My Inquiry
My Account
Infineon Technologies CYT3DLBBCBQ1BZSGS
- Part No.:
- CYT3DLBBCBQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBCBQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,573
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT3DLBBCBQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety compliance. It targets instrument clusters and head-up displays (HUD) with on-the-fly display warping, VRAM-backed rendering, and secure boot via hardware crypto engine.
For engineers reviewing the CYT3DLBBCBQ1BZSGS datasheet, CYT3DLBBCBQ1BZSGS pinout, CYT3DLBBCBQ1BZSGS application, or CYT3DLBBCBQ1BZSGS equivalent, key selection criteria include dual-core real-time partitioning, FPD-Link video output (1920×720 @ 110 MHz), 4160 KB code-flash with RWW, 135 GPIOs, and HSM-enabled secure firmware update over CAN FD or Ethernet.
Technical Context
The device implements hardware-isolated processing: the Cortex-M7 handles graphics-intensive HUD rendering and application logic, while the Cortex-M0+ manages peripheral control, security services (eSHE/HSM), and ASIL-B safety monitors including SMPU, PPU, SECDED ECC on SRAM/flash/TCM, and multi-counter watchdog timers. Clock domain separation ensures deterministic timing for safety-critical tasks.
Its graphics subsystem includes a command sequencer, drawing engine, composition engine, and display engine-enabling frame-bufferless rendering, direct capture-to-display feed-through, and real-time perspective warping without external GPU. Video I/O supports MIPI CSI-2 (2/4-lane), ITU-R BT.656, parallel RGB, and single-channel FPD-Link output at HD resolution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 (with FPU, 16 KB I/D cache) + 100 MHz Cortex®-M0+ |
| Graphics Memory | 2048 KB embedded VRAM for layer composition and on-the-fly rendering without external frame buffer |
| Video Output | FPD-Link single interface supporting 1920×720 @ 110 MHz for HUD projection |
| Communication | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with AVB/PTP |
| Security | HSM-compliant crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, GCM, secure boot with digital signature verification |
| Memory | 4160 KB code-flash (RWW, dual-bank for FOTA), 128 KB work-flash, 384 KB SRAM with retention granularity |
| Safety | ASIL-B compliant: SECDED ECC on all safety-critical memories, SMPU/PPU/MPU, MCWDT, LVD/BOD/OVD/OCD, CSV |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input; supports dual BOD thresholds (2.7 V / 3.0 V) for robust analog sensing |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; enables wide-input automotive operation |
| ETH_RXD[3:0] | Ethernet receive data | 4-bit RMII/MII interface supporting IEEE-802.3bw 10/100 Mbps with AVB/PTP timestamping |
| CANFD0_TX | CAN FD channel 0 transmit | Differential output compliant with ISO 11898-1:2015; supports non-ISO CAN FD V1.0 protocol extensions |
| FPDLP_DATA[7:0] | FPD-Link parallel data bus | 8-bit LVDS-compatible data path for HD video output (1920×720 @ 110 MHz) to HUD display driver |
| GPIO_SMC[5:0] | Stepper motor control I/O | 6 dedicated pins with ZPD and slew rate control for driving stepper motors in cluster gauge applications |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated perspective correction for curved HUD optics without CPU load or frame buffer |
| Dual-bank flash with RWW | Enables seamless FOTA updates: execute from Bank A while programming Bank B, eliminating system downtime |
| Hardware inter-processor communication | Dedicated mailbox and semaphore units enable deterministic, low-latency M7↔M0+ messaging for safety-critical task delegation |
| MIPI CSI-2 capture (4-lane) | Supports 2880×1080 @ 220 MHz input for high-resolution rear-view camera integration in digital clusters |
| Audio mixing with 5-stream input | Two PCM mixers accept up to five concurrent audio sources (e.g., navigation voice, chimes, media) for synchronized HUD audio feedback |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Digital gauge cluster with animated speedometers, fuel indicators, ADAS warnings, and customizable UI layouts. IC Role / Device Role / Timing Role: Primary application processor and graphics controller; renders vector-based gauges and overlays using TCPWM-synchronized PWM for LED backlight dimming. Use Value: 240 MHz M7 core executes UI framework at >60 FPS; VRAM and composition engine enable smooth layer transitions without external memory bandwidth bottleneck. | Use Scenario: Projection-based HUD showing speed, navigation arrows, and collision alerts onto windshield with optical distortion correction. IC Role / Device Role / Timing Role: Real-time graphics engine with on-the-fly warping; FPD-Link output drives HUD display driver with precise pixel timing and jitter-free sync. Use Value: Hardware warping eliminates need for external FPGA/GPU; reduces BOM cost and latency vs software-based correction. |
| Rear-View Camera Processing | Secure Gateway Node |
