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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

Infineon Technologies CYT3DLABCBQ1AESGST

Name: CYT3DLABCBQ1AESGST
Brand: Infineon Technologies
SKU: CYT3DLABCBQ1AESGST
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYT3DLABCBQ1AESGST

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 216-LQFP Exposed Pad

Datasheet:: CYT3DLABCBQ1AESGST.pdf

Description:: TRAVEO-2 CLUST.2.5DGRAPH

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Product details

Overview

CYT3DLABCBQ1AESGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety for instrument cluster and HUD systems.

For engineers reviewing the CYT3DLABCBQ1AESGST datasheet, CYT3DLABCBQ1AESGST pinout, CYT3DLABCBQ1AESGST application, or CYT3DLABCBQ1AESGST equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping for HUDs, secure boot with eSHE/HSM, FPD-Link video output (1920×720 @ 110 MHz), and hardware-accelerated vector graphics rendering without frame buffers.

Technical Context

The device implements a heterogeneous dual-CPU architecture: the Cortex-M7 handles primary application and graphics processing with 16 KB I/D caches and 64 KB TCM each, while the Cortex-M0+ manages peripheral control, security services, and inter-processor communication via dedicated hardware mailbox. Both cores operate under independent power domains with shared memory protection units (SMPU) and peripheral protection units (PPU).

Graphics subsystem includes a command sequencer, composition engine, drawing engine, and display timing generator - all operating independently of CPU intervention. Video path supports direct capture-to-display feed-through with overlay, ITU-656/RGB/MIPI CSI-2 input (up to 2880×1080 @ 220 MHz on 4-lane MIPI), and parallel RGB/FPD-Link output with on-the-fly perspective warping optimized for head-up display projection geometry.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Arm® Cortex®-M0+, enabling real-time separation of safety-critical and UI tasks
Memory	4160 KB code-flash (RWW, dual-bank FOTA), 384 KB SRAM (retention granularity selectable), 2048 KB VRAM for graphics layer buffering
Graphics Engine	Hardware-accelerated 2D/2.5D rendering with on-the-fly warping, no frame buffer required, supporting HUD optical distortion correction
Video I/O	FPD-Link single-lane output (1920×720 @ 110 MHz); MIPI CSI-2 4-lane input (2880×1080 @ 220 MHz); ITU-656/RGB capture up to 800×480
Networking	4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 10/100 Mbps Ethernet MAC with IEEE-1588 PTP and AVB support
Security	eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, SECDED ECC on flash/SRAM/TCM, ASIL-B certified
Power Modes	Five low-power states (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V / 3.0 V / 1.1 V)

Pinout & Package

Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max height, 0.8 mm ball pitch.

Pin/Terminal	Circuit Role	Design Meaning
VDDA_ADC	Analog supply for ADC	1.1 V regulated supply with dedicated brown-out detection at 1.1 V threshold
VDDD	Digital core supply	1.1 V nominal core voltage generated internally from 2.7–5.5 V input; monitored by BOD at 2.7 V/3.0 V
VDDIO	I/O supply domain	Configurable 1.8 V / 2.5 V / 3.3 V / 5.0 V operation per port group; supports mixed-voltage interfaces
XTAL_IN / XTAL_OUT	External crystal oscillator interface	Supports 1–40 MHz crystals for ECO; enables precise clock source for CAN FD timing and Ethernet PTP synchronization
ETH_RXD[3:0] / ETH_TXD[3:0]	Ethernet PHY data lanes	RMII/MII interface pins; enable IEEE-802.3bw 10/100 Mbps operation with AVB/PTP timestamping capability
FPD_D[7:0] / FPD_CLK	FPD-Link video data and clock	Single-lane FPD-Link output supporting HD resolution (1920×720) at 110 MHz for HUD panel driving
CANFD0_TX / CANFD0_RX	CAN FD channel 0 differential pair	High-speed physical layer interface compliant with ISO 11898-1:2015; supports bit rates up to 8 Mbps

Key Features

Feature	Design Value
On-the-fly HUD warping	Hardware-accelerated perspective transformation applied during video output generation, eliminating CPU load and latency in head-up display systems
Dual-core inter-processor communication	Dedicated hardware mailbox with interrupt signaling and memory coherency management between M7 and M0+ cores
FOTA-ready flash architecture	Dual-bank code-flash with Read-While-Write capability enables seamless over-the-air firmware updates without system interruption
Secure boot with eSHE	Hardware-enforced digital signature verification using ECDSA keys stored in OTP eFuse; fast boot time < 100 ms
Smart I/O Boolean logic	Programmable combinational logic block supporting up to eight GPIO_STD pins for autonomous signal conditioning without CPU involvement

Applications

Instrument Cluster Display

Head-Up Display (HUD)

Use Scenario: Real-time rendering of speed, RPM, navigation arrows, and ADAS alerts on TFT-LCD dashboards with animated transitions.

IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant GUI stack while managing CAN FD bus traffic and sensor fusion inputs.

Use Value: Dual-core isolation ensures deterministic response to safety-critical warnings (e.g., collision alerts) without GUI stutter, leveraging 240 MHz M7 performance and 64 KB TCM.

Use Scenario: Projection of vehicle speed, lane departure, and navigation cues onto windshield with optical distortion correction.

IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and overlay composition directly in video pipeline, synchronized to projection timing.

Use Value: Eliminates need for external FPGA or GPU; reduces BOM cost and latency by >15 ms versus CPU-based warping solutions.

