My Inquiry
My Account
Infineon Technologies CYT3DLBBABQ1BZSGST
- Part No.:
- CYT3DLBBABQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBABQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,492
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT3DLBBABQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety - deployed in automotive instrument clusters and HUD systems.
For engineers reviewing the CYT3DLBBABQ1BZSGST datasheet, CYT3DLBBABQ1BZSGST pinout, CYT3DLBBABQ1BZSGST application, or CYT3DLBBABQ1BZSGST equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping for HUD, FPD-Link video output (1920×720 @ 110 MHz), and hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC).
Technical Context
The device implements a heterogeneous dual-CPU architecture: the Cortex®-M7 handles primary application and graphics rendering, while the Cortex®-M0+ manages peripheral control, security boot, and ASIL-B safety monitoring. Hardware inter-processor communication enables deterministic message passing without software overhead.
Its graphics subsystem includes a command sequencer, composition engine, and drawing engine supporting frameless rendering; the sound subsystem integrates four TDM interfaces, two PCM-PWM ports, and dual audio mixers - all synchronized via shared clock domains and DMA routing across P-DMA0/P-DMA1 controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks |
| Memory | 4160 KB code-flash (RWW, dual-bank), 128 KB work-flash, 384 KB SRAM with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly display warping, and direct capture-to-display feed for HUD |
| Video I/O | FPD-Link single-lane output (1920×720 @ 110 MHz); MIPI CSI-2 2-/4-lane input (2880×1080 @ 220 MHz) |
| Networking | 4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 10/100 Mbps Ethernet MAC with IEEE-1588 PTP and AVB support |
| Safety & Security | ASIL-B certified; eSHE/HSM crypto engine with AES-128/192/256, SHA-256/512, ECC, TRNG, and SECDED ECC on flash/SRAM/TCM |
| Power Modes | Five low-power states (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with multi-pin wakeup and configurable BOD thresholds |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated supply with dedicated brown-out detection at 1.1 V threshold |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; monitored by BOD at 2.7 V / 3.0 V |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin debug port supporting Arm® SWD protocol and ETM instruction/data trace |
| ETH_RXD0–3 / ETH_TXD0–3 | Ethernet PHY data lanes | Supports MII/RMII physical layer interfacing with IEEE-802.3bw compliance |
| FPD_DATA[7:0] | FPD-Link video data bus | 8-bit parallel video output path for HD resolution (1920×720) at 110 MHz pixel clock |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Partitioning | Hardware-isolated Cortex®-M7 (application/graphics) and Cortex®-M0+ (peripheral/security) with dedicated TCM and inter-processor mailbox |
| HUD-Optimized Graphics | On-the-fly perspective warping and direct video feed-through eliminate frame buffer latency for head-up display projection |
| FOTA-Ready Flash | Dual-bank code-flash with Read-While-Write enables seamless over-the-air firmware updates without system interruption |
| Audio Synchronization | Four TDM interfaces + two PCM-PWM ports + dual audio mixers enable time-aligned multi-source audio processing for cockpit systems |
| Functional Safety Support | MPU, SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, and SECDED ECC on all safety-critical memories per ISO 26262 ASIL-B requirements |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards. IC Role / Device Role / Timing Role: Primary application MCU with graphics acceleration and CAN FD gateway for cluster ECU. Use Value: 240 MHz Cortex®-M7 + 2048 KB VRAM enables smooth 60 Hz UI animation and concurrent CAN FD message handling at 5 Mbps. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with geometric correction. IC Role / Device Role / Timing Role: Graphics controller with on-the-fly warping engine and FPD-Link video output driver. Use Value: Hardware-accelerated perspective transformation reduces CPU load and eliminates frame buffer memory bandwidth bottlenecks. |
| Automotive Audio Gateway | ADAS Domain Controller Interface |
