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Infineon Technologies CYT3DLBBBBQ1BZSGS
- Part No.:
- CYT3DLBBBBQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBBBQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,054
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Product details
Overview
CYT3DLBBBBQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and FPD-Link video output for HUD and instrument cluster applications.
For engineers reviewing the CYT3DLBBBBQ1BZSGS datasheet, CYT3DLBBBBQ1BZSGS pinout, CYT3DLBBBBQ1BZSGS application, or CYT3DLBBBBQ1BZSGS equivalent, key selection criteria include ASIL-B functional safety compliance, on-the-fly graphics composition without frame buffers, secure boot with eSHE/HSM, dual-core inter-processor communication, and support for MIPI CSI-2 (4-lane, 2880 × 1080 @ 220 MHz) video capture.
Technical Context
The device implements a heterogeneous dual-CPU architecture: the Cortex®-M7 handles high-performance graphics rendering and application logic, while the Cortex®-M0+ manages peripheral control, security services, and real-time I/O tasks via hardware inter-processor communication. Memory subsystem includes Read-While-Write flash with dual-bank FOTA support and SECDED ECC on all safety-critical memories.
Graphics processing is offloaded to a dedicated subsystem with drawing engine, command sequencer, and composition engine-enabling HUD warping and direct video feed-through from MIPI CSI-2 or parallel RGB capture to FPD-Link output. The crypto engine delivers AES-128/192/256, SHA-256/512, RSA/ECC, and TRNG, certified for Enhanced Secure Hardware Extension (eSHE) and HSM use cases.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, with hardware IPC and separate TCMs |
| Memory | 4160 KB code-flash (RWW, dual-bank), 128 KB work-flash, 384 KB SRAM with configurable retention |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly warping, and no-framebuffer operation |
| Video I/O | FPD-Link single-lane output (1920 × 720 @ 110 MHz); MIPI CSI-2 4-lane input (2880 × 1080 @ 220 MHz) |
| Networking | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 1× 10/100 Mbps Ethernet MAC (IEEE-802.3bw, AVB/PTP) |
| Safety & Security | ASIL-B compliant; eSHE/HSM crypto engine with AES, SHA-2/3, RSA/ECC, TRNG, and SECDED ECC on flash/SRAM/TCM |
| Power Modes | Low-power Active, Sleep, DeepSleep, Hibernate; BOD at 2.7 V / 3.0 V (VDDD/VDDA_ADC), 1.1 V (VCCD) |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch. Pinout validated per Infineon CYT3DL datasheet Rev. *K (pp. 10–11, Peripheral Instance List & Block Diagram).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O power supply banks | Eight independent 1.7–5.5 V I/O domains enabling mixed-voltage interface operation |
| VDDD / VDDA_ADC | Digital core & ADC analog supply | 1.1 V nominal core rail; 2.7–5.5 V ADC reference with dual-threshold BOD detection |
| XTAL_IN / XTAL_OUT | External crystal oscillator input/output | Supports ECO (1–50 MHz) and WCO (32.768 kHz) for precise clocking and RTC accuracy |
| MDIO / MDC | Ethernet PHY management interface | Enables IEEE-802.3bw-compliant 10/100 Mbps Ethernet MAC configuration and status monitoring |
| CSI2_D0P–CSI2_D3P/N | MIPI CSI-2 differential data lanes | Four high-speed differential pairs supporting 220 MHz lane rate for 4-lane camera input |
| FPDLP0–FPDLP7 | FPD-Link parallel video data bus | 8-bit parallel LVDS-compatible interface for HD-resolution HUD display output |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | M7 handles graphics/audio/application; M0+ manages peripherals/security-hardware IPC eliminates software overhead |
| On-the-fly graphics composition | Direct video feed-through from capture to display with overlay, eliminating frame buffer memory and latency |
| FOTA-ready flash architecture | Dual-bank code-flash enables seamless over-the-air firmware updates without system interruption |
| ASIL-B functional safety support | MPU, SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, and SECDED ECC across all critical memories |
| Secure boot with hardware acceleration | eSHE/HSM crypto engine performs digital signature verification and fast secure boot using AES-GCM and SHA-256 |
Applications
| Automotive Instrument Clusters | Head-Up Displays (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD clusters with animated transitions. IC Role / Device Role / Timing Role: Primary application processor with integrated graphics engine and CAN FD gateway for sensor fusion data ingestion. Use Value: Eliminates external GPU; 240 MHz M7 + VRAM enables smooth 60 Hz UI updates with 2.5D warping and alpha blending. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with geometric correction for driver eye position. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and direct MIPI-to-FPD-Link feed-through. Use Value: On-the-fly warping avoids frame buffering; FPD-Link output drives DLP/LCoS projector at 1920 × 720 @ 110 MHz. |
| Automotive Audio Video Bridging (AVB) | Secure Gateway Modules |
