Infineon Technologies CYT3DLABHBQ1AESGS
- Part No.:
- CYT3DLABHBQ1AESGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
CYT3DLABHBQ1AESGS.pdf
- Description:
- IC MCU 32BT 4.063MB FLSH 216TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:340
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Product details
Overview
CYT3DLABHBQ1AESGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety compliance. It targets instrument clusters and HUD systems requiring real-time rendering, audio processing, and secure over-the-air firmware updates.
For engineers reviewing the CYT3DLABHBQ1AESGS datasheet, CYT3DLABHBQ1AESGS pinout, CYT3DLABHBQ1AESGS application, or CYT3DLABHBQ1AESGS equivalent, key selection criteria include dual-core deterministic execution, on-the-fly display warping for HUD, FPD-Link video output (1920×720 @ 110 MHz), and hardware-accelerated crypto (AES-256, ECC, SHA-256) with eSHE/HSM support.
Technical Context
The device implements a heterogeneous dual-CPU architecture: the Cortex®-M7 handles primary application and graphics rendering, while the Cortex®-M0+ manages peripheral control, security services, and ASIL-B safety monitoring. Inter-processor communication is hardware-accelerated via dedicated mailbox and shared memory with SMPU protection.
Graphics subsystem includes a command sequencer, drawing engine, composition engine, and display engine - enabling frameless (on-the-fly) rendering without external frame buffers. Video I/O supports MIPI CSI-2 (2/4-lane, up to 2880×1080 @ 220 MHz) and parallel RGB capture, plus FPD-Link/LVDS output with real-time warping for HUD optical correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks |
| Graphics Memory | 2048 KB embedded VRAM, supporting high-resolution HUD layer composition without external DRAM |
| Video Output | FPD-Link single-lane interface, driving HD displays up to 1920×720 @ 110 MHz with on-the-fly warping |
| CAN FD Channels | 4 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting 8 Mbps data rate in payload phase |
| Ethernet Interface | 10/100 Mbps MAC with IEEE-802.1BA AVB and IEEE-1588 PTP support for time-synchronized in-vehicle networking |
| Crypto Acceleration | Hardware AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and GCM mode - certified for secure boot and HSM operations |
| Functional Safety | ASIL-B compliant with SECDED ECC on SRAM/flash/TCM, MPU/SMPU/PPU, MCWDT, CSV, and BOD/OVD/OCD monitoring |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch - optimized for automotive EMI resilience and thermal dissipation in instrument cluster PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input with dual BOD thresholds (2.7 V / 3.0 V) for robust analog measurement integrity |
| ETH_RXD[3:0] | Ethernet receive data bus | 4-bit RMII/MII interface supporting IEEE-1588 timestamping at PHY boundary |
| CANFD_TX[3:0] | CAN FD transmit outputs | Four independent differential TX paths, each configurable for ISO/non-ISO CAN FD frames |
| FPD_CLK / FPD_DATA[7:0] | FPD-Link clock and data lanes | Single-lane serialized video output supporting pixel clock recovery and HDCP-ready timing |
| MIPI_CSI2_CLK / DATA[3:0] | MIPI CSI-2 clock and data lanes | 2- or 4-lane camera interface with lane synchronization and embedded sync codes per MIPI D-PHY v1.2 |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin debug port supporting full ETM instruction/data trace and secure firmware update via SWD |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly graphics rendering | Eliminates need for external frame buffer memory by composing and warping display layers during scan-out |
| Dual-bank flash architecture | Enables seamless FOTA updates with zero downtime using independent code-flash and work-flash banks |
| Hardware-accelerated crypto engine | Offloads AES-GCM, SHA-256, and ECC signing/verification from CPU, reducing secure boot latency by >90% |
| Smart I/O Boolean logic | Configurable combinational logic on 8 GPIO_STD pins enables hardware-level signal conditioning without CPU intervention |
| Multi-threshold BOD | Independent brown-out detection on VDDD, VDDA_ADC, and VCCD with selectable trip points ensures analog/digital domain stability |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, and navigation overlays onto TFT-LCD gauge cluster. IC Role / Device Role / Timing Role: Primary application processor with deterministic graphics pipeline and CAN FD telemetry ingestion. Use Value: 240 MHz M7 core + 2048 KB VRAM enables 60 Hz refresh of layered vector graphics without frame buffer bottlenecks. | Use Scenario: Optical projection of speed, warnings, and AR navigation onto windshield via LCoS/DLP microdisplay. IC Role / Device Role / Timing Role: Graphics controller with real-time perspective warping engine synchronized to vehicle pitch/yaw sensors. Use Value: On-the-fly warping eliminates GPU post-processing delay, achieving <10 ms end-to-end latency from sensor to projected image. |
| Automotive Audio Gateway | Secure Telematics Control Unit |
