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Infineon Technologies CYT3DLABCBQ1AESGS
- Part No.:
- CYT3DLABCBQ1AESGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABCBQ1AESGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:3,131
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Product details
Overview
CYT3DLABCBQ1AESGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety compliance. It targets instrument clusters and HUD systems requiring real-time rendering, secure boot, and multi-interface connectivity.
For engineers reviewing the CYT3DLABCBQ1AESGS datasheet, CYT3DLABCBQ1AESGS pinout, CYT3DLABCBQ1AESGS application, or CYT3DLABCBQ1AESGS equivalent, key selection criteria include dual-core deterministic execution, on-the-fly display warping for HUDs, FPD-Link video output (1920×720 @ 110 MHz), embedded VRAM (2048 KB), and hardware crypto acceleration (AES-128/192/256, ECC, SHA-256/512).
Technical Context
The device implements a heterogeneous dual-CPU architecture: the Cortex®-M7 handles primary graphics and application processing with 16 KB I-cache/16 KB D-cache and 64 KB TCM per domain, while the Cortex®-M0+ manages peripheral control, security services, and ASIL-B safety monitoring via dedicated SMPU/PPU protection units.
Its graphics subsystem includes a command sequencer, composition engine, and drawing engine enabling frame-bufferless rendering; video I/O supports MIPI CSI-2 (2-/4-lane, up to 2880×1080 @ 220 MHz) and parallel RGB capture (1600×600 @ 80 MHz), with direct feed-through to dual video outputs (FPD-Link + RGB).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks |
| Graphics Memory | 2048 KB embedded VRAM supporting simultaneous layer composition and on-the-fly warping for HUD projection |
| Video Interface | FPD-Link single-lane output (1920×720 @ 110 MHz) + Parallel RGB output (800×600 @ 40 MHz) |
| Communication | 4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with AVB/PTP |
| Security | HSM with eSHE, AES-128/192/256, ECC/RSA, SHA-256/512, TRNG, SECDED ECC on flash/SRAM/TCM |
| Power Modes | Five low-power states (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V / 3.0 V / 1.1 V) |
| Analog Peripherals | 12-bit SAR ADC (32 logical channels, 1 Msps), six internal analog inputs including bandgap reference and temperature diode |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input; enables precise 12-bit sampling at 1 Msps with internal bandgap reference |
| VRAM_VDD | VRAM power supply | Dedicated 1.1 V rail for 2048 KB embedded video RAM, isolated to prevent noise coupling into graphics pipeline |
| FPD_DATA[7:0] | FPD-Link data bus | 8-bit LVDS-compatible interface driving HD-resolution displays (1920×720) at 110 MHz pixel clock |
| MIPI_CSI2_CLK | MIPI CSI-2 clock input | Differential clock for two-/four-lane camera interface supporting up to 2880×1080 capture at 220 MHz |
| CANFD0_TX | CAN FD channel 0 transmit | High-speed differential driver supporting ISO 11898-1:2015 up to 8 Mbps with built-in bit-rate switching logic |
| ETH_MII_RXD[3:0] | Ethernet MII receive data | 4-bit parallel interface for 10/100 Mbps Ethernet MAC, compliant with IEEE-802.3bw and AVB timing requirements |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated perspective transformation for HUD projection without frame buffer overhead or CPU intervention |
| Direct video feed-through | Zero-latency path from MIPI CSI-2 or RGB capture to FPD-Link/RGB output with optional graphics overlay blending |
| Firmware update Over-The-Air (FOTA) | Support for dual-bank flash (4160 KB code-flash + 128 KB work-flash) with Read-While-Write capability |
| ASIL-B functional safety | Hardware-enforced memory protection (MPU/SMPU/PPU), SECDED ECC on all safety-critical memories, and independent watchdog timers |
| Secure boot with fast authentication | Digital signature verification using hardware crypto engine (RSA/ECC), enabling sub-100 ms verified boot sequence |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD cluster with animated transitions. IC Role / Device Role / Timing Role: Primary application processor with deterministic graphics rendering and CAN FD data ingestion from vehicle network. Use Value: Dual-core isolation ensures safety-critical gauge updates (M0+) remain unaffected by UI animation load (M7), meeting ASIL-B timing deadlines. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with geometric correction for optical distortion. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and layer composition before FPD-Link output. Use Value: On-the-fly warping eliminates need for external GPU or frame buffers, reducing BOM cost and latency below 16 ms. |
| Automotive Ethernet Gateway | Digital Audio Processing Node |
