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Infineon Technologies CYT3DLABEBQ1AESGS
- Part No.:
- CYT3DLABEBQ1AESGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABEBQ1AESGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:1,225
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Product details
Overview
CYT3DLABEBQ1AESGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), 4160 KB code-flash, 384 KB SRAM, and integrated graphics subsystem supporting FPD-Link output up to 1920×720 at 110 MHz. It targets instrument clusters and head-up displays with CAN FD, Ethernet MAC (10/100 Mbps), and hardware-accelerated 2D/2.5D rendering.
For engineers reviewing the CYT3DLABEBQ1AESGS datasheet, CYT3DLABEBQ1AESGS pinout, CYT3DLABEBQ1AESGS application, or CYT3DLABEBQ1AESGS equivalent, this device delivers deterministic real-time control, secure boot with eSHE/HSM, ASIL-B functional safety, and low-power DeepSleep wake-up via up to 61 GPIOs - critical for automotive display and domain controller designs.
Technical Context
The CYT3DLABEBQ1AESGS implements a heterogeneous dual-core architecture: the Cortex-M7 handles primary graphics, audio, and application processing with 16 KB I/D cache and TCM, while the Cortex-M0+ manages peripheral orchestration, security services, and ASIL-B safety monitoring. Inter-processor communication is hardware-accelerated via dedicated mailbox and shared memory interfaces.
Its graphics subsystem includes a command sequencer, drawing engine, composition engine, and display warping logic - enabling HUD-specific on-the-fly perspective correction without frame buffers. The sound subsystem integrates four TDM, two PCM-PWM, five SG, and dual PCM mixers with one DAC, supporting multi-channel audio routing and synthesis in automotive cockpit systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks. |
| Memory | 4160 KB code-flash (RWW, dual-bank for FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention granularity. |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly display warping, and FPD-Link/LVDS output up to HD resolution (1920×720 @ 110 MHz). |
| Communication | 4× CAN FD (up to 8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with AVB/PTP support. |
| Security & Safety | eSHE/HSM crypto engine (AES-128/192/256, ECC/RSA, SHA-256/512, TRNG), SECDED ECC on flash/SRAM/TCM, ASIL-B certified peripherals. |
| Power Management | 2.7–5.5 V operation; DeepSleep/ Hibernate modes with 61-GPIO wakeup; dual-regulator system (Core + DeepSleep) for fine-grained power control. |
| Analog | 12-bit SAR ADC (1 Msps, 48 external channels), internal temp sensor, bandgap reference, and AMUXBUS support for sensor multiplexing. |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input; supports dual BOD thresholds (2.7 V / 3.0 V) for robust analog sensing in noisy automotive environments. |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; monitored by BOD and OVD for fault detection. |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin debug port compliant with Arm® SWD; enables non-intrusive firmware update, trace, and secure authentication during development and field service. |
| ETH_RXD0–3 / ETH_TXD0–3 | Ethernet physical layer interface | Supports MII/RMII PHY connection; enables time-synchronized AVB streaming and IEEE-1588 PTP for synchronized multi-display or ADAS gateway applications. |
| FPD_LINK_DATA[0:7] | FPD-Link video data bus | 8-bit parallel LVDS-compatible interface driving HUD or cluster displays up to 1920×720 @ 110 MHz; supports direct feed-through from MIPI CSI-2 capture. |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated perspective correction for curved or angled HUD optics - eliminates software rendering latency and frame buffer memory overhead. |
| Dual-CPU inter-processor communication | Dedicated hardware mailbox and shared memory protection unit (SMPU) enable deterministic, lock-free messaging between M7 and M0+ for safety partitioning. |
| Firmware update Over-The-Air (FOTA) | Dual-bank flash architecture with RWW capability allows seamless background firmware update without interrupting real-time graphics or CAN FD communication. |
| Audio/video synchronization | Ethernet MAC with IEEE-1588 PTP and AVB support enables sub-microsecond timing alignment across distributed audio sources and display outputs in cockpit domains. |
| Secure boot with fast authentication | HSM-enforced digital signature verification using ECC keys; boot time < 100 ms with hardware-accelerated SHA-256 and AES-GCM decryption. |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Digital gauge rendering with animated speedometers, warning indicators, and navigation overlays on TFT-LCD panels. IC Role / Device Role / Timing Role: Primary graphics processor and CAN FD gateway managing vehicle speed, RPM, and ADAS alerts in real time. Use Value: 2048 KB VRAM and on-the-fly composition engine eliminate external frame buffer, reducing BOM cost and board area. |
Use Scenario: Projection of speed, navigation, and ADAS symbols onto windshield with optical distortion correction. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping; M0+ handles secure CAN FD diagnostics and thermal monitoring. Use Value: Hardware warping logic achieves <1 ms latency per frame - essential for driver safety and motion sickness mitigation. |
| Central Domain Controller | Automotive Audio Gateway |
