My Inquiry
My Account
Infineon Technologies CYT3DLABEBQ1AESGST
- Part No.:
- CYT3DLABEBQ1AESGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABEBQ1AESGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,997
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT3DLABEBQ1AESGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety compliance. It targets instrument clusters and HUD systems requiring real-time rendering, secure boot, and multi-interface connectivity.
For engineers reviewing the CYT3DLABEBQ1AESGST datasheet, CYT3DLABEBQ1AESGST pinout, CYT3DLABEBQ1AESGST application, or CYT3DLABEBQ1AESGST equivalent, key selection criteria include dual-core deterministic execution, on-the-fly display warping for HUDs, FPD-Link video output (1920×720 @ 110 MHz), embedded VRAM (2048 KB), and hardware crypto acceleration (AES-128/192/256, ECC, SHA-256/512).
Technical Context
The device implements a heterogeneous dual-CPU architecture: the Cortex-M7 handles high-throughput graphics and application tasks with 16 KB I/D cache and 64 KB TCM, while the Cortex-M0+ manages peripheral control, security services, and ASIL-B safety monitoring via dedicated SMPU/PPU protection units. Inter-processor communication is hardware-accelerated with dedicated mailbox and semaphore resources.
Graphics processing occurs in a dedicated subsystem with command sequencer, drawing engine, composition engine, and display timing generator - enabling frameless rendering (no frame buffer required) and real-time perspective warping for HUD projection. Video I/O supports MIPI CSI-2 (2-/4-lane, up to 2880×1080 @ 220 MHz) and parallel RGB capture (1600×600 @ 80 MHz), feeding directly into overlay-capable display paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application workloads |
| Graphics Engine | Integrated 2D/2.5D engine with on-the-fly warping, 2048 KB VRAM, and direct capture-to-display path for HUD latency reduction |
| Video I/O | FPD-Link single (1920×720 @ 110 MHz); MIPI CSI-2 2-/4-lane (2880×1080 @ 220 MHz); parallel RGB capture (1600×600 @ 80 MHz) |
| Networking | 4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps); 10/100 Mbps Ethernet MAC with IEEE 1588 PTP and AVB support |
| Security | HSM-compliant crypto engine: AES-128/192/256, ECC/RSA, SHA-256/512, TRNG, SECDED ECC on SRAM/flash/TCM, eSHE support |
| Functional Safety | ASIL-B compliant: MPU/SMPU/PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, hardware error correction on safety-critical memories |
| Memory | 4160 KB code-flash + 128 KB work-flash (RWW, dual-bank FOTA); 384 KB SRAM with configurable retention granularity |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max height, 0.8 mm ball pitch. Designed for automotive PCB thermal and mechanical reliability under AEC-Q100 Grade 2 conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input; supports dual BOD thresholds (2.7 V / 3.0 V) for robust analog measurement integrity |
| VCORE | Core voltage supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; enables wide automotive battery range operation |
| ETH_RXD[3:0] | Ethernet receive data | 4-bit MII/RMII interface supporting IEEE 802.3bw 10/100 Mbps; enables time-synchronized AVB/PTP traffic |
| CANFD0_TX | CAN FD channel 0 transmit | Differential output driving external CAN FD transceiver; supports non-ISO and ISO 11898-1:2015 protocols |
| MIPI_CSI2_CLK_P/N | MIPI CSI-2 clock differential pair | High-speed clock lane for 2-/4-lane camera interface; supports up to 220 MHz lane rate for 4K-class capture |
| FPD_LINK_DATA[7:0] | FPD-Link video data bus | 8-bit parallel LVDS-compatible interface driving HUD displays at HD resolution (1920×720) with embedded timing |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated perspective correction for HUD projection without frame buffer, reducing latency and memory bandwidth |
| Dual-bank flash with RWW | Enables concurrent firmware execution and over-the-air update (FOTA) without system interruption or external memory dependency |
| Hardware crypto acceleration | Dedicated engine delivering AES/GCM, SHA-512, ECC-384, and TRNG - meeting UNECE R155/R156 cybersecurity requirements |
| ASIL-B safety mechanisms | Integrated SMPU, PPU, SECDED ECC, and dual watchdogs provide hardware-enforced partitioning and fault containment per ISO 26262 |
| Smart I/O Boolean logic | Configurable combinational logic block on up to 8 GPIO_STD pins enables hardware-level signal conditioning without CPU intervention |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD cluster with animated transitions. IC Role / Device Role / Timing Role: Primary application processor with graphics engine, TCPWM for backlight dimming, and CAN FD for vehicle bus telemetry ingestion. Use Value: 240 MHz Cortex-M7 + 2048 KB VRAM enables smooth 60 Hz UI updates; dual-bank flash allows silent FOTA during ignition-off periods. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield using DLP or LCoS optics with geometric correction. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping; FPD-Link drives HUD controller; MIPI CSI-2 ingests forward camera feed. Use Value: Hardware warping eliminates GPU load and frame buffer memory; low-latency capture-to-display path (< 16 ms) meets HUD safety response requirements. |