Use Scenario: Time-synchronized audio streaming across multiple ECUs in premium infotainment systems using IEEE-1722/1588. IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-802.1BA AVB and IEEE-1588 PTP support acts as AVB endpoint node. Use Value: Hardware timestamping and traffic shaping ensure sub-10 µs jitter for multi-channel PCM audio transport. | Use Scenario: Isolating and routing CAN FD, LIN, and Ethernet traffic between domain controllers with cryptographic integrity checks. IC Role / Device Role / Timing Role: Dual-core architecture separates gateway protocol stack (M0+) from security validation (M7 + HSM). Use Value: eSHE-accelerated AES-GCM and SHA-256 enable authenticated message forwarding at line rate (8 Mbps CAN FD). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports CAN FD + Ethernet but lacks MIPI CSI-2 or FPD-Link | Targeted at body control and gateway functions-not HUD/instrument cluster graphics rendering | Select when graphics acceleration is unnecessary and higher CPU clock speed or larger flash is prioritized |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), ASIL-D capable, no 2D graphics engine, supports CAN FD + Ethernet but no MIPI or FPD-Link interfaces | Focused on powertrain and chassis control; lacks video I/O required for display-centric applications | Select for ASIL-D safety-critical control tasks where display integration is handled by external SoC |
Compared with S32K344 and RH850/U2A, CYT3DLBBBBQ1BZSGS uniquely integrates HUD-optimized graphics, MIPI CSI-2 capture, and FPD-Link output-making it the only option among the three qualified for standalone automotive display controller applications requiring ASIL-B compliance and secure boot.
Availability
CYT3DLBBBBQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, AVB audio endpoints, and secure gateway modules requiring stable component supply, long lifecycle support, and ASIL-B certification.
Supply support for CYT3DLBBBBQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G family-designed specifically for automotive human-machine interface (HMI) applications demanding integrated graphics, real-time audio/video processing, and functional safety up to ASIL-B.
FAQ
What is the maximum resolution supported by the FPD-Link interface?
The FPD-Link interface supports single-lane output up to 1920 × 720 pixels at 110 MHz pixel clock, sufficient for HD-resolution HUD projection. This is confirmed in the datasheet Section 1.1 (Peripheral Instance List) and Figure 3-1 (Block Diagram), where FPD-Link is mapped to the Display Engine output path with timing generator support for standard video formats.
Does CYT3DLBBBBQ1BZSGS support MIPI CSI-2 with four data lanes?
Yes-it supports two- or four-lane MIPI CSI-2 with maximum capture resolution of 2880 × 1080 at 220 MHz lane rate. This capability is explicitly stated in the "Capture engine" feature list (Datasheet p.2) and validated in Table 1-1 (Peripheral Instance List), which lists "MIPI CSI-2 (4-lane)" as an available instance.
Is the crypto engine enabled on this specific part number?
Yes-CYT3DLBBBBQ1BZSGS includes the full crypto engine per datasheet Note 1 and Section 3.1.6, supporting AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and GCM. The part number suffix "BZSGS" corresponds to the BGA package variant with eSHE/HSM features enabled, as documented in Infineon's MPN cross-reference guide.
What power modes support wake-up from DeepSleep using GPIO?
Up to 61 GPIO pins can serve as wake sources from DeepSleep mode, as specified in the "Low-power" feature section (Datasheet p.3). These include GPIO_STD, GPIO_ENH, and GPIO_SMC types-each configurable with interrupt edge sensitivity and debouncing, and mapped to the Event Generator (EVTGEN) module for low-latency wakeup response.
CYT3DLBBBBQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBBBQ1BZSGS FAQ
1.How can I place an order for CYT3DLBBBBQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBBBQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBBBQ1BZSGS reliable?
The price and inventory of CYT3DLBBBBQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBBBQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT3DLBBBBQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBBBQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBBBQ1BZSGS?
CYT3DLBBBBQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBBBQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBBBQ1BZSGS?
For technical support, including CYT3DLBBBBQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBBBQ1BZSGS requirements.
6.How does Aetrix verify that CYT3DLBBBBQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBBBQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBBBQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT3DLBBBBQ1BZSGS?
All CYT3DLBBBBQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBBBQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBBBQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT3DLBBBBQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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