Use Scenario: Aggregation and routing of audio streams from microphones, infotainment, and telematics modules. IC Role / Device Role / Timing Role: Audio subsystem hub with four TDM interfaces, dual mixers, and PCM-PWM outputs. Use Value: Synchronized audio sampling and playback across multiple sources using shared clock domain and hardware DMA routing. | Use Scenario: Bridging radar, camera, and ultrasonic sensors to central ADAS ECU via high-speed interfaces. IC Role / Device Role / Timing Role: High-bandwidth interface aggregator with 10/100 Mbps Ethernet MAC and 4× CAN FD channels. Use Value: IEEE-1588 PTP timestamping and AVB QoS ensure deterministic sensor data delivery with sub-microsecond jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 8 MB flash, supports CAN FD + Ethernet AVB | Lacks on-chip 2D/2.5D graphics and VRAM; requires external GPU for HUD/instrument cluster rendering | Select when graphics offload is handled externally and higher CPU clock speed is prioritized over integrated display pipeline |
| Renesas RH850/U2A | Dual-core (RH850 + RISC-V), 160 MHz, 4 MB flash, no crypto accelerator, no Ethernet MAC, supports CAN FD + LIN | No Ethernet or hardware graphics; focused on powertrain and chassis control rather than HMI-intensive domains | Select for ASIL-D powertrain applications where Ethernet and HUD rendering are not required |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBABQ1BZSGST uniquely integrates HUD-optimized graphics, FPD-Link output, and ASIL-B-certified dual-core security partitioning - making it purpose-built for automotive HMI systems requiring both real-time responsiveness and visual fidelity.
Availability
CYT3DLBBABQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, audio gateways, and ADAS interface modules requiring stable component supply across extended temperature ranges and long lifecycle commitments.
Supply support for CYT3DLBBABQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G family - designed specifically for automotive human-machine interface (HMI) systems requiring integrated graphics, audio, networking, and functional safety in a single SoC.
FAQ
What is the maximum display resolution supported by CYT3DLBBABQ1BZSGST via FPD-Link?
The device supports single-lane FPD-Link output at up to 1920×720 resolution with a 110 MHz pixel clock. This enables HD-ready HUD projection and instrument cluster displays without external timing controllers or frame buffers.
Does CYT3DLBBABQ1BZSGST support over-the-air (OTA) firmware updates?
Yes - its dual-bank code-flash architecture with Read-While-Write capability allows background firmware validation and atomic bank switching during runtime, enabling secure, zero-downtime OTA updates compliant with Uptane and AUTOSAR Secure Boot standards.
How many CAN FD channels does CYT3DLBBABQ1BZSGST integrate, and what is their data rate limit?
CYT3DLBBABQ1BZSGST integrates four independent CAN FD controllers, each supporting data rates up to 8 Mbps per ISO 11898-1:2015. Physical layer performance depends on transceiver selection and bus topology, but the controller itself meets non-ISO Bosch CAN FD v1.0 specifications.
Is the crypto engine in CYT3DLBBABQ1BZSGST certified for automotive security standards?
Yes - the hardware crypto engine supports Enhanced Secure Hardware Extension (eSHE) and Hardware Security Module (HSM) functionality, with AES-128/192/256, SHA-256/512, ECC, and TRNG. It underpins secure boot, key provisioning, and cryptographic services aligned with ISO/SAE 21434 and EVITA Medium Profile requirements.
CYT3DLBBABQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBABQ1BZSGST FAQ
1.How can I place an order for CYT3DLBBABQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBABQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBABQ1BZSGST reliable?
The price and inventory of CYT3DLBBABQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBABQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT3DLBBABQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBABQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBABQ1BZSGST?
CYT3DLBBABQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBABQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBABQ1BZSGST?
For technical support, including CYT3DLBBABQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBABQ1BZSGST requirements.
6.How does Aetrix verify that CYT3DLBBABQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBABQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBABQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT3DLBBABQ1BZSGST?
All CYT3DLBBABQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBABQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBABQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT3DLBBABQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT3DLBBABQ1BZSGST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
