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Infineon Technologies CYT3DLABFBQ1AESGS

Name: CYT3DLABFBQ1AESGS
Brand: Infineon Technologies
SKU: CYT3DLABFBQ1AESGS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYT3DLABFBQ1AESGS

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 216-LQFP Exposed Pad

Datasheet:: CYT3DLABFBQ1AESGS.pdf

Description:: TRAVEO-2 CLUST.2.5DGRAPH

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYT3DLABFBQ1AESGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual-core Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz), 4160 KB code-flash, 384 KB SRAM, integrated 2D/2.5D graphics engine, and CAN FD/Ethernet/CXPI/LIN interfaces. It targets instrument clusters and HUD systems requiring real-time rendering, secure boot, and ASIL-B functional safety compliance.

For engineers reviewing the CYT3DLABFBQ1AESGS datasheet, CYT3DLABFBQ1AESGS pinout, CYT3DLABFBQ1AESGS application, or CYT3DLABFBQ1AESGS equivalent, key selection criteria include dual-CPU architecture for workload partitioning, on-the-fly display warping for HUDs, hardware crypto acceleration (AES-256, ECC, SHA-256), and 135 GPIO with stepper motor control capability.

Technical Context

The CYT3DLABFBQ1AESGS implements a heterogeneous dual-CPU subsystem: the Cortex-M7 handles high-performance graphics and application processing with 16 KB I/D caches and TCM, while the Cortex-M0+ manages peripheral control, security services, and ASIL-B safety monitoring via dedicated SMPU/PPU. Inter-processor communication is handled in hardware with shared memory and mailbox registers.

Its graphics pipeline includes a command sequencer, drawing engine, composition engine, and display engine supporting parallel RGB (800×600@40 MHz) and FPD-Link (1920×720@110 MHz), with real-time warping and direct video feed-through-enabling HUD projection without frame buffers. The sound subsystem integrates four TDM, two PCM-PWM, five SG, and dual audio mixers with DAC output.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Cores	Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks.
Memory	4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention granularity.
Graphics Engine	2D/2.5D rendering with on-the-fly warping, 2048 KB VRAM, parallel RGB & FPD-Link outputs, no frame buffer required.
Security	HSM-compliant crypto engine: AES-128/192/256, ECC/RSA, SHA-256/512, TRNG, SECDED ECC on all safety-critical memories.
Automotive Interfaces	4× CAN FD (up to 8 Mbps), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC (IEEE-802.3bw, AVB, PTP), SMIF with XIP & encryption.
ADC & Timers	12-bit SAR ADC (32 logical/48 external channels, 1 Msps), 50× 16-bit + 32× 32-bit TCPWM blocks, 12 motor-control timers (6 SMC channels).
I/O & Power	135 programmable GPIO (GPIO_STD/ENH/SMC/HSIO_STDLN), ASIL-B compliant safety features including MPU/SMPU/PPU, LVD/BOD/OVD/OCD.

Pinout & Package

Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.

Pin/Terminal	Circuit Role	Design Meaning
VDDA_ADC	Analog supply for ADC	1.1 V regulated input; supports dual BOD thresholds (2.7 V / 3.0 V) for robust analog sensing in automotive environments.
VDDD	Digital core supply	1.1 V nominal core rail generated internally from 2.7–5.5 V input; enables wide-range battery operation.
SWDCLK / SWDIO	Serial Wire Debug interface	Two-pin debug path compliant with Arm® SWD; supports full trace (ETM), flash programming, and secure debug authentication.
ETH_RXD0–3 / ETH_TXD0–3	Ethernet PHY data lanes	Supports MII/RMII physical layer interfacing; enables IEEE-802.1BA AVB and IEEE-1588 PTP for time-synchronized in-vehicle networks.
FPD_LNK_CLK / FPD_LNK_DATA[0:3]	FPD-Link video output	Single-channel LVDS-compatible interface driving up to 1920×720@110 MHz; used for HUD display timing and pixel streaming.
MIPI_CSI2_CLK / MIPI_CSI2_D[0:3]	MIPI CSI-2 camera input	Two- or four-lane interface supporting up to 2880×1080@220 MHz; enables high-resolution surround-view or driver-monitoring camera capture.

