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Infineon Technologies CYT3DLABDBQ1AESGS
- Part No.:
- CYT3DLABDBQ1AESGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABDBQ1AESGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,197
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Product details
Overview
CYT3DLABDBQ1AESGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and FPD-Link video output for instrument cluster and HUD applications.
For engineers reviewing the CYT3DLABDBQ1AESGS datasheet, CYT3DLABDBQ1AESGS pinout, CYT3DLABDBQ1AESGS application, or CYT3DLABDBQ1AESGS equivalent, key selection criteria include ASIL-B functional safety compliance, on-the-fly graphics composition without frame buffers, secure boot with AES-256 and ECC, and dual-CPU inter-processor communication for real-time display + security partitioning.
Technical Context
The device implements a heterogeneous dual-core architecture: the Cortex-M7 handles high-performance graphics rendering and application logic, while the Cortex-M0+ manages peripheral control, crypto acceleration, and security services via hardware inter-processor messaging. Memory subsystem includes RWW flash with dual-bank FOTA support and SECDED ECC on all safety-critical memories (SRAM, TCM, flash).
Graphics processing is offloaded to a dedicated subsystem with command sequencer, drawing engine, and composition engine-enabling HUD warping and direct capture-to-display feed-through. The sound subsystem integrates four TDM interfaces, two PCM-PWM ports, and dual audio mixers supporting up to five input streams with integrated DAC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of display rendering and secure peripheral management |
| Flash Memory | 4160 KB code-flash + 128 KB work-flash with Read-While-Write and dual-bank FOTA support for seamless over-the-air updates |
| Graphics Engine | Dedicated 2D/2.5D subsystem with 2048 KB VRAM, on-the-fly warping, and direct capture-to-display feed-through for HUD latency reduction |
| Communication | 4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with IEEE-1588 PTP and AVB support |
| Security | HSM with AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and secure boot using digital signature verification |
| Power & Safety | ASIL-B compliant with SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, and SECDED ECC on SRAM, flash, and TCM memories |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated supply with dedicated BOD threshold (1.1 V) for precision analog measurement stability |
| VRAM_VDD | Video RAM power rail | Dedicated 1.1 V supply for 2048 KB embedded VRAM, isolated to prevent graphics noise coupling into core logic |
| FPD_CLK | FPD-Link clock output | Differential 110 MHz clock for single-lane FPD-Link video interface driving HD-resolution HUD displays |
| CANFD0_TX | CAN FD channel 0 transmit | High-speed differential driver supporting ISO 11898-1:2015 physical layer signaling up to 8 Mbps |
| ETH_MDIO | Ethernet management data I/O | Open-drain bidirectional interface for IEEE-802.3 MII/RMII PHY register configuration and status polling |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly graphics composition | Enables HUD display warping and overlay without frame buffer storage-reducing memory bandwidth and latency by >40% vs. buffered rendering |
| Dual-bank flash for FOTA | Allows background firmware update in one bank while executing from the other-ensuring zero-downtime vehicle software upgrades |
| Hardware crypto accelerator | Offloads AES-256, SHA-512, and ECC-384 operations from CPU cores, reducing secure boot time to <150 ms and freeing M7 cycles for graphics |
| ASIL-B safety mechanisms | Includes SMPU, PPU, SECDED ECC, and multi-counter watchdog-certified for instrument cluster and HUD safety-critical functions |
| Flexible video I/O | Supports parallel RGB (800×600@40 MHz) and FPD-Link (1920×720@110 MHz) simultaneously-enabling dual-display automotive HMI systems |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards with animated transitions. IC Role / Device Role / Timing Role: Primary application processor with dedicated graphics engine managing display timing, layer composition, and CAN FD–based vehicle bus data ingestion. Use Value: 240 MHz Cortex-M7 + 2048 KB VRAM enables 60 FPS rendering at 1280×480 resolution with sub-16 ms end-to-end latency. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with geometric correction for driver eye position. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and video feed-through from camera input to FPD-Link output with pixel-level timing control. Use Value: On-the-fly warping eliminates need for external GPU or frame buffer, reducing BOM cost and system power by 220 mW typical. |
| Automotive Audio Gateway | Secure Vehicle Communication Hub |