Use Scenario: Bridging CAN FD, LIN, and CXPI vehicle networks to Ethernet backbone for OTA updates and diagnostics. IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-1588 PTP and AVB support synchronizes time-critical messages across domains. Use Value: Hardware timestamping and traffic shaping ensure sub-1 μs jitter for time-sensitive control packets in zonal architectures. | Use Scenario: Multi-channel audio mixing, TDM stream routing, and PCM-PWM conversion for cabin speaker zones and alert tones. IC Role / Device Role / Timing Role: Sound subsystem provides five SG interfaces, two PCM mixers, and one DAC for concurrent audio sources. Use Value: Dedicated audio DMA paths and hardware mixers offload M7 core, enabling <50 μs interrupt latency for emergency tone generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 2× CAN FD, no FPD-Link or MIPI CSI-2 | Targeted at gateway and motor control-not instrument clusters or HUDs requiring on-chip rendering | Select when graphics acceleration and high-resolution video I/O are unnecessary and higher CPU clock speed is prioritized |
| Renesas RH850/U2A | 32-bit RXv3 core (200 MHz), ASIL-D capable, 3× CAN FD, no Ethernet MAC, no VRAM or graphics pipeline | Designed for powertrain and chassis control-lacks video subsystem and audio mixing capabilities | Select for ASIL-D safety-critical control applications where multimedia features are excluded by system architecture |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLABCBQ1AESGS uniquely integrates graphics, audio, and Ethernet in a single ASIL-B-compliant package-enabling consolidation of cluster, HUD, and gateway functions without external co-processors.
Availability
CYT3DLABCBQ1AESGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, Ethernet gateways, and digital audio nodes requiring stable component supply across extended production lifecycles.
Supply support for CYT3DLABCBQ1AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G automotive MCU product line, engineered specifically for human-machine interface (HMI) consolidation in next-generation digital cockpits requiring graphics, audio, networking, and functional safety in one chip.
FAQ
Does CYT3DLABCBQ1AESGS support hardware-accelerated 3D graphics rendering?
No. The device supports 2D and 2.5D graphics only-including perspective warping, layer composition, and vector rendering-but lacks dedicated 3D GPU hardware or OpenGL ES support. Its graphics engine is optimized for HUD projection, instrument cluster UIs, and real-time overlays, not polygon-based 3D scene rendering.
What is the maximum resolution supported for MIPI CSI-2 camera input?
CYT3DLABCBQ1AESGS supports up to 2880×1080 at 220 MHz using four MIPI CSI-2 lanes, or 1920×720 at 110 MHz using two lanes. This is confirmed in the TRAVEO™ T2G datasheet (Rev. *K, page 3) under "Capture engine" specifications and validated against Infineon's official peripheral instance list.
Is the Ethernet MAC interface compatible with IEEE-1588 Precision Time Protocol?
Yes. The 10/100 Mbps Ethernet MAC fully complies with IEEE-1588-2008 (PTP v2), providing hardware timestamping for ingress/egress frames, transparent clock support, and synchronization accuracy within ±50 ns under ideal conditions-critical for time-sensitive automotive networking.
Can CYT3DLABCBQ1AESGS perform secure firmware updates over CAN FD?
Yes. The HSM supports authenticated firmware updates via CAN FD using digital signatures (RSA/ECC) and AES-GCM encryption. The dual-bank flash architecture enables atomic swap during runtime, and the M0+ core handles signature verification independently of the M7 application core-ensuring update integrity without compromising real-time operation.
CYT3DLABCBQ1AESGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABCBQ1AESGS FAQ
1.How can I place an order for CYT3DLABCBQ1AESGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABCBQ1AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABCBQ1AESGS reliable?
The price and inventory of CYT3DLABCBQ1AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABCBQ1AESGS is usually 5 days.
3.What payment methods are accepted for CYT3DLABCBQ1AESGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABCBQ1AESGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABCBQ1AESGS?
CYT3DLABCBQ1AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABCBQ1AESGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABCBQ1AESGS?
For technical support, including CYT3DLABCBQ1AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABCBQ1AESGS requirements.
6.How does Aetrix verify that CYT3DLABCBQ1AESGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLABCBQ1AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABCBQ1AESGS meets industry standards.
7.What is the process for return or replacement of CYT3DLABCBQ1AESGS?
All CYT3DLABCBQ1AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABCBQ1AESGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABCBQ1AESGS part is unused and in its original packaging.
Return procedure for CYT3DLABCBQ1AESGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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