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Infineon Technologies CYT3DLABBBQ1AESGS
- Part No.:
- CYT3DLABBBQ1AESGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABBBQ1AESGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:3,155
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Product details
Overview
CYT3DLABBBQ1AESGS from Infineon is an automotive-grade 32-bit TRAVEO™ T2G microcontroller built on Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) dual-core architecture, featuring integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and hardware crypto acceleration (AES-256, SHA-512, ECC, TRNG). It targets instrument clusters and HUD systems requiring real-time rendering, secure boot, and ASIL-B functional safety compliance.
For engineers reviewing the CYT3DLABBBQ1AESGS datasheet, CYT3DLABBBQ1AESGS pinout, CYT3DLABBBQ1AESGS application, or CYT3DLABBBQ1AESGS equivalent, key selection criteria include dual-CPU partitioning for safety-critical peripheral control, on-the-fly display warping for HUD optical correction, FPD-Link video output (1920×720 @ 110 MHz), and RWW flash with dual-bank FOTA support.
Technical Context
The device implements a tightly coupled dual-CPU subsystem: the M7 handles primary application and graphics rendering, while the M0+ manages peripheral offload, security services (eSHE/HSM), and ASIL-B safety monitors (SMPU, PPU, SECDED ECC on SRAM/flash/TCM). Hardware inter-processor communication enables deterministic task handoff without software arbitration.
Graphics processing occurs in dedicated hardware blocks - composition engine, drawing engine, command sequencer - enabling frame-bufferless rendering and direct capture-to-display feed-through with overlay. Video I/O supports parallel RGB (800×600 @ 40 MHz) and single-lane FPD-Link (1920×720 @ 110 MHz), both with real-time warping for HUD projection alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M7 @ 240 MHz + Cortex®-M0+ @ 100 MHz; enables real-time OS partitioning and safety isolation |
| Graphics Memory | 2048 KB VRAM; supports multi-layer composition and on-the-fly rendering without external frame buffers |
| Video Output | Single-lane FPD-Link up to 1920×720 @ 110 MHz; meets HD HUD resolution and timing requirements |
| CAN FD Channels | 4 channels, up to 8 Mbps; satisfies high-bandwidth vehicle network demands per ISO 11898-1:2015 |
| Crypto Engine | AES-128/192/256, SHA-512, ECC, TRNG; enables secure boot, OTA firmware authentication, and HSM compliance |
| Functional Safety | ASIL-B compliant with SMPU, PPU, SECDED ECC, MCWDT, and BOD/OVD/OCD monitoring |
| Flash & RAM | 4160 KB code-flash + 128 KB work-flash (RWW, dual-bank); 384 KB SRAM with retention granularity control |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch. Pinout validated per Infineon CYT3DL package drawing 002-27763 Rev. *K (pages 4, 10–11).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input; supports 12-bit SAR ADC sampling at 1 Msps with internal temperature sensing |
| FPD_TXP/N | FPD-Link differential video output | Drives single-lane FPD-Link interface to HUD display; supports embedded clock and data recovery |
| CANFD0_TX/RX | CAN FD channel 0 transceiver interface | Direct connection to external CAN FD transceiver; enables 8 Mbps data phase with ISO 11898-1 compliance |
| ETH_MII_RXD[3:0] | Ethernet MAC receive data bus | 4-bit MII interface for 10/100 Mbps AVB-compliant audio/video bridging |
| SWDIO/SWCLK | Serial Wire Debug interface | Enables non-intrusive debug, trace, and flash programming via industry-standard tools (IAR, GHS) |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated geometric correction for HUD optical projection alignment without CPU overhead |
| Dual-bank RWW flash | Enables seamless FOTA updates with zero downtime; one bank executes while the other is reprogrammed |
| Hardware crypto accelerator | Offloads AES-256, SHA-512, and ECC operations from CPU; reduces secure boot time by >70% vs. software-only |
| ASIL-B safety mechanisms | Integrated SMPU, PPU, SECDED ECC, and multi-counter watchdog ensure runtime fault detection per ISO 26262 |
| Smart I/O block | Configurable Boolean logic engine for GPIO signal conditioning; eliminates external glue logic in sensor interface designs |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD cluster panel. IC Role / Device Role / Timing Role: Primary application processor (Cortex-M7) with graphics engine driving parallel RGB interface at 800×600 @ 40 MHz. Use Value: Eliminates need for external GPU; reduces BOM cost and latency through integrated VRAM and composition engine. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield using optical combiner. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and overlay blending before FPD-Link output. Use Value: Hardware warping ensures pixel-perfect HUD alignment across temperature and voltage variations without calibration software. |
| Automotive Ethernet Gateway | Secure OTA Update Node |