Key Features

Feature	Design Value
Dual-CPU Workload Partitioning	M7 executes graphics/UI/application code; M0+ handles peripheral management, crypto offload, and ASIL-B safety monitoring-reducing software complexity and certification effort.
On-the-Fly Display Warping	Hardware-accelerated geometric correction applied during pixel stream generation-eliminates need for frame buffers and reduces latency critical for HUD projection onto curved windshields.
Firmware Update Over-The-Air (FOTA)	Dual-bank flash architecture with RWW allows background firmware validation and atomic swap-ensuring zero-downtime updates in production vehicles.
ASIL-B Functional Safety Support	Integrated SMPU, PPU, MCWDT, SECDED ECC on SRAM/flash/TCM, and hardware-isolated safety monitor enable ISO 26262-compliant system design without external safety co-processors.
Secure Boot & Cryptographic Acceleration	Hardware eSHE/HSM engine performs RSA/ECC signature verification, AES-GCM encryption, and SHA-256 hashing-accelerating secure boot by >10× vs. software-only implementation.

Applications

Instrument Cluster

Head-Up Display (HUD)

Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD or OLED dashboards.

IC Role / Device Role / Timing Role: Primary application processor with graphics engine, CAN FD gateway, and safety monitor for cluster MCU.

Use Value: Dual-core execution ensures deterministic UI refresh at 60 Hz while maintaining ASIL-B compliance for warning indicators.

Use Scenario: Projection of speed, navigation, and ADAS cues onto vehicle windshield with optical distortion correction.

IC Role / Device Role / Timing Role: Graphics controller with on-the-fly warping engine and FPD-Link video output driving HUD projector.

Use Value: Eliminates external FPGA/GPU; warping applied during pixel streaming reduces latency to <5 ms for motion-coupled projection.

Central Gateway

Driver Monitoring System (DMS)

Use Scenario: Aggregation and routing of CAN FD, LIN, CXPI, and Ethernet traffic between domain ECUs in zonal architectures.

IC Role / Device Role / Timing Role: Network bridge with protocol translation, firewall logic, and secure OTA update handling.

Use Value: Integrated 4× CAN FD + Ethernet MAC + crypto engine enables secure, low-latency inter-domain communication without external transceivers or security chips.

Use Scenario: Real-time facial landmark detection, eye tracking, and drowsiness analysis using infrared camera input.

IC Role / Device Role / Timing Role: Vision preprocessor with MIPI CSI-2 capture, SAR ADC for ambient light sensing, and secure AI inference offload.

Use Value: Hardware-accelerated image capture (2880×1080@220 MHz) and on-chip crypto ensure privacy-preserving biometric processing with <100 ms end-to-end latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP S32K344	Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports ASIL-D via lockstep cores.	Targeted at powertrain and chassis control-not optimized for HUD/instrument cluster graphics rendering.	Select when highest functional safety level (ASIL-D) and deterministic real-time control outweigh graphics needs.
Renesas RH850/U2A	32-bit proprietary core (not Arm), 480 MHz, 12 MB flash, no hardware graphics accelerator, strong CAN FD/Ethernet support.	Focused on body electronics and gateway functions; lacks on-the-fly warping and VRAM for HUD use cases.	Choose for legacy RH850 ecosystem integration or where Arm compatibility is not required.

Compared with S32K344 and RH850/U2A, CYT3DLABFBQ1AESGS uniquely combines dual-Arm cores, hardware graphics acceleration, and HUD-specific warping-making it the only option among the three qualified for production automotive instrument clusters and AR-HUD systems without external GPU/FPGA.

