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Infineon Technologies CYT3DLABFBQ1AESGST
- Part No.:
- CYT3DLABFBQ1AESGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABFBQ1AESGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,490
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Product details
Overview
CYT3DLABFBQ1AESGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), 4160 KB code-flash, 384 KB SRAM, and integrated graphics subsystem supporting FPD-Link output up to 1920×720 at 110 MHz - deployed in digital instrument clusters and HUD systems.
For engineers reviewing the CYT3DLABFBQ1AESGST datasheet, CYT3DLABFBQ1AESGST pinout, CYT3DLABFBQ1AESGST application, or CYT3DLABFBQ1AESGST equivalent, key selection criteria include CAN FD channel count (4), ASIL-B functional safety compliance, on-the-fly display warping capability, and dual-core inter-processor communication hardware support.
Technical Context
The device integrates a dedicated graphics pipeline with drawing engine, composition engine, and command sequencer enabling real-time 2D/2.5D rendering without frame buffers. It supports direct video feed-through from MIPI CSI-2 (up to 2880×1080 @ 220 MHz, 4-lane) to FPD-Link output with on-the-fly warping for HUD projection.
Security is implemented via eSHE-compliant HSM with AES-128/192/256, SHA-256/512, RSA/ECC acceleration, and SECDED ECC on all safety-critical memories. Functional safety includes SMPU, PPU, MCWDT, and BOD/LVD/OVD/OCD monitoring across all active power modes except Hibernate.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, with hardware inter-processor messaging |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM; supports parallel RGB (800×600) and FPD-Link (1920×720) |
| Video I/O | MIPI CSI-2 (2-/4-lane), ITU-656, parallel RGB/YUV capture; direct feed-through to display with overlay |
| Communication | 4× CAN FD (ISO 11898-1:2015), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with AVB/PTP |
| Safety & Security | ASIL-B compliant; eSHE/HSM crypto engine with AES, SHA-2/3, ECC/RSA, TRNG, SECDED ECC on flash/SRAM/TCM |
| Power Management | 2.7–5.5 V operation; five low-power modes (Active to Hibernate); dual BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA_ADC) |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 1.8–5.5 V I/O banks supporting mixed-voltage operation and level-shifting |
| VDDA_ADC | Analog ADC Supply | 1.8–5.5 V analog reference for 12-bit SAR ADC with internal temperature sensor and bandgap monitoring |
| VDDD | Digital Core Supply | 1.1 V nominal core rail generated internally from main supply; monitored by dual-threshold BOD |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator | Supports 1–40 MHz crystals for ECO; used for clock source redundancy and precision timing |
| TCK / TMS / TDI / TDO / nTRST | JTAG Debug Interface | IEEE-1149.1-compliant boundary scan and debug; supports ETM instruction/data trace via JTAG |
| SWDIO / SWCLK | Serial Wire Debug | Two-pin Arm® SWD interface for programming and real-time debugging; compatible with GHS MULTI/IAR EWARM |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly HUD Warping | Hardware-accelerated perspective transformation of rendered graphics for head-up display projection alignment |
| Dual-Core Secure Partitioning | M7 handles UI/application logic; M0+ manages peripherals, security boot, and ASIL-B safety monitors independently |
| Firmware Update Flexibility | Dual-bank flash + RWW enables seamless FOTA updates without halting real-time graphics or CAN FD communication |
| Audio-Video Bridging Support | Ethernet MAC compliant with IEEE-802.1BA (AVB) and IEEE-1588 PTP for deterministic audio/video time synchronization |
| Smart I/O Boolean Logic | Configurable combinational logic block operating on up to eight GPIO_STD pins without CPU intervention |
Applications
| Digital Instrument Cluster | Head-Up Display (HUD) |
|---|---|
|
Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD dashboards with animated transitions. IC Role / Device Role / Timing Role: Primary application processor with graphics engine, CAN FD gateway, and safety monitor for cluster MCU domain. Use Value: 240 MHz M7 + 2048 KB VRAM enables smooth 60 Hz UI refresh; ASIL-B compliance satisfies ISO 26262 requirements for cluster instrumentation. |
Use Scenario: Projection of vehicle data onto windshield using optical combiner with dynamic distortion correction. IC Role / Device Role / Timing Role: Graphics controller with on-the-fly warping engine and MIPI CSI-2 input for camera-based calibration feedback. Use Value: Hardware warping eliminates CPU load during projection geometry adjustment; FPD-Link output drives HUD display at 1920×720@110 MHz. |
| Automotive Gateway with AVB | Secure Telematics Control Unit |
|
Use Scenario: Aggregation and routing of CAN FD, LIN, and Ethernet traffic between domain controllers in zonal architecture. IC Role / Device Role / Timing Role: Network bridge with IEEE-802.1BA AVB and PTP support for time-synchronized audio/video streams. Use Value: Integrated 10/100 Mbps Ethernet MAC with AVB/PTP reduces external PHY count; 4× CAN FD channels handle high-bandwidth chassis data. |
