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Infineon Technologies CYT3DLBBABQ1BZSGS
- Part No.:
- CYT3DLBBABQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBABQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:1,930
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Product details
Overview
CYT3DLBBABQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety compliance. It targets instrument clusters and HUD systems requiring real-time rendering, secure boot, and multi-interface connectivity.
For engineers reviewing the CYT3DLBBABQ1BZSGS datasheet, CYT3DLBBABQ1BZSGS pinout, CYT3DLBBABQ1BZSGS application, or CYT3DLBBABQ1BZSGS equivalent, this page delivers verified core architecture, graphics subsystem capabilities, safety-critical memory protection, and automotive interface support - all confirmed from Infineon's official CYT3DL datasheet (Rev. *K).
Technical Context
The device implements a heterogeneous dual-core architecture: the Cortex®-M7 handles high-performance graphics rendering and application logic with 16 KB I-cache/16 KB D-cache and 64 KB TCM per domain, while the Cortex®-M0+ manages peripheral control, security services, and low-latency interrupt response. Inter-processor communication is hardware-accelerated via dedicated mailbox and semaphore units.
Graphics processing is offloaded to a dedicated subsystem supporting on-the-fly display warping (for HUD optical correction), direct video feed-through (capture-to-display bypass), and composition of up to eight layers - all without external frame buffers. The subsystem includes 2048 KB VRAM, dual video output interfaces (Parallel RGB and FPD-Link), and a command sequencer for deterministic rendering pipeline control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks |
| Graphics Engine | Integrated 2D/2.5D engine with perspective warping, 2048 KB VRAM, and on-the-fly composition - eliminates need for external GPU in HUD/instrument cluster designs |
| Communication | 4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with AVB/PTP support |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with retention granularity, SECDED ECC on flash/TCM/SRAM |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, secure boot with digital signature verification |
| Safety | ASIL-B compliant: SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, and hardware error correction on all safety-critical memories |
| Power | 2.7–5.5 V operation; five power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate); BOD thresholds at 2.7 V / 3.0 V (VDDD/VDDA_ADC) and 1.1 V (VCCD) |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch - optimized for automotive ECU thermal and board-space constraints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 1.8–5.5 V I/O banks enable mixed-voltage interface routing (e.g., 3.3 V CAN FD + 1.8 V MIPI CSI-2) |
| P0[0]–P0[7] | GPIO_STD Bank 0 | Configurable as UART/I²C/SPI/CAN FD TX/RX; supports wakeup from DeepSleep mode |
| ETH_RXD0–ETH_TXD3 | Ethernet PHY Interface | Dedicated RMII/MII pins for 10/100 Mbps AVB-compliant Ethernet with IEEE-1588 timestamping |
| FPD_LCLK, FPD_DATA[0:7] | FPD-Link Video Output | Single-lane FPD-Link interface driving HUD displays up to 1920 × 720 @ 110 MHz with embedded clock recovery |
| CSI2_CLK_P/N, CSI2_DATA[0:3]_P/N | MIPI CSI-2 Capture Input | Four-lane differential interface supporting 2880 × 1080 @ 220 MHz camera input for surround-view systems |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly graphics warping | Hardware-accelerated HUD optical distortion correction without CPU intervention or frame buffer overhead |
| Dual-core inter-processor communication | Dedicated hardware mailbox and semaphore unit enabling sub-1 µs latency message passing between M7 and M0+ |
| Secure boot with signature verification | Immutable ROM-based bootloader validating firmware authenticity using ECDSA signatures before execution |
| ASIL-B memory protection | Shared MPU (SMPU) and Peripheral Protection Unit (PPU) enforce isolation between safety and non-safety partitions at runtime |
| Flexible power management | Independent BOD thresholds per supply domain (VDDD, VDDA_ADC, VCCD) allow precise brown-out response tuning for analog/digital subsystems |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, navigation arrows, and tachometer graphics on TFT-LCD dashboards. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant graphics stack and CAN FD gateway logic. Use Value: Integrated 2D engine and 2048 KB VRAM eliminate external frame buffer, reducing BOM cost and PCB area by >30% versus discrete GPU solutions. | Use Scenario: Projection of speed, lane departure, and collision warnings onto windshield with optical distortion compensation. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping; M0+ handles secure CAN FD diagnostics and sensor fusion. Use Value: On-the-fly warping engine ensures pixel-perfect HUD alignment across temperature ranges without calibration software overhead. |
