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Infineon Technologies CYT3DLABBBQ1AESGST
- Part No.:
- CYT3DLABBBQ1AESGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABBBQ1AESGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:3,561
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Product details
Overview
CYT3DLABBBQ1AESGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated graphics/sound subsystems. It supports CAN FD (up to 8 Mbps), 10/100 Ethernet MAC, and ASIL-B functional safety for instrument cluster and HUD applications.
For engineers reviewing the CYT3DLABBBQ1AESGST datasheet, CYT3DLABBBQ1AESGST pinout, CYT3DLABBBQ1AESGST application, or CYT3DLABBBQ1AESGST equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping, FPD-Link video output (1920×720 @ 110 MHz), secure boot with eSHE/HSM, and automotive-grade power modes (Hibernate, DeepSleep, Low-power Sleep).
Technical Context
The CYT3DLABBBQ1AESGST implements hardware-isolated processing: the Cortex-M7 handles graphics rendering, audio mixing, and high-speed communication (Ethernet, CAN FD), while the Cortex-M0+ manages peripheral control, security services (secure boot, AES-256, ECC), and ASIL-B safety monitors (SMPU, PPU, SECDED ECC). Its clock system integrates IMO, ECO, PLL, and FLL with dynamic frequency scaling across power modes.
Graphics execution bypasses frame buffers via command sequencer-driven on-the-fly composition, supporting direct capture-to-display feedthrough with overlay. The sound subsystem includes two PCM-PWM interfaces, four TDM ports, and dual PCM mixers-enabling multi-source audio routing without external DSP.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and multimedia tasks |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 384 KB SRAM with retention granularity control |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly warping, and FPD-Link/LVDS output up to 1920×720 @ 110 MHz |
| Video I/O | Two video outputs (Parallel RGB, FPD-Link); one capture engine supporting MIPI CSI-2 (2–4 lanes), ITU-656, or RGB/YUV input |
| Communication | 4× CAN FD (ISO 11898-1:2015), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Ethernet MAC with AVB/PTP support |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, GCM, and secure boot with digital signature verification |
| Safety | ASIL-B compliant: SMPU, PPU, SECDED ECC on flash/SRAM/TCM, MCWDT, LVD/BOD/OVD/OCD, CSV, and hardware error detection |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch - optimized for automotive thermal and mechanical reliability in instrument cluster PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated supply with dedicated BOD threshold (1.1 V) for precision analog acquisition |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; supports low-power active/deepsleep modes |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–40 MHz crystals for precise clock source; used by ECO and WCO for timing-critical peripherals |
| ETH_RXD0–3 / ETH_TXD0–3 | Ethernet PHY data lines | RMII/MII interface pins enabling IEEE-802.3bw 10/100 Mbps operation with AVB/PTP timestamping |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential pair | High-speed (up to 8 Mbps) automotive bus interface compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 |
| FPD_D0–7 / FPD_CLK | FPD-Link video data and clock | Single-channel LVDS-compatible interface driving HUD displays at HD resolution (1920×720 @ 110 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly graphics composition | Eliminates frame buffer memory overhead by composing layers directly to display interface using command sequencer and drawing engine |
| Dual-CPU hardware isolation | M7 handles multimedia and comms; M0+ runs security stack and peripheral firmware-no software arbitration needed |
| FOTA-ready flash architecture | Dual-bank code-flash enables seamless over-the-air updates without runtime interruption or external memory |
| Automotive audio routing | Four TDM + two PCM-PWM interfaces plus dual 5-stream mixers allow concurrent multi-sensor audio ingestion and speaker-level output |
| ASIL-B safety mechanisms | Hardware-enforced memory protection (SMPU/PPU), SECDED ECC on all safety-critical memories, and redundant watchdogs (MCWDT + WDT) |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards. IC Role / Device Role / Timing Role: Primary application processor executing graphics pipeline, CAN FD message parsing, and sensor fusion logic. Use Value: 2048 KB VRAM and on-the-fly warping enable distortion-corrected vector graphics overlays without external GPU or frame buffer DRAM. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with optical distortion compensation. IC Role / Device Role / Timing Role: Graphics engine + FPD-Link transmitter with pixel-accurate timing generation and real-time perspective warping. Use Value: Direct capture-to-display feedthrough with graphics overlay reduces latency to <16 ms-critical for driver response time. |
| Automotive Audio Gateway | Secure Telematics Control Unit |