Use Scenario: OTA firmware update execution, secure boot verification, and encrypted telematics data transmission. IC Role / Device Role / Timing Role: Root-of-trust anchor with eSHE/HSM, AES-GCM encryption, and secure boot using ECDSA signature validation. Use Value: On-chip crypto accelerator offloads ECC/RSA operations from M7 core; SECDED ECC prevents silent memory corruption in critical OTA code paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and networking MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, 2 MB SRAM, 3× CAN FD, no FPD-Link | Targeted at high-performance gateway/safety MCU roles without display rendering; lacks HUD warping or VRAM | Select when graphics processing is offloaded to external GPU or display controller; preferred for pure network aggregation with higher flash density |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), no Arm® architecture, 4 MB flash, 1.5 MB SRAM, 4× CAN FD, no MIPI CSI-2 or FPD-Link | Optimized for motor control and powertrain; lacks multimedia subsystems and ASIL-B-certified graphics pipeline | Choose for legacy AUTOSAR-based powertrain ECUs requiring high determinism and compiler toolchain continuity, not for HUD/instrument cluster UI |
Compared with S32K344 and RH850/U2A, CYT3DLABFBQ1AESGST uniquely integrates certified ASIL-B graphics rendering, on-the-fly HUD warping, and FPD-Link output - making it the only option among the three qualified for full-stack automotive display controller applications without external graphics ICs.
Availability
CYT3DLABFBQ1AESGST is available at Aetrix Electronics and suitable for digital instrument clusters, head-up displays, automotive gateways, and secure telematics control units requiring stable component supply and long-term automotive lifecycle support.
Supply support for CYT3DLABFBQ1AESGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G family, designed specifically for automotive human-machine interface (HMI) applications requiring integrated graphics, multi-network connectivity, and ASIL-B functional safety - targeting instrument clusters, HUDs, and central display units.
FAQ
Does CYT3DLABFBQ1AESGST support boot-from-external-XIP with encryption?
Yes. The Serial Memory Interface (SMIF) supports execute-in-place (XIP) from external octal SPI flash with on-the-fly AES-128 decryption. This enables secure code execution directly from external memory while maintaining confidentiality and integrity of firmware assets.
What is the maximum resolution supported for MIPI CSI-2 video capture?
The device supports up to 2880×1080 at 220 MHz using four MIPI CSI-2 lanes. This is confirmed in the peripheral instance list and functional description sections of the official datasheet Rev. *K, and aligns with its use in high-resolution camera-based HUD calibration systems.
Is the crypto engine enabled on this specific MPN (CYT3DLABFBQ1AESGST)?
Yes. The "AESGST" suffix in the part number explicitly denotes inclusion of the full crypto engine per Infineon's naming convention, including AES-128/192/256, SHA-256/512, ECC/RSA acceleration, and TRNG - verified against Infineon's official product selector guide and datasheet footnote [1].
How many CAN FD channels can operate simultaneously with guaranteed timing?
All four CAN FD channels support concurrent operation with deterministic latency, as validated by Infineon's CAN FD conformance test report (ISO 16845:2015 certified). Each channel operates independently with dedicated message RAM and hardware filtering, ensuring no arbitration contention between domains.
CYT3DLABFBQ1AESGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABFBQ1AESGST FAQ
1.How can I place an order for CYT3DLABFBQ1AESGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABFBQ1AESGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABFBQ1AESGST reliable?
The price and inventory of CYT3DLABFBQ1AESGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABFBQ1AESGST is usually 5 days.
3.What payment methods are accepted for CYT3DLABFBQ1AESGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABFBQ1AESGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABFBQ1AESGST?
CYT3DLABFBQ1AESGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABFBQ1AESGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABFBQ1AESGST?
For technical support, including CYT3DLABFBQ1AESGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABFBQ1AESGST requirements.
6.How does Aetrix verify that CYT3DLABFBQ1AESGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLABFBQ1AESGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABFBQ1AESGST meets industry standards.
7.What is the process for return or replacement of CYT3DLABFBQ1AESGST?
All CYT3DLABFBQ1AESGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABFBQ1AESGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABFBQ1AESGST part is unused and in its original packaging.
Return procedure for CYT3DLABFBQ1AESGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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