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Infineon Technologies CYT3DLBBBBQ1BZSGST
- Part No.:
- CYT3DLBBBBQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBBBQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,967
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Product details
Overview
CYT3DLBBBBQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety - deployed in automotive instrument clusters and HUD systems.
For engineers reviewing the CYT3DLBBBBQ1BZSGST datasheet, CYT3DLBBBBQ1BZSGST pinout, CYT3DLBBBBQ1BZSGST application, or CYT3DLBBBBQ1BZSGST equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping for HUD, FPD-Link video output (1920×720 @ 110 MHz), secure boot with eSHE/HSM, and 135 GPIOs with stepper motor control capability.
Technical Context
The device implements hardware-isolated inter-processor communication between its Cortex-M7 (primary compute) and Cortex-M0+ (peripheral/security management) cores, enabling deterministic real-time response and secure firmware updates. Its graphics subsystem includes dedicated drawing, composition, and command sequencer engines - all operating without frame buffers via direct video feed-through from MIPI CSI-2 or RGB capture to parallel RGB/FPD-Link output.
The safety architecture integrates SECDED ECC on flash, SRAM, and TCM; SMPU/PPU/MPU enforcement; and multi-level BOD (2.7 V / 3.0 V / 1.1 V) with wake-up support across five power modes. Crypto acceleration covers AES-128/192/256, SHA-256/512, RSA/ECC, and GCM authenticated encryption - all accessible via HSM-compliant APIs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of graphics/audio processing from security/peripheral control. |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention - supports concurrent execution and field update. |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly display warping, and direct capture-to-display path - eliminates external frame buffer for HUD latency reduction. |
| Video I/O | FPD-Link single-lane (1920×720 @ 110 MHz) + Parallel RGB (800×600 @ 40 MHz); MIPI CSI-2 2-/4-lane input (up to 2880×1080 @ 220 MHz). |
| Networking | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 12× reconfigurable SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, IEEE-802.3bw 10/100 Mbps Ethernet MAC with AVB/PTP support. |
| Safety & Security | ASIL-B compliant; SECDED ECC on all safety-critical memories; eSHE/HSM crypto engine with AES/SHA/RSA/ECC/TRNG; secure boot via digital signature verification. |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch - optimized for automotive EMI resilience and thermal dissipation in instrument cluster PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input with dedicated BOD threshold (1.1 V) for precision analog acquisition stability. |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; supports low-power active/deepsleep modes. |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–40 MHz crystals for precise clock sourcing; used with ECO for system timing and CAN FD bit rate accuracy. |
| ETH_RXD0–3 / ETH_TXD0–3 | Ethernet PHY data lanes | RMII/MII interface pins enabling IEEE-802.1BA AVB and IEEE-1588 PTP synchronization in connected vehicle networks. |
| CSI2_D0P/D0N – D3P/D3N | MIPI CSI-2 differential data lanes | Four-lane high-speed camera interface supporting up to 2880×1080 @ 220 MHz for surround-view or driver-monitoring systems. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Partitioning | Hardware-enforced isolation between Cortex-M7 (graphics/audio/application) and Cortex-M0+ (CAN FD/LIN/CXPI/secure boot) enables ASIL-B compliance and deterministic scheduling. |
| On-the-Fly Graphics Rendering | Command sequencer + drawing engine render vector graphics directly to display without frame buffer - reduces memory bandwidth and latency critical for HUD projection. |
| Firmware Update Over-The-Air (FOTA) | Dual-bank flash architecture with RWW allows background firmware validation and atomic swap - essential for zero-downtime ECU updates in production vehicles. |
| Smart I/O Boolean Logic | Configurable logic block on up to eight GPIO_STD pins performs real-time signal conditioning (AND/OR/XOR) without CPU intervention - offloads timing-critical sensor preprocessing. |
| Audio Subsystem Integration | Four TDM + two PCM-PWM interfaces, five sound generator channels, and dual audio mixers enable multi-zone audio processing and HUD voice feedback without external codecs. |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards with animated transitions. IC Role / Device Role / Timing Role: Primary application processor with integrated graphics engine, driving parallel RGB interface at 40 MHz while managing CAN FD bus telemetry. Use Value: Eliminates external GPU and DDR memory; 2048 KB VRAM + on-the-fly composition enables smooth 60 Hz UI updates with <5 ms latency. | Use Scenario: Projection of speed, lane departure, and collision warnings onto windshield using LCoS or DLP optics with geometric correction. IC Role / Device Role / Timing Role: Graphics controller performing real-time perspective warping and overlay compositing on captured camera/video streams. Use Value: Integrated warping engine applies pixel-level distortion correction in hardware - avoids software-based GPU load and ensures sub-frame timing consistency. |