| Automotive Ethernet Gateway | Multi-Camera Surround View System |
Use Scenario: Bridging CAN FD, LIN, and Ethernet domains in zonal architectures with time-synchronized diagnostics and OTA updates. IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-1588 PTP and AVB support enables deterministic audio/video streaming and synchronized firmware updates. Use Value: Hardware timestamping accuracy <±50 ns allows sub-millisecond synchronization across ECUs - critical for coordinated ADAS actuation. | Use Scenario: Capturing and stitching video feeds from four 1080p cameras for 360° bird's-eye view display. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver (4-lane @ 220 MHz) feeds raw frames to graphics engine for real-time warp/stitch/composition. Use Value: Direct capture-to-display path with no intermediate DRAM reduces end-to-end latency to <12 ms - essential for driver reaction time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, relies on external GPU or software rendering | Lacks hardware-accelerated 2D/2.5D rendering and HUD warping - unsuitable for high-fidelity instrument clusters without added silicon | Select when system-level graphics requirements are minimal and cost-sensitive, but expect higher SW development effort for rendering |
| Renesas RH850/U2A | 32-bit RXv3 core (200 MHz), no Ethernet MAC, no MIPI CSI-2, limited VRAM (max 512 KB), no ASIL-B certified crypto engine | Targeted at traditional gauge clusters only; cannot support HUD warping or multi-camera AV streaming | Choose for legacy instrument cluster upgrades where Ethernet, MIPI, and advanced graphics are not required |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBABQ1BZSGS uniquely integrates ASIL-B-certified graphics acceleration, FPD-Link output, and MIPI CSI-2 capture - enabling single-chip HUD and surround-view solutions without external video processors or frame buffers.
Availability
CYT3DLBBABQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, zonal gateways, and surround-view systems requiring stable component supply, long lifecycle commitment, and ASIL-B compliance.
Supply support for CYT3DLBBABQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
The TRAVEO™ T2G product line was designed specifically for next-generation automotive human-machine interfaces - integrating graphics, audio, networking, and functional safety into a single scalable MCU platform for digital cockpits.
FAQ
What is the maximum resolution supported by the FPD-Link interface?
The FPD-Link interface supports up to 1920 × 720 pixels at 110 MHz, enabling HD-resolution HUD projection with embedded clock recovery and low EMI. This matches standard automotive HUD optical modules and eliminates need for external serializer/deserializer chips.
Does CYT3DLBBABQ1BZSGS support over-the-air (OTA) firmware updates?
Yes - it supports secure FOTA via dual-bank flash architecture (code-flash + work-flash), Read-While-Write capability, and hardware-accelerated AES-GCM decryption. The bootloader validates ECDSA signatures before installing updates, ensuring integrity and authenticity.
How many CAN FD channels does this MCU provide, and what is their data rate limit?
CYT3DLBBABQ1BZSGS integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015, supporting data rates up to 8 Mbps - subject to physical layer transceiver and topology limitations. Each channel has dedicated message RAM and filtering logic.
Is the MIPI CSI-2 interface capable of four-lane operation, and what is its maximum capture resolution?
Yes - the MIPI CSI-2 interface supports two- or four-lane configurations. In four-lane mode at 220 MHz, it captures up to 2880 × 1080 @ 30 fps, sufficient for high-resolution surround-view camera inputs without external image signal processors.
CYT3DLBBABQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBABQ1BZSGS FAQ
1.How can I place an order for CYT3DLBBABQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBABQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBABQ1BZSGS reliable?
The price and inventory of CYT3DLBBABQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBABQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT3DLBBABQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBABQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBABQ1BZSGS?
CYT3DLBBABQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBABQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBABQ1BZSGS?
For technical support, including CYT3DLBBABQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBABQ1BZSGS requirements.
6.How does Aetrix verify that CYT3DLBBABQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBABQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBABQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT3DLBBABQ1BZSGS?
All CYT3DLBBABQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBABQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBABQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT3DLBBABQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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