Use Scenario: Aggregation and routing of microphone arrays, Bluetooth audio, and infotainment streams to amplifier and speaker systems. IC Role / Device Role / Timing Role: Audio subsystem controller managing TDM/PCM-PWM interfaces, mixer scheduling, and DAC output timing. Use Value: Dual PCM mixers with five input streams and hardware-accelerated sample rate conversion eliminate need for external audio DSP. | Use Scenario: Secure OTA update orchestration, cryptographic key management, and cellular modem interfacing in connected vehicles. IC Role / Device Role / Timing Role: Security co-processor running HSM firmware, validating signed firmware images before flash programming. Use Value: eSHE-compliant secure boot with AES-256/GCM and ECC-based attestation meets UNECE R155/R156 compliance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Arm® Cortex®-M7 core (320 MHz), no integrated graphics engine, 8 MB flash, 2 MB SRAM, supports CAN FD/Ethernet but lacks FPD-Link or on-the-fly warping | Targeted at body control and gateway modules-not HUD/instrument cluster graphics rendering | Select when graphics acceleration and display interface integration are unnecessary and higher CPU clock speed is prioritized |
| Renesas RH850/U2A | Tri-core (3× RXv3), 400 MHz, no M0+/M7 split, no embedded VRAM or FPD-Link, supports CAN FD/Ethernet but requires external video encoder | Designed for powertrain and chassis control; lacks multimedia subsystems required for HUD/instrument cluster UI | Select for ASIL-D powertrain applications where deterministic real-time interrupt latency outweighs graphics capability |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLABBBQ1AESGST uniquely integrates HUD-optimized graphics, dual-core security partitioning, and FPD-Link output-making it the only single-chip solution for automotive digital cockpit display subsystems requiring ASIL-B compliance and low-latency rendering.
Availability
CYT3DLABBBQ1AESGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, and telematics control units requiring stable component supply, long lifecycle commitment, and AEC-Q100 Grade 2 qualification.
Supply support for CYT3DLABBBQ1AESGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line targets automotive digital cockpits, integrating graphics, audio, networking, and functional safety into a single scalable MCU platform for instrument clusters and HUDs.
FAQ
What is the maximum display resolution supported by CYT3DLABBBQ1AESGST via FPD-Link?
The device supports up to 1920 × 720 pixels at 110 MHz over its single-channel FPD-Link interface, meeting HD resolution requirements for automotive HUDs. This is confirmed in the graphics subsystem section of the datasheet (Rev. *K, page 2), which specifies "FPD-link single (max display size: 1920 × 720 at 110 MHz)" and notes compatibility with standard LVDS timing protocols.
Does CYT3DLABBBQ1AESGST support secure boot with public-key verification?
Yes-it implements fast secure boot using digital signature verification with asymmetric cryptography (RSA/ECC) via its integrated crypto engine. The datasheet confirms support for "secure boot and authentication using digital signature verification" and lists vector unit acceleration for RSA and ECC operations under the crypto engine features (page 2, footnote [1]).
How many CAN FD channels does CYT3DLABBBQ1AESGST provide, and what is their compliance status?
The part provides up to four CAN FD channels, fully compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0 (non-ISO). The datasheet states "Up to four CAN FD channels" and confirms ISO 16845:2015 conformance testing certification is available-ensuring interoperability with automotive ECUs and test equipment.
Is the 272-BGA package of CYT3DLABBBQ1AESGST RoHS and AEC-Q100 qualified?
Yes-the 272-ball BGA package (16 × 16 × 1.7 mm, 0.8 mm pitch) is AEC-Q100 Grade 2 qualified for automotive use and RoHS-compliant. This is documented in Infineon's official ordering information and package drawings referenced in the datasheet (Rev. *K, page 4), and verified through Infineon's qualified parts list (QPL) database.
CYT3DLABBBQ1AESGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABBBQ1AESGST FAQ
1.How can I place an order for CYT3DLABBBQ1AESGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABBBQ1AESGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABBBQ1AESGST reliable?
The price and inventory of CYT3DLABBBQ1AESGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABBBQ1AESGST is usually 5 days.
3.What payment methods are accepted for CYT3DLABBBQ1AESGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABBBQ1AESGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABBBQ1AESGST?
CYT3DLABBBQ1AESGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABBBQ1AESGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABBBQ1AESGST?
For technical support, including CYT3DLABBBQ1AESGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABBBQ1AESGST requirements.
6.How does Aetrix verify that CYT3DLABBBQ1AESGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLABBBQ1AESGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABBBQ1AESGST meets industry standards.
7.What is the process for return or replacement of CYT3DLABBBQ1AESGST?
All CYT3DLABBBQ1AESGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABBBQ1AESGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABBBQ1AESGST part is unused and in its original packaging.
Return procedure for CYT3DLABBBQ1AESGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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