| Connected Vehicle Gateway | Driver Monitoring System (DMS) |
Use Scenario: Aggregating and routing data across CAN FD, LIN, CXPI, and Ethernet domains in zone controllers or central gateways. IC Role / Device Role / Timing Role: Network bridge with time-synchronized packet forwarding using IEEE-1588 PTP and AVB-aware Ethernet MAC. Use Value: Hardware timestamping and priority queuing ensure <100 µs jitter for safety-critical actuator commands across heterogeneous buses. | Use Scenario: Capturing and preprocessing facial video from infrared cameras for drowsiness and distraction detection. IC Role / Device Role / Timing Role: Vision front-end with MIPI CSI-2 4-lane input (2880×1080 @ 220 MHz), SAR ADC for ambient light sensing, and smart I/O for IR LED control. Use Value: On-chip capture engine and programmable GPIO logic reduce external components and enable synchronized IR illumination gating at 60 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports ASIL-D via lockstep cores. | Targeted at safety-critical body control modules; lacks HUD-optimized display warping and VRAM. | Select when highest functional safety (ASIL-D) is required over graphics capability. |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), 12 MB flash, no GPU, but deeper ASIL-B/B+ peripheral safety mechanisms. | Focused on powertrain and chassis control; no video I/O or audio subsystem integration. | Prefer for engine control units where deterministic interrupt latency outweighs multimedia features. |
Compared with S32K344 and RH850/U2A, CYT3DLBBBBQ1BZSGST uniquely combines dual-core real-time partitioning, on-the-fly HUD warping, and integrated audio/video I/O - making it optimal for cost-sensitive, graphics-intensive automotive displays rather than pure safety or powertrain roles.
Availability
CYT3DLBBBBQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, connected vehicle gateways, and driver monitoring systems requiring stable component supply across extended temperature ranges (−40°C to +125°C).
Supply support for CYT3DLBBBBQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for human-machine interface (HMI) applications demanding integrated graphics, audio, networking, and ASIL-B safety in compact form factors.
FAQ
What is the maximum resolution supported by the FPD-Link interface?
The FPD-Link single-lane interface supports up to 1920×720 pixels at 110 MHz pixel clock, sufficient for HD-wide automotive displays. This is confirmed in the TRAVEO™ T2G datasheet Section 1.1 (Peripheral Instance List) and validated against Infineon's official package-specific timing tables for CYT3DLBBBBQ1BZSGST.
Does CYT3DLBBBBQ1BZSGST support secure boot with cryptographic signature verification?
Yes - it implements fast secure boot using digital signature verification (ECDSA or RSA) via its integrated Hardware Security Module (HSM) and Enhanced Secure Hardware Extension (eSHE). Boot image authenticity is verified before execution, with keys stored in one-time-programmable eFuses.
How many CAN FD channels does this MCU provide, and what is their data rate limit?
CYT3DLBBBBQ1BZSGST integrates four independent CAN FD controllers compliant with ISO 11898-1:2015, supporting data rates up to 8 Mbps. The actual achievable rate depends on physical layer transceivers and network topology, as specified in Infineon's TRAVEO™ T2G communication interface documentation.
Is the MIPI CSI-2 interface capable of four-lane operation, and what is its maximum capture resolution?
Yes - the MIPI CSI-2 interface supports two- or four-lane configurations. In four-lane mode, it achieves up to 2880×1080 resolution at 220 MHz, enabling high-fidelity camera input for surround-view or driver monitoring systems, per the TRAVEO™ T2G datasheet Table 1-1 and Section 3.3.11.
CYT3DLBBBBQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBBBQ1BZSGST FAQ
1.How can I place an order for CYT3DLBBBBQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBBBQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBBBQ1BZSGST reliable?
The price and inventory of CYT3DLBBBBQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBBBQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT3DLBBBBQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBBBQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBBBQ1BZSGST?
CYT3DLBBBBQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBBBQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBBBQ1BZSGST?
For technical support, including CYT3DLBBBBQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBBBQ1BZSGST requirements.
6.How does Aetrix verify that CYT3DLBBBBQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBBBQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBBBQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT3DLBBBBQ1BZSGST?
All CYT3DLBBBBQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBBBQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBBBQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT3DLBBBBQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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