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Infineon Technologies CYT3DLBBCBQ1BZSGST
- Part No.:
- CYT3DLBBCBQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBCBQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,858
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Product details
Overview
CYT3DLBBCBQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), 4160 KB code-flash, 384 KB SRAM, integrated 2D/2.5D graphics engine with 2048 KB VRAM, and CAN FD, Ethernet MAC, and LIN interfaces. It targets instrument clusters and HUD systems requiring real-time graphics rendering, audio processing, and functional safety.
For engineers reviewing the CYT3DLBBCBQ1BZSGST datasheet, CYT3DLBBCBQ1BZSGST pinout, CYT3DLBBCBQ1BZSGST application, or CYT3DLBBCBQ1BZSGST equivalent, this MCU delivers verified ASIL-B compliance, on-the-fly display warping for HUDs, dual-core inter-processor communication, and hardware-accelerated crypto including AES-256, ECC, and SHA-512.
Technical Context
The device integrates a dedicated graphics subsystem with command sequencer, drawing engine, composition engine, and display timing generation-enabling frameless rendering and direct video feed-through from MIPI CSI-2 or RGB capture to FPD-Link output. Its sound subsystem includes four TDM, two PCM-PWM, five SG, and dual PCM mixers feeding a DAC.
The CPU subsystem uses tightly coupled memories (64 KB ITCM/64 KB DTCM), dual DMA controllers (P-DMA0: 76 channels; P-DMA1: 84 channels), and hardware inter-processor messaging. Safety features include SECDED ECC on all safety-critical memories, SMPU, PPU, MCWDT, and BOD with dual thresholds (2.7 V / 3.0 V) on VDDD/VDDA_ADC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling primary compute and secure peripheral management in parallel |
| Memory | 4160 KB code-flash (RWW, dual-bank), 128 KB work-flash, 384 KB SRAM with selectable retention granularity |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly warping, and direct capture-to-display path for HUDs |
| Video I/O | FPD-Link single (1920×720 @ 110 MHz); MIPI CSI-2 (2-/4-lane, up to 2880×1080 @ 220 MHz); ITU656/RGB capture |
| Communication | 4× CAN FD (up to 8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with AVB/PTP support |
| Security | HSM with eSHE, AES-128/192/256, RSA/ECC, SHA-1/2/3, TRNG, GCM, and secure boot via digital signature verification |
| Safety | ASIL-B compliant with SECDED ECC on flash/SRAM/TCM, SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, and CSV |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD, VDDA_ADC, VCCD | Power supply inputs | Core (1.1 V), analog ADC (2.7–5.5 V), and digital domain supplies with independent BOD thresholds |
| GPIO[0:134] | Programmable I/O banks | 135 total pins supporting GPIO_STD, GPIO_ENH, GPIO_SMC, and HSIO_STDLN modes with wakeup capability |
| TCPWM[0:49], TCPWM_H[0:11] | PWM/timer outputs | 62 total timer/PWM blocks-including 12 motor-control-optimized counters with ZPD and slew rate control |
| CANFD[0:3]_TX/RX | CAN FD transceiver interface | Four differential CAN FD channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 non-ISO |
| ETH_MII/RMII | Ethernet PHY interface | Configurable 10/100 Mbps MAC supporting MII or RMII, IEEE-802.1BA (AVB) and IEEE-1588 (PTP) |
| MIPI_CSI[0:1]_CLK/DATA[0:3] | MIPI CSI-2 receiver | Two-lane or four-lane camera interface supporting up to 2880×1080 @ 220 MHz with embedded clock recovery |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated geometric correction for HUD projection without frame buffer overhead or CPU intervention |
| Dual-core inter-processor communication | Dedicated hardware mailbox and shared memory with MPU/SMPU protection enabling deterministic M7/M0+ task partitioning |
| Firmware update Over-The-Air (FOTA) | Dual-bank flash architecture with RWW support allows seamless background firmware updates without system interruption |
| Smart I/O logic block | Boolean combinational logic engine operating on up to eight GPIO_STD pins for autonomous signal conditioning and edge detection |
| Audio stream mixing | Two dedicated PCM mixers accepting five input streams each, enabling multi-source audio routing before DAC conversion |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD or OLED dash displays. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant GUI stack while managing CAN FD bus traffic and sensor fusion. Use Value: 240 MHz Cortex®-M7 with 64 KB ITCM/64 KB DTCM ensures deterministic frame rendering at 60 Hz; 2048 KB VRAM eliminates external graphics memory. | Use Scenario: Projection of augmented reality overlays onto windshield with dynamic perspective correction based on driver position and road geometry. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time warping and layer composition; M0+ handles secure boot and CAN/LIN gateway functions. Use Value: Hardware warping engine reduces M7 load by >70%; FPD-Link output supports 1920×720 @ 110 MHz for high-fidelity optical projection. |
| Automotive Audio Gateway | ADAS Sensor Fusion Hub |