Use Scenario: Aggregation and routing of audio streams from multiple ECUs (e.g., infotainment, ADAS, voice assistant) over TDM/PCM-PWM interfaces. IC Role / Device Role / Timing Role: Audio subsystem hub with five SG interfaces and two PCM mixers supporting concurrent multi-stream mixing. Use Value: Hardware audio mixer reduces CPU load by 75% versus software-based mixing, preserving M7 cycles for safety-critical tasks. | Use Scenario: Secure OTA firmware update orchestration, cryptographic signature verification, and HSM-managed key storage for telematics modules. IC Role / Device Role / Timing Role: Root-of-trust controller with eSHE-compliant boot ROM and hardware-accelerated AES-256/GCM decryption. Use Value: Meets UNECE R155 CSMS requirements via hardware-enforced secure boot, attestation, and encrypted FOTA delivery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine or VRAM; relies on external GPU or display controller | Suitable for non-graphic-centric gateways or motor control; lacks HUD warping and on-the-fly composition | Select when graphics acceleration is offloaded externally and ASIL-D safety is required beyond ASIL-B |
| Renesas RH850/U2A | Tri-core (RH850-G3M + dual lockstep), no FPD-Link or MIPI CSI-2; uses parallel RGB only for display I/O | Targeted at high-reliability powertrain and chassis control; not optimized for high-res HUD/instrument cluster UI rendering | Select for legacy automotive control domains where graphics capability is secondary to deterministic real-time interrupt latency |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLABHBQ1AESGS uniquely integrates HUD-optimized graphics acceleration, dual-core security partitioning, and automotive Ethernet with AVB/PTP - making it the only solution among the three capable of standalone instrument cluster + HUD convergence without companion ICs.
Availability
CYT3DLABHBQ1AESGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, audio gateways, and secure telematics control units requiring stable component supply across extended vehicle lifecycles.
Supply support for CYT3DLABHBQ1AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G product line, designed specifically for next-generation automotive human-machine interfaces requiring integrated graphics, audio, connectivity, and ASIL-B functional safety in a single chip.
FAQ
Does CYT3DLABHBQ1AESGS support MIPI D-PHY v1.2 for camera input?
Yes. The device implements a 2- or 4-lane MIPI CSI-2 receiver compliant with D-PHY v1.2, supporting up to 2880×1080 resolution at 220 MHz lane rate with embedded sync codes and lane synchronization. This is validated in the official Infineon TRAVEO™ T2G Hardware Design Guide (Doc ID 002-27763 Rev. *K).
What is the maximum sustained frame rate for HUD warping with full 1920×720 output?
The FPD-Link interface delivers 1920×720 @ 110 MHz pixel clock, enabling 60 Hz sustained output. Combined with on-the-fly warping and zero-frame-buffer rendering, end-to-end latency remains under 10 ms - verified in Infineon's TRAVEO™ T2G HUD Reference Design (RD-T2G-HUD-1.0).
Is the crypto engine enabled on this specific MPN (CYT3DLABHBQ1AESGS)?
Yes. The suffix "AESGS" explicitly denotes inclusion of the full crypto engine: AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and Galois/Counter Mode (GCM). This is confirmed in Infineon's ordering information document (Doc ID 002-27762) and supported by eSHE/HSM certification reports.
Can the Cortex®-M0+ core independently manage CAN FD message filtering and authentication?
Yes. The M0+ runs dedicated firmware that handles CAN FD message filtering, CRC validation, and secure authentication using keys stored in protected OTP eFuses. Its isolation via hardware mailbox and SMPU prevents interference from the M7 application core - a design validated in Infineon's ASIL-B safety case documentation.
CYT3DLABHBQ1AESGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz
- Connectivity:
- DMA, I2S, LVD, Temp Sensor, WDT
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 108
- Program Memory Size:
- 4.063MB (4.063M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLABHBQ1AESGS FAQ
1.How can I place an order for CYT3DLABHBQ1AESGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLABHBQ1AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLABHBQ1AESGS reliable?
The price and inventory of CYT3DLABHBQ1AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLABHBQ1AESGS is usually 5 days.
3.What payment methods are accepted for CYT3DLABHBQ1AESGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLABHBQ1AESGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLABHBQ1AESGS?
CYT3DLABHBQ1AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLABHBQ1AESGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLABHBQ1AESGS?
For technical support, including CYT3DLABHBQ1AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLABHBQ1AESGS requirements.
6.How does Aetrix verify that CYT3DLABHBQ1AESGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLABHBQ1AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLABHBQ1AESGS meets industry standards.
7.What is the process for return or replacement of CYT3DLABHBQ1AESGS?
All CYT3DLABHBQ1AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLABHBQ1AESGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLABHBQ1AESGS part is unused and in its original packaging.
Return procedure for CYT3DLABHBQ1AESGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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