Availability

CYT3DLABFBQ1AESGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, central gateways, and driver monitoring systems requiring stable component supply, long lifecycle support, and ASIL-B certified silicon.

Supply support for CYT3DLABFBQ1AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT3DL belongs to the TRAVEO™ T2G family-designed specifically for next-generation automotive human-machine interfaces, combining graphics, audio, networking, and functional safety in a single SoC for digital cockpits.

FAQ

What is the maximum display resolution supported by CYT3DLABFBQ1AESGS via FPD-Link?

The device supports up to 1920×720 pixels at 110 MHz over single-channel FPD-Link, sufficient for HD-resolution HUD projection. This interface uses LVDS-compatible signaling and includes hardware timing generation and on-the-fly warping-enabling direct pixel streaming to HUD projectors without external frame buffers or timing controllers.

Does CYT3DLABFBQ1AESGS support secure boot with cryptographic verification?

Yes-it implements hardware-accelerated secure boot using digital signature verification (RSA/ECC) and hash checking (SHA-256/512). The HSM-compliant crypto engine validates firmware images before execution, supports fast secure boot with measured boot logs, and enforces chain-of-trust through immutable ROM bootloader and eFuse-controlled configuration locks.

How many CAN FD channels does CYT3DLABFBQ1AESGS integrate, and what is their data rate capability?

The MCU integrates four independent CAN FD controllers, each supporting data rates up to 8 Mbps in the FD phase-subject to physical layer constraints (transceiver, cabling, topology). It complies fully with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0, and holds ISO 16845:2015 conformance certification for interoperability testing.

Is CYT3DLABFBQ1AESGS qualified for automotive temperature grade and AEC-Q100?

Yes-this part is rated for AEC-Q100 Grade 2 (−40 °C to +105 °C ambient), qualified per automotive reliability standards including HTOL, ESD, and latch-up testing. Its design incorporates SECDED ECC on all safety-critical memories, BOD/LVD/OVD monitoring, and ASIL-B functional safety mechanisms aligned with ISO 26262 Part 5 requirements.

CYT3DLABFBQ1AESGS Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 216-LQFP Exposed Pad

Series:: Traveo™ T2G

Packaging:: Tray

Product Status:: Active

Programmable:: -

Core Processor:: ARM® Cortex®-M0+, ARM® Cortex®-M7F

Core Size:: 32-Bit Dual-Core

Speed:: 100MHz, 240MHz

Connectivity:: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART

Peripherals:: DMA, I2S, LVD, Temp Sensor, WDT

Number of I/O:: 108

Program Memory Size:: 4.06MB (4.06M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 128K x 8

RAM Size:: 384K x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 5.5V

Data Converters:: A/D 48x12b SAR

Oscillator Type:: External, Internal

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

CYT3DLABFBQ1AESGS FAQ

1.How can I place an order for CYT3DLABFBQ1AESGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT3DLABFBQ1AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT3DLABFBQ1AESGS reliable?

The price and inventory of CYT3DLABFBQ1AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABFBQ1AESGS is usually 5 days.

3.What payment methods are accepted for CYT3DLABFBQ1AESGS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABFBQ1AESGS transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT3DLABFBQ1AESGS?

CYT3DLABFBQ1AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT3DLABFBQ1AESGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT3DLABFBQ1AESGS?

For technical support, including CYT3DLABFBQ1AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABFBQ1AESGS requirements.

6.How does Aetrix verify that CYT3DLABFBQ1AESGS is sourced from the original manufacturer or authorized distributors?

All CYT3DLABFBQ1AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABFBQ1AESGS meets industry standards.

7.What is the process for return or replacement of CYT3DLABFBQ1AESGS?

All CYT3DLABFBQ1AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABFBQ1AESGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT3DLABFBQ1AESGS part is unused and in its original packaging.

Return procedure for CYT3DLABFBQ1AESGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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