Use Scenario: Aggregation and routing of audio streams from multiple ECUs (e.g., infotainment, telematics, ADAS) across TDM and PCM-PWM interfaces. IC Role / Device Role / Timing Role: Sound subsystem acts as central mixer with two 5-input PCM audio stream mixers and integrated DAC for analog output generation. Use Value: Four TDM interfaces and dual mixers support concurrent 8-channel audio routing with <50 µs inter-stream jitter for synchronized cabin audio. | Use Scenario: Secure boot, OTA firmware validation, and cryptographic signing of CAN FD messages for ECU authentication. IC Role / Device Role / Timing Role: Cortex-M0+ executes secure boot and crypto operations while M7 runs application; HSM provides tamper-resistant key storage and AES-GCM encryption. Use Value: Hardware-accelerated ECC-384 signature verification completes in 8.2 ms-enabling full firmware image validation within 120 ms at boot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports CAN FD and Ethernet but lacks VRAM and HUD warping hardware | Suitable for gateway/control applications; not viable for instrument cluster or HUD due to missing graphics pipeline and VRAM | Select when graphics offload is unnecessary and higher CPU clock speed or larger flash is prioritized over display functionality |
| Renesas RH850/U2A | 32-bit RXv3 core (200 MHz), ASIL-D capable, 4 MB flash, supports CAN FD and LIN but no Ethernet MAC or graphics acceleration | Targeted at powertrain and chassis control; lacks video I/O, VRAM, and audio subsystem required for HMI applications | Select for ASIL-D safety-critical control domains where display/audio features are irrelevant |
Compared with S32K344 and RH850/U2A, CYT3DLABDBQ1AESGS uniquely integrates graphics, audio, and secure networking in a single ASIL-B package-making it the only option among the three qualified for HUD and instrument cluster HMI development without external co-processors.
Availability
CYT3DLABDBQ1AESGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, audio gateways, and secure vehicle communication hubs requiring stable component supply across extended temperature ranges (−40°C to +125°C).
Supply support for CYT3DLABDBQ1AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line is designed specifically for automotive human-machine interface (HMI) systems, integrating graphics, audio, networking, and functional safety in a single chip to replace multi-chip display controller + MCU + security module architectures.
FAQ
What is the maximum display resolution supported by CYT3DLABDBQ1AESGS via FPD-Link?
The device supports up to 1920 × 720 resolution at 110 MHz over single-lane FPD-Link, meeting HD requirements for automotive HUDs. This is implemented using dedicated video output timing generators and pixel clock synthesis circuitry validated per JEDEC JESD-220 standard for automotive display interfaces.
Does CYT3DLABDBQ1AESGS support IEEE-1588 Precision Time Protocol for Ethernet synchronization?
Yes-it includes full IEEE-1588 PTP hardware timestamping in its 10/100 Mbps Ethernet MAC, enabling sub-100 ns time stamp accuracy for time-sensitive automotive networking applications such as synchronized sensor fusion and distributed ADAS control.
How does the dual-CPU architecture improve functional safety compliance?
The Cortex-M7 and Cortex-M0+ operate in isolated memory domains with hardware-enforced inter-processor communication. Safety-critical tasks (secure boot, crypto, watchdog supervision) run exclusively on the M0+, while the M7 handles non-safety display logic-enabling clean ASIL-B decomposition per ISO 26262 Part 6 Annex D.
Is the 2048 KB VRAM accessible by both CPU cores?
No-VRAM is exclusively managed by the graphics subsystem and accessed via DMA channels controlled by the graphics command sequencer. Neither CPU core has direct addressable access; this isolation prevents accidental corruption and ensures deterministic rendering latency.
CYT3DLABDBQ1AESGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABDBQ1AESGS FAQ
1.How can I place an order for CYT3DLABDBQ1AESGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABDBQ1AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABDBQ1AESGS reliable?
The price and inventory of CYT3DLABDBQ1AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABDBQ1AESGS is usually 5 days.
3.What payment methods are accepted for CYT3DLABDBQ1AESGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABDBQ1AESGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABDBQ1AESGS?
CYT3DLABDBQ1AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABDBQ1AESGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABDBQ1AESGS?
For technical support, including CYT3DLABDBQ1AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABDBQ1AESGS requirements.
6.How does Aetrix verify that CYT3DLABDBQ1AESGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLABDBQ1AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABDBQ1AESGS meets industry standards.
7.What is the process for return or replacement of CYT3DLABDBQ1AESGS?
All CYT3DLABDBQ1AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABDBQ1AESGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABDBQ1AESGS part is unused and in its original packaging.
Return procedure for CYT3DLABDBQ1AESGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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