Use Scenario: Aggregating audio streams from microphones, infotainment head unit, and telematics module for voice assistant and noise cancellation. IC Role / Device Role / Timing Role: Sound subsystem processes four TDM and two PCM-PWM inputs; M0+ manages secure audio routing policies. Use Value: Dual PCM mixers with five-stream inputs enable concurrent voice pickup, ANC, and alert playback; integrated DAC avoids external audio codec. | Use Scenario: Time-synchronized acquisition and preprocessing of radar, camera, and ultrasonic sensor data for lane-keeping and AEB decision logic. IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-1588 PTP provides sub-microsecond timestamp alignment across sensors; TCPWM blocks generate precise trigger pulses. Use Value: Hardware PTP timestamping enables <1 µs sensor time skew; 12 motor-control timers support synchronized actuator control for steering/braking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and connectivity applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, 2 MB SRAM, 3× CAN FD, no MIPI CSI-2 or FPD-Link | Targeted at ECU control and gateway functions-not HUD/instrument cluster graphics rendering | Select when graphics acceleration and display interfaces are unnecessary and higher flash/SRAM density is prioritized |
| Renesas RH850/U2A | 32-bit proprietary core (400 MHz), no Arm® architecture, no GPU or VRAM, 4 MB flash, 1.5 MB SRAM, 6× CAN FD, no Ethernet MAC or MIPI CSI-2 | Optimized for powertrain and chassis control with deterministic real-time response-not multimedia or display subsystems | Select for ASIL-D powertrain applications where Arm® ecosystem compatibility and graphics are not required |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBCBQ1BZSGST uniquely integrates a full graphics pipeline, MIPI CSI-2 capture, FPD-Link output, and dual-core security partitioning-making it the only option among the three qualified for HUD and digital instrument cluster SoC replacement.
Availability
CYT3DLBBCBQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, and ADAS sensor fusion hubs requiring stable component supply, long lifecycle commitment, and ASIL-B certified silicon.
Supply support for CYT3DLBBCBQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.
This part belongs to the TRAVEO™ T2G family-designed specifically for automotive human-machine interface (HMI) applications demanding integrated graphics, audio, safety, and high-speed connectivity in a single SoC.
FAQ
What is the maximum display resolution supported by CYT3DLBBCBQ1BZSGST?
The device supports up to 1920×720 at 110 MHz via its single-channel FPD-Link interface and 800×600 at 40 MHz via parallel RGB. For HUD applications, on-the-fly warping enables distortion-corrected projection beyond native resolution limits using internal VRAM and composition engine.
Does CYT3DLBBCBQ1BZSGST support secure boot with cryptographic verification?
Yes-it implements fast secure boot with digital signature verification using RSA/ECC keys stored in OTP eFuse. The HSM validates firmware images against public keys before execution, and AES-GCM ensures authenticated encryption of code-flash updates during FOTA operations.
How many CAN FD interfaces does CYT3DLBBCBQ1BZSGST provide, and what is their data rate capability?
The MCU integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 non-ISO. Each supports configurable bit rates up to 8 Mbps in the data phase, subject to physical layer transceiver and topology constraints.
Is MIPI CSI-2 video capture supported, and what configurations are available?
Yes-the device includes a dedicated MIPI CSI-2 receiver supporting two- or four-lane operation. Two-lane mode achieves up to 1920×720 @ 110 MHz; four-lane mode supports 2880×1080 @ 220 MHz with embedded clock recovery and automatic lane synchronization.
CYT3DLBBCBQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBCBQ1BZSGST FAQ
1.How can I place an order for CYT3DLBBCBQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBCBQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBCBQ1BZSGST reliable?
The price and inventory of CYT3DLBBCBQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBCBQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT3DLBBCBQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBCBQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBCBQ1BZSGST?
CYT3DLBBCBQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBCBQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBCBQ1BZSGST?
For technical support, including CYT3DLBBCBQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBCBQ1BZSGST requirements.
6.How does Aetrix verify that CYT3DLBBCBQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBCBQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBCBQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT3DLBBCBQ1BZSGST?
All CYT3DLBBCBQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBCBQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBCBQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT3DLBBCBQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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