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Infineon Technologies CYT3DLABDBQ1AESGST
- Part No.:
- CYT3DLABDBQ1AESGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABDBQ1AESGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:1,791
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Product details
Overview
CYT3DLABDBQ1AESGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and hardware security (AES-256, SHA-512, ECC, TRNG) for instrument cluster and HUD applications.
For engineers reviewing the CYT3DLABDBQ1AESGST datasheet, CYT3DLABDBQ1AESGST pinout, CYT3DLABDBQ1AESGST application, or CYT3DLABDBQ1AESGST equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping, FPD-Link video output (1920×720 @ 110 MHz), secure boot with eSHE/HSM, and ASIL-B functional safety compliance.
Technical Context
The device implements hardware-isolated processing: the Cortex-M7 handles graphics rendering, audio mixing, and high-speed communication (Ethernet, CAN FD), while the Cortex-M0+ manages peripheral control, security services, and low-power state coordination. Inter-processor communication uses dedicated hardware mailboxes and shared memory with SMPU protection.
Its graphics subsystem includes a command sequencer, composition engine, and drawing engine enabling frame-bufferless rendering; the sound subsystem integrates four TDM, two PCM-PWM, five SG interfaces, and dual PCM mixers - all synchronized via hardware-triggered DMA channels tied to TCPWM and RTC events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and multimedia tasks |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly display warping, and direct capture-to-display feed for HUDs |
| Video I/O | FPD-Link single-lane output (1920×720 @ 110 MHz); MIPI CSI-2 2-/4-lane input (2880×1080 @ 220 MHz) |
| Security | HSM-compliant crypto engine: AES-128/192/256, SHA-512/256/160, ECC/RSA, TRNG, SECDED ECC on flash/SRAM/TCM |
| Functional Safety | ASIL-B compliant: MPU, SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, and hardware error correction on safety-critical memories |
| Communication | 4× CAN FD (8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC (MII/RMII, AVB/PTP) |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch. RoHS-compliant, automotive-grade (AEC-Q100 Grade 2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 1.8–5.5 V I/O banks supporting mixed-voltage operation and level-shifting |
| VDDD / VCCD | Digital Core Supply | 1.1 V nominal core rail generated internally; VCCD monitors 1.1 V domain for brown-out detection at 1.1 V threshold |
| VDDA_ADC | Analog ADC Supply | Separate 2.7–5.5 V analog rail with dual BOD thresholds (2.7 V / 3.0 V) for precision SAR ADC operation |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator | Supports 1–40 MHz crystals for ECO; enables precise clock sourcing for CAN FD timing and Ethernet PTP synchronization |
| ETH_RXD0–ETH_TXD3 | Ethernet PHY Interface | MII/RMII pins for 10/100 Mbps Ethernet MAC; RMII mode reduces pin count to 9 signals while maintaining full bandwidth |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 | Differential transceiver interface compliant with ISO 11898-1:2015; supports non-ISO CAN FD v1.0 and ISO 16845 conformance testing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Architecture | Hardware-isolated Cortex-M7 (graphics/audio/comms) and Cortex-M0+ (security/peripherals) with mailbox-based IPC and shared memory protection |
| Graphics Rendering | On-the-fly composition without frame buffers; supports perspective warping and HUD-specific display distortion correction in real time |
| FOTA Support | Dual-bank flash with Read-While-Write enables seamless over-the-air firmware updates without system interruption or external memory |
| Audio Subsystem | Four TDM + two PCM-PWM interfaces plus dual 5-input PCM mixers enable multi-source audio routing and real-time mixing for cockpit audio systems |
| Functional Safety | ASIL-B certified peripherals including SMPU, PPU, MCWDT, and SECDED ECC on all safety-critical memories (flash, SRAM, TCM) |
Applications
| Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, ADAS alerts, and navigation overlays on TFT-LCD or OLED dash displays. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant graphics stack and CAN FD data aggregation from ECUs. Use Value: Dual-core partitioning ensures deterministic response to warning indicators while concurrently running animated UI elements at 60 fps. | Use Scenario: Projection of speed, navigation, and driver assistance data onto windshield via optical combiner with geometric correction. IC Role / Device Role / Timing Role: Graphics engine performs real-time perspective warping and overlay composition; Ethernet synchronizes with ADAS camera feeds. Use Value: On-the-fly warping eliminates need for external FPGA or GPU, reducing BOM cost and latency below 16 ms end-to-end. |
| Central Gateway Module | ADAS Domain Controller Companion |