Use Scenario: High-resolution camera input (1920×1080) processed for parking assist with dynamic grid overlay and object highlighting. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver + graphics engine + TCPWM-driven overlay generator; captures and composites video in real time. Use Value: 4-lane CSI-2 supports 2880×1080 @ 220 MHz; direct capture-to-display feed-through avoids frame buffer latency for <100 ms end-to-end response. | Use Scenario: In-vehicle gateway managing CAN FD, LIN, and Ethernet traffic between domain controllers with secure firmware update capability. IC Role / Device Role / Timing Role: Secure network bridge with HSM-enforced authentication; routes messages between domains while verifying signatures on OTA updates. Use Value: Crypto engine performs AES-GCM decryption and ECDSA signature verification inline; prevents unauthorized firmware injection during FOTA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 2× CAN FD, no FPD-Link output | Targeted at body control modules and gateway nodes-not HUD/instrument cluster graphics rendering | Select when graphics acceleration and display interfaces are unnecessary; prioritize higher CPU clock and larger RAM over visual subsystems |
| Renesas RH850/U2A | 32-bit RXv3 core (200 MHz), ASIL-D capable, 3× CAN FD, no Ethernet MAC, no VRAM or graphics engine | Focused on powertrain and chassis control; lacks video I/O and secure boot crypto acceleration | Choose for ASIL-D safety-critical engine management where display functionality is absent and deterministic interrupt latency is paramount |
Compared with S32K344 and RH850/U2A, CYT3DLBBCBQ1BZSGS uniquely integrates HUD-optimized graphics hardware, FPD-Link output, and HSM-grade crypto in a single ASIL-B package-making it the only option among the three for cost-sensitive, graphics-intensive automotive displays requiring secure over-the-air updates.
Availability
CYT3DLBBCBQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, rear-view camera systems, and secure gateway nodes requiring stable component supply across extended vehicle lifecycles.
Supply support for CYT3DLBBCBQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.
The TRAVEO™ T2G product line is designed specifically for automotive human-machine interface (HMI) applications-delivering integrated graphics, audio, networking, and functional safety in a single-chip solution for digital cockpits.
FAQ
Does CYT3DLBBCBQ1BZSGS support booting from external QSPI flash?
Yes, it supports Execute-in-Place (XIP) from external memory via the Serial Memory Interface (SMIF), which includes dual SPI channels with octal/xSPI capability and on-the-fly encryption/decryption. This enables secure execution of firmware directly from external flash without loading into internal RAM, reducing boot time and memory footprint.
What is the maximum resolution supported by the MIPI CSI-2 interface?
The MIPI CSI-2 interface supports up to 2880×1080 at 220 MHz using four lanes, as confirmed in the TRAVEO™ T2G datasheet Rev. *K. This enables full HD+ rear-view or surround-view camera input with minimal latency for real-time processing in digital clusters.
How does the dual-core architecture handle real-time safety monitoring?
The Cortex-M0+ runs dedicated safety firmware that continuously monitors M7 execution via hardware mailboxes, checks memory integrity using SECDED ECC, validates peripheral access through PPU, and triggers fail-safe responses via MCWDT-ensuring ASIL-B compliance without compromising M7 performance for application tasks.
Is the FPD-Link interface compatible with standard automotive display drivers?
Yes, the single-channel FPD-Link interface complies with industry-standard LVDS signaling and timing requirements for automotive HUD drivers. It delivers 1920×720 pixels at 110 MHz with embedded sync signals, matching common HUD display controller inputs without requiring level-shifting or protocol translation.
CYT3DLBBCBQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBCBQ1BZSGS FAQ
1.How can I place an order for CYT3DLBBCBQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBCBQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBCBQ1BZSGS reliable?
The price and inventory of CYT3DLBBCBQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBCBQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT3DLBBCBQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBCBQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBCBQ1BZSGS?
CYT3DLBBCBQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBCBQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBCBQ1BZSGS?
For technical support, including CYT3DLBBCBQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBCBQ1BZSGS requirements.
6.How does Aetrix verify that CYT3DLBBCBQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBCBQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBCBQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT3DLBBCBQ1BZSGS?
All CYT3DLBBCBQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBCBQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBCBQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT3DLBBCBQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT3DLBBCBQ1BZSGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