Automotive Audio Gateway

Central Domain Controller

Use Scenario: Aggregation and routing of audio streams from multiple microphones and speakers across CAN FD, LIN, and TDM interfaces.

IC Role / Device Role / Timing Role: Sound subsystem mixes five PCM streams, applies echo cancellation via dedicated SG interfaces, and outputs analog audio via integrated DAC.

Use Value: Reduces external codec count by integrating four TDM, two PCM-PWM, and one DAC - lowering PCB area and power consumption by ~30%.

Use Scenario: Coordinating ADAS, infotainment, and body control functions in zonal architecture with centralized compute and distributed I/O.

IC Role / Device Role / Timing Role: Cortex-M0+ handles secure boot, cryptographic operations, and peripheral arbitration; Cortex-M7 runs Linux-based middleware and virtualization hypervisor.

Use Value: Hardware-enforced memory protection (MPU/SMPU/PPU) and SECDED ECC ensure ASIL-B compliance for safety partitions while enabling rich OS environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive MCU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP S32K344	Single Arm® Cortex®-R52 core (up to 320 MHz), no integrated graphics engine, 8 MB flash, supports ASIL-D	Targeted at safety-critical powertrain and chassis control; lacks HUD-specific warping and VRAM	Select when highest functional safety level (ASIL-D) is mandatory and graphics processing is offloaded externally
Renesas RH850/U2A	Tri-core lockstep (3× Cortex-R7), 16 MB flash, no 2D graphics accelerator, supports ASIL-D but no built-in VRAM or FPD-Link	Optimized for motor control and brake-by-wire; requires external video processor for HUD/instrument cluster	Choose for high-integrity real-time control where deterministic latency outweighs UI rendering capability

Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLABCBQ1AESGST uniquely integrates HUD-optimized graphics acceleration, on-chip VRAM, and FPD-Link output - reducing system latency and component count in digital cockpit applications requiring embedded display processing.

Availability

CYT3DLABCBQ1AESGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, central domain controllers, and audio gateways requiring stable component supply, long lifecycle support, and ASIL-B compliance.

Supply support for CYT3DLABCBQ1AESGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT3DL belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for digital cockpit systems requiring integrated graphics, multi-protocol connectivity (CAN FD/Ethernet/CXPI), and hardware-enforced security for ASIL-B compliance.

FAQ

Does CYT3DLABCBQ1AESGST support CAN FD with ISO 11898-1:2015 compliance?

Yes. The device integrates four fully compliant CAN FD controllers meeting ISO 11898-1:2015 requirements, supporting data rates up to 8 Mbps and non-ISO Bosch CAN FD V1.0 features. It also holds ISO 16845:2015 conformance certification for physical layer testing.

What is the maximum resolution supported by the FPD-Link interface?

The FPD-Link single-lane interface supports up to 1920×720 resolution at 110 MHz pixel clock, sufficient for wide-aspect HD HUD panels. This is implemented in hardware without CPU intervention and includes built-in deskew and alignment compensation.

Is the crypto engine available on all CYT3DL variants?

No. The full crypto engine-including AES, SHA, RSA/ECC, TRNG, and GCM-is only enabled on select MPNs marked with "AES" or "HSM" suffixes in the part number. CYT3DLABCBQ1AESGST includes this feature set as confirmed by its "AES" designation and datasheet footnote [1].

How does the dual-core architecture handle inter-processor communication?

It uses a hardware mailbox with 16-word FIFO, interrupt signaling, and ownership flags. Memory coherency is maintained via shared SMPU regions and cache maintenance instructions. No software polling is required - events trigger direct ISR execution on the target core.

CYT3DLABCBQ1AESGST Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 216-LQFP Exposed Pad

Series:: Traveo™ T2G

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Core Processor:: ARM® Cortex®-M0+, ARM® Cortex®-M7F

Core Size:: 32-Bit Dual-Core

Speed:: 100MHz, 240MHz

Connectivity:: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART

Peripherals:: DMA, I2S, LVD, Temp Sensor, WDT

Number of I/O:: 108

Program Memory Size:: 4.06MB (4.06M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 128K x 8

RAM Size:: 384K x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 5.5V

Data Converters:: A/D 48x12b SAR

Oscillator Type:: External, Internal

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

CYT3DLABCBQ1AESGST FAQ

1.How can I place an order for CYT3DLABCBQ1AESGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT3DLABCBQ1AESGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT3DLABCBQ1AESGST reliable?

The price and inventory of CYT3DLABCBQ1AESGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABCBQ1AESGST is usually 5 days.

3.What payment methods are accepted for CYT3DLABCBQ1AESGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABCBQ1AESGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT3DLABCBQ1AESGST?

CYT3DLABCBQ1AESGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT3DLABCBQ1AESGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT3DLABCBQ1AESGST?

For technical support, including CYT3DLABCBQ1AESGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABCBQ1AESGST requirements.

6.How does Aetrix verify that CYT3DLABCBQ1AESGST is sourced from the original manufacturer or authorized distributors?

All CYT3DLABCBQ1AESGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABCBQ1AESGST meets industry standards.

7.What is the process for return or replacement of CYT3DLABCBQ1AESGST?

All CYT3DLABCBQ1AESGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABCBQ1AESGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT3DLABCBQ1AESGST part is unused and in its original packaging.

Return procedure for CYT3DLABCBQ1AESGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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