration |
| Renesas RH850/U2A | Tri-core (RH850-G3M + dual G3KH); 12 MB flash; supports CAN FD + Ethernet AVB but no HSM or GCM acceleration | Focused on powertrain and braking; limited FOTA capability due to lack of RWW dual-bank flash | Select for legacy RH850 ecosystem migration where ASIL-D readiness and deterministic real-time latency are primary concerns |
Compared with S32K344 and RH850/U2A, CYT3BBBCEBQ0BZSGST uniquely integrates Ethernet MAC, HSM with GCM, and dual-bank RWW flash in a single die-making it optimal for next-gen automotive gateways requiring secure, upgradable, multi-protocol connectivity without external co-processors.
Availability
CYT3BBBCEBQ0BZSGST is available at Aetrix Electronics and suitable for automotive body control modules, gateway controllers, electric power steering systems, and adaptive lighting applications requiring stable component supply, long lifecycle support, and ASIL-B compliance.
Supply support for CYT3BBBCEBQ0BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3BBBCEBQ0BZSGST belongs to the TRAVEO™ T2G family-designed specifically for automotive domain controllers requiring real-time performance, functional safety (ASIL-B), and hardware-enforced security for secure vehicle networking and OTA updates.
FAQ
What is the maximum CAN FD data rate supported by CYT3BBBCEBQ0BZSGST?
CYT3BBBCEBQ0BZSGST supports CAN FD up to 8 Mbps per channel, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification v1.0. This rate is achievable under optimal physical layer conditions (e.g., short stub lengths, matched impedance, compatible transceivers) and is independent of arbitration phase speed.
Does CYT3BBBCEBQ0BZSGST include hardware support for IEEE 1588 Precision Time Protocol?
Yes, the integrated Ethernet MAC supports IEEE 1588-2008 (PTPv2) with hardware timestamping for transmit and receive frames. It provides sub-microsecond synchronization accuracy when paired with a compliant RMII/MII PHY and proper clock configuration using the internal PLL/FLL.
How does the dual-bank flash architecture enable safe firmware updates?
The 4160 KB code-flash is partitioned into two independently erasable banks. During FOTA, new firmware is written to the inactive bank while the system executes from the active bank. Upon successful verification, the boot vector is atomically redirected-ensuring zero-downtime updates and rollback capability if integrity checks fail.
Is external RAM required to use the SDHC interface with eMMC 5.1?
No. The SDHC interface supports eMMC 5.1, SD 6.0, and SDIO 4.10 directly without external RAM. Internal 768 KB SRAM buffers data transfers, and the controller handles command/response sequencing, CRC checking, and high-speed DDR mode (52 MHz) autonomously via DMA.
CYT3BBBCEBQ0BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 90x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3BBBCEBQ0BZSGST FAQ
1.How can I place an order for CYT3BBBCEBQ0BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3BBBCEBQ0BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3BBBCEBQ0BZSGST reliable?
The price and inventory of CYT3BBBCEBQ0BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3BBBCEBQ0BZSGST is usually 5 days.
3.What payment methods are accepted for CYT3BBBCEBQ0BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3BBBCEBQ0BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3BBBCEBQ0BZSGST?
CYT3BBBCEBQ0BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3BBBCEBQ0BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3BBBCEBQ0BZSGST?
For technical support, including CYT3BBBCEBQ0BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3BBBCEBQ0BZSGST requirements.
6.How does Aetrix verify that CYT3BBBCEBQ0BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT3BBBCEBQ0BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3BBBCEBQ0BZSGST meets industry standards.
7.What is the process for return or replacement of CYT3BBBCEBQ0BZSGST?
All CYT3BBBCEBQ0BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3BBBCEBQ0BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3BBBCEBQ0BZSGST part is unused and in its original packaging.
Return procedure for CYT3BBBCEBQ0BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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