| Automotive Audio Gateway | Secure Vehicle Control Unit |
Use Scenario: Aggregation and routing of audio streams from multiple ECUs (telematics, infotainment, ADAS) across TDM, PCM-PWM, and Ethernet AVB. IC Role / Device Role / Timing Role: Sound subsystem mixes five input streams; Ethernet MAC synchronizes audio clocks via IEEE 1588 PTP; CAN FD relays control commands. Use Value: Two PCM mixers + DAC + AVB support enable deterministic multi-source audio distribution with sub-100 µs jitter. | Use Scenario: Secure boot, OTA update validation, and runtime cryptographic attestation for ECU identity and firmware integrity. IC Role / Device Role / Timing Role: Cortex-M0+ executes HSM firmware; crypto engine verifies ECDSA signatures; eSHE enforces secure boot policy enforcement. Use Value: Hardware-accelerated ECDSA-384 verification completes in < 8 ms; TRNG + GCM ensures cryptographically strong key derivation for UNECE R156 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 1x 1000BASE-T1 Ethernet, ASIL-D capable | Targeted at domain controllers and gateway functions - lacks HUD-specific graphics acceleration and warping | Select when higher CPU throughput and Ethernet PHY integration are prioritized over display rendering capability |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), no Arm® architecture, 2D graphics IP licensed from Imagination, limited crypto acceleration | Focused on powertrain and chassis control; graphics support is secondary and less optimized for real-time HUD warping | Select for legacy RH850 ecosystem migration or where RX toolchain and ASIL-D motor control IP are required |
Compared with S32K344 and RH850/U2A, CYT3DLABEBQ1AESGST uniquely integrates HUD-optimized graphics hardware, dual-core safety partitioning, and automotive Ethernet AVB/PTP - making it the only option among the three qualified for full-stack instrument cluster + HUD convergence without external GPU or timing ICs.
Availability
CYT3DLABEBQ1AESGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, audio gateways, and secure vehicle control units requiring stable component supply across extended production lifecycles.
Supply support for CYT3DLABEBQ1AESGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G family - engineered specifically for automotive human-machine interface (HMI) systems demanding integrated graphics, functional safety, and multi-protocol connectivity in a single die.
FAQ
What is the maximum display resolution supported by CYT3DLABEBQ1AESGST via FPD-Link?
The device supports single-lane FPD-Link output at up to 1920×720 resolution with 110 MHz pixel clock, sufficient for standard HD HUD modules. This interface uses embedded sync and timing, eliminating need for separate clock lines and reducing EMI in automotive harnesses.
Does CYT3DLABEBQ1AESGST support simultaneous CAN FD and Ethernet communication?
Yes - it integrates four independent CAN FD controllers and one 10/100 Mbps Ethernet MAC, both operating concurrently. The hardware DMA controllers (P-DMA0/P-DMA1) and AXI/AHB interconnect ensure zero-copy data movement between CAN, Ethernet, and SRAM without CPU overhead.
How is functional safety implemented for ASIL-B compliance?
ASIL-B compliance is achieved through hardware-enforced partitioning: SMPU isolates M7/M0+ memory spaces; PPU restricts peripheral access; SECDED ECC protects SRAM/flash/TCM; MCWDT and CSV monitor clock integrity; and dual BOD thresholds guard against supply anomalies across VDDD/VDDA_ADC rails.
Is external RAM required for graphics operation?
No - the device includes 2048 KB of embedded VRAM and supports on-the-fly rendering without frame buffers. Graphics layers are composed and warped in hardware, minimizing external memory bandwidth and eliminating DDR dependency for HUD and cluster use cases.
CYT3DLABEBQ1AESGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABEBQ1AESGST FAQ
1.How can I place an order for CYT3DLABEBQ1AESGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABEBQ1AESGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABEBQ1AESGST reliable?
The price and inventory of CYT3DLABEBQ1AESGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABEBQ1AESGST is usually 5 days.
3.What payment methods are accepted for CYT3DLABEBQ1AESGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABEBQ1AESGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABEBQ1AESGST?
CYT3DLABEBQ1AESGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABEBQ1AESGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABEBQ1AESGST?
For technical support, including CYT3DLABEBQ1AESGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABEBQ1AESGST requirements.
6.How does Aetrix verify that CYT3DLABEBQ1AESGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLABEBQ1AESGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABEBQ1AESGST meets industry standards.
7.What is the process for return or replacement of CYT3DLABEBQ1AESGST?
All CYT3DLABEBQ1AESGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABEBQ1AESGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABEBQ1AESGST part is unused and in its original packaging.
Return procedure for CYT3DLABEBQ1AESGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT3DLABEBQ1AESGST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