Use Scenario: Bridging CAN FD networks (powertrain, chassis) with Ethernet AVB backbone for camera/audio streaming. IC Role / Device Role / Timing Role: Ethernet MAC (IEEE-802.3bw) + 4× CAN FD channels + IEEE-1588 PTP timer enable synchronized multi-sensor data transport. Use Value: Single-chip integration reduces gateway latency and eliminates external switch/FPGA; supports AVB traffic shaping. | Use Scenario: Receiving, authenticating, and installing signed firmware updates over cellular or Wi-Fi link. IC Role / Device Role / Timing Role: Crypto engine verifies ECDSA signatures; dual-bank flash enables atomic update with rollback capability. Use Value: Meets UNECE R155/R156 compliance; prevents unauthorized firmware injection via hardware-rooted trust chain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and connectivity MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 core (320 MHz); no integrated graphics engine or VRAM; relies on external GPU or display controller | Suitable for gateway/control ECU but not standalone HUD/instrument cluster display rendering | Select when graphics offload is unnecessary and higher CPU throughput is prioritized over display integration |
| Renesas RH850/U2A | Tri-core (RH850-G3M + 2× RH850-G3KH); no hardware graphics acceleration; limited video I/O (no FPD-Link) | Targeted at powertrain and chassis control; lacks display subsystem and ASIL-B graphics safety certification | Select for ASIL-D motor control applications where display functionality is handled by separate SoC |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLABBBQ1AESGS uniquely integrates certified graphics rendering, FPD-Link output, and HUD-specific warping - eliminating external components required by alternatives for automotive display systems.
Availability
CYT3DLABBBQ1AESGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, Ethernet gateways, and secure OTA update nodes requiring stable component supply and long-term automotive lifecycle support.
Supply support for CYT3DLABBBQ1AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for human-machine interface (HMI) applications demanding integrated graphics, functional safety, and secure connectivity in vehicles.
FAQ
What is the maximum display resolution supported by CYT3DLABBBQ1AESGS via FPD-Link?
The device supports up to 1920×720 resolution at 110 MHz over single-lane FPD-Link, verified in Infineon's TRAVEO™ T2G hardware validation reports. This meets HD HUD requirements and is compatible with standard automotive FPD-Link PHYs such as TI DS90UB953.
Does CYT3DLABBBQ1AESGS support IEEE-1588 Precision Time Protocol for Ethernet synchronization?
Yes - the integrated 10/100 Mbps Ethernet MAC fully complies with IEEE-1588-2008 (PTPv2) and supports hardware timestamping for sub-microsecond synchronization, essential for time-sensitive automotive AVB networks and camera sensor triggering.
How does the dual-core architecture enforce ASIL-B compliance?
The Cortex-M0+ core runs safety monitor firmware that independently validates M7 execution, memory integrity (via SECDED ECC), peripheral access (PPU), and clock/reset behavior. This separation meets ISO 26262 partitioning requirements without requiring external safety controllers.
Is the 2048 KB VRAM accessible by both CPU cores?
No - VRAM is exclusively managed by the graphics subsystem and accessed via DMA from the Cortex-M7. The Cortex-M0+ has no direct VRAM access, preserving memory isolation required for ASIL-B safety partitioning and preventing unintended interference with rendering pipelines.
CYT3DLABBBQ1AESGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABBBQ1AESGS FAQ
1.How can I place an order for CYT3DLABBBQ1AESGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABBBQ1AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABBBQ1AESGS reliable?
The price and inventory of CYT3DLABBBQ1AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABBBQ1AESGS is usually 5 days.
3.What payment methods are accepted for CYT3DLABBBQ1AESGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABBBQ1AESGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABBBQ1AESGS?
CYT3DLABBBQ1AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABBBQ1AESGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABBBQ1AESGS?
For technical support, including CYT3DLABBBQ1AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABBBQ1AESGS requirements.
6.How does Aetrix verify that CYT3DLABBBQ1AESGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLABBBQ1AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABBBQ1AESGS meets industry standards.
7.What is the process for return or replacement of CYT3DLABBBQ1AESGS?
All CYT3DLABBBQ1AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABBBQ1AESGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABBBQ1AESGS part is unused and in its original packaging.
Return procedure for CYT3DLABBBQ1AESGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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