Use Scenario: Integration point for CAN FD, LIN, CXPI, and Ethernet networks in zonal architectures with centralized compute. IC Role / Device Role / Timing Role: Network bridge and safety monitor; M7 runs AUTOSAR Adaptive, M0+ enforces ASIL-B watchdog supervision and crypto offload. Use Value: Four CAN FD channels and IEEE-1588 PTP enable deterministic inter-domain message scheduling and time-triggered communication. |
Use Scenario: Multi-source audio mixing (infotainment, voice assistant, ADAS alerts) with low-latency DAC output to amplifier. IC Role / Device Role / Timing Role: Sound subsystem routes four TDM streams, mixes five PCM inputs, and drives DAC with jitter-free timing via dedicated clock domain. Use Value: Dual PCM mixers and hardware TDM demux eliminate external audio DSP, simplifying signal chain and reducing EMI risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive display and domain controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports CAN FD/Ethernet but lacks FPD-Link or VRAM. | Targeted at body control and gateway functions - not suitable for HUD/instrument cluster graphics rendering. | Select when safety-critical control dominates over display processing; requires external GPU or display controller. |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), ASIL-D capable, 12 MB flash, no hardware graphics acceleration or FPD-Link interface. | Optimized for powertrain and chassis control; lacks audio subsystem, VRAM, and display timing engines needed for cockpit HMI. | Prefer for high-integrity motor control or braking systems where graphics and audio are absent. |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLABEBQ1AESGS uniquely integrates graphics, audio, and networking in a single ASIL-B-certified package - eliminating inter-chip latency and reducing system-level complexity for automotive HMI.
Availability
CYT3DLABEBQ1AESGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, central domain controllers, and audio gateways requiring stable component supply, long lifecycle commitment, and automotive-grade traceability.
Supply support for CYT3DLABEBQ1AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G family - engineered specifically for automotive human-machine interface (HMI) systems requiring integrated graphics, audio, safety, and multi-protocol connectivity in a single chip.
FAQ
Does CYT3DLABEBQ1AESGS support ISO 26262 ASIL-B certification out of the box?
Yes. The device includes hardware safety mechanisms such as SECDED ECC on all safety-critical memories (flash, SRAM, TCM), SMPU, PPU, dual watchdog timers (WDT/MCWDT), and clock supervision - enabling ASIL-B compliance when used per Infineon's safety manual and diagnostic software library. No external safety monitor is required for basic ASIL-B partitioning.
What display interfaces does CYT3DLABEBQ1AESGS natively support?
It supports two native video output interfaces: Parallel RGB (up to 800×600 @ 40 MHz) and single-lane FPD-Link (up to 1920×720 @ 110 MHz). Both are driven by the integrated display engine with programmable timing generation, eliminating need for external timing controllers or level shifters in most HUD and cluster designs.
Can the graphics engine operate without external DRAM or frame buffers?
Yes. The graphics subsystem supports true on-the-fly rendering - composition, warping, and overlay operations execute directly from internal 2048 KB VRAM with zero frame buffer dependency. This reduces system latency, eliminates external memory bottlenecks, and lowers total BOM cost compared to discrete GPU solutions.
Is the crypto engine enabled on all CYT3DL variants, including CYT3DLABEBQ1AESGS?
Yes. CYT3DLABEBQ1AESGS includes the full crypto engine: AES-128/192/256, SHA-256/512, ECC/RSA acceleration, TRNG, and GCM mode - all accessible via the HSM interface. These features are silicon-verified and documented in Infineon's TRAVEO™ T2G Security Reference Manual (002-27764).
CYT3DLABEBQ1AESGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABEBQ1AESGS FAQ
1.How can I place an order for CYT3DLABEBQ1AESGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABEBQ1AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABEBQ1AESGS reliable?
The price and inventory of CYT3DLABEBQ1AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABEBQ1AESGS is usually 5 days.
3.What payment methods are accepted for CYT3DLABEBQ1AESGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABEBQ1AESGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABEBQ1AESGS?
CYT3DLABEBQ1AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABEBQ1AESGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABEBQ1AESGS?
For technical support, including CYT3DLABEBQ1AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABEBQ1AESGS requirements.
6.How does Aetrix verify that CYT3DLABEBQ1AESGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLABEBQ1AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABEBQ1AESGS meets industry standards.
7.What is the process for return or replacement of CYT3DLABEBQ1AESGS?
All CYT3DLABEBQ1AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABEBQ1AESGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABEBQ1AESGS part is unused and in its original packaging.
Return procedure for CYT3DLABEBQ1AESGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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