Use Scenario: Aggregation and protocol translation between CAN FD, LIN, CXPI, and Ethernet domains in zonal architecture gateways. IC Role / Device Role / Timing Role: Cortex-M7 handles high-bandwidth Ethernet routing and CAN FD bridging; Cortex-M0+ enforces firewall rules and secure boot verification. Use Value: Integrated 4× CAN FD + 10/100 Ethernet MAC enables single-chip gateway implementation without external switch or transceivers. | Use Scenario: Pre-processing of camera and radar sensor data before forwarding to high-performance AI accelerator (e.g., NPU) in ADAS domain controller. IC Role / Device Role / Timing Role: SAR ADC and TCPWM blocks condition analog sensor inputs; SMIF with XIP and on-the-fly encryption secures firmware loading. Use Value: Hardware-accelerated CRC, SHA, and AES offload cryptographic operations from main CPU, preserving M7 cycles for sensor fusion algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports CAN FD + Ethernet but lacks FPD-Link/MIPI CSI-2 video I/O | Targeted at body control and gateway functions; not suitable for HUD/instrument cluster graphics rendering | Select when prioritizing higher CPU frequency and larger flash over embedded graphics/video I/O capability |
| Renesas RH850/U2A | Tri-core (3× RXv3), 480 MHz, no Arm architecture, no hardware graphics engine, supports CAN FD + Ethernet but no MIPI/FPD-Link interfaces | Designed for powertrain and chassis control; lacks multimedia acceleration and display subsystem required for digital cockpit | Select for legacy AUTOSAR toolchain compatibility and high-reliability motor control, not for graphics-intensive cockpit applications |
Compared with S32K344 and RH850/U2A, CYT3DLABDBQ1AESGST uniquely integrates dual Arm cores, on-the-fly graphics warping, FPD-Link/MIPI video I/O, and HSM-grade security - making it purpose-built for ASIL-B digital cockpit systems requiring concurrent safety, performance, and visual fidelity.
Availability
CYT3DLABDBQ1AESGST is available at Aetrix Electronics and suitable for instrument clusters, head-up displays, central gateways, and ADAS companion modules requiring stable component supply across automotive production lifecycles.
Supply support for CYT3DLABDBQ1AESGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G product line, engineered specifically for automotive digital cockpit applications demanding integrated graphics, multi-protocol connectivity, functional safety, and hardware-enforced security.
FAQ
What is the maximum display resolution supported by CYT3DLABDBQ1AESGST via FPD-Link?
The device supports single-lane FPD-Link output up to 1920×720 pixels at 110 MHz pixel clock, sufficient for HD-wide automotive displays. This interface is optimized for low EMI and long cable runs typical in instrument cluster and HUD implementations, and does not require external serializer/deserializer chips.
Does CYT3DLABDBQ1AESGST support secure boot with public-key verification?
Yes - it implements fast secure boot using digital signature verification with asymmetric cryptography (RSA/ECC) accelerated by its vector unit. Boot images are authenticated against keys stored in eFuse or protected flash, and execution only proceeds if signatures match pre-provisioned certificates.
How many CAN FD channels are implemented, and what is their data rate capability?
CYT3DLABDBQ1AESGST integrates four independent CAN FD controllers, each supporting data rates up to 8 Mbps in the FD phase. All channels comply with ISO 11898-1:2015 and Bosch CAN FD v1.0 specifications, and have passed ISO 16845 conformance testing for interoperability.
Is the 2D graphics engine capable of rendering without external frame buffer memory?
Yes - the graphics subsystem supports true on-the-fly rendering without frame buffers, using command sequencing and composition engines to generate display output directly from VRAM-resident assets. This reduces latency and external memory bandwidth requirements, critical for HUD real-time warping and overlay insertion.
CYT3DLABDBQ1AESGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABDBQ1AESGST FAQ
1.How can I place an order for CYT3DLABDBQ1AESGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABDBQ1AESGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABDBQ1AESGST reliable?
The price and inventory of CYT3DLABDBQ1AESGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABDBQ1AESGST is usually 5 days.
3.What payment methods are accepted for CYT3DLABDBQ1AESGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABDBQ1AESGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABDBQ1AESGST?
CYT3DLABDBQ1AESGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABDBQ1AESGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABDBQ1AESGST?
For technical support, including CYT3DLABDBQ1AESGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABDBQ1AESGST requirements.
6.How does Aetrix verify that CYT3DLABDBQ1AESGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLABDBQ1AESGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABDBQ1AESGST meets industry standards.
7.What is the process for return or replacement of CYT3DLABDBQ1AESGST?
All CYT3DLABDBQ1AESGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABDBQ1AESGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABDBQ1AESGST part is unused and in its original packaging.
Return procedure for CYT3DLABDBQ1AESGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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