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Infineon Technologies CYT3DLBBDBQ1BZSGS
- Part No.:
- CYT3DLBBDBQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBDBQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:1,037
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Product details
Overview
CYT3DLBBDBQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety for instrument cluster and HUD systems.
For engineers reviewing the CYT3DLBBDBQ1BZSGS datasheet, CYT3DLBBDBQ1BZSGS pinout, CYT3DLBBDBQ1BZSGS application, or CYT3DLBBDBQ1BZSGS equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping for HUD, secure boot with eSHE/HSM, FPD-Link video output (1920×720 @ 110 MHz), and hardware-accelerated vector graphics rendering without frame buffers.
Technical Context
The device implements hardware-isolated processing: Cortex®-M7 handles graphics, audio, and application logic with 16 KB I-cache/16 KB D-cache and 64 KB TCM per core; Cortex®-M0+ manages peripheral control, security services, and ASIL-B safety monitors including SMPU, PPU, and SECDED ECC on flash/SRAM/TCM. Inter-processor communication uses dedicated hardware mailboxes.
Graphics subsystem includes command sequencer, composition engine, drawing engine, and display engine - enabling real-time HUD warping, direct capture-to-display feed-through, and layer-based scene composition. Audio path integrates four TDM, two PCM-PWM, five SG interfaces, and dual 5-input PCM mixers feeding one DAC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and rich UI tasks |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly warping, and no-framebuffer operation for HUD latency reduction |
| Video I/O | FPD-Link single-lane output (1920×720 @ 110 MHz); MIPI CSI-2 2-/4-lane input (2880×1080 @ 220 MHz) |
| Networking | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 10/100 Mbps Ethernet MAC with IEEE-1588 PTP and AVB support |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, GCM, and fast secure boot with digital signature verification |
| Safety | ASIL-B compliant: MPU/SMPU/PPU, SECDED ECC on all safety-critical memories, MCWDT, LVD/BOD/OVD/OCD, CSV |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated supply with dedicated BOD threshold (1.1 V) for analog accuracy and fault detection |
| VDDD | Digital core supply | 1.1 V nominal core rail with dual BOD thresholds (2.7 V / 3.0 V) for flexible low-power mode entry/exit |
| SWDIO/SWCLK | Serial Wire Debug interface | Two-pin debug port supporting full ETM instruction/data trace and secure firmware update via SWD |
| ETH_RXD[3:0]/TXD[3:0] | Ethernet PHY data lanes | RMII/MII interface pins enabling IEEE-802.3bw-compliant 10/100 Mbps connectivity with AVB/PTP timing precision |
| FPD_DATA[7:0]/CLK | FPD-Link video output | Single-lane LVDS-compatible interface driving HD displays (1920×720) at 110 MHz pixel clock for HUD projection |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | M7 handles graphics/audio/UI; M0+ runs safety monitors, crypto, and peripheral stacks - eliminating software partitioning overhead |
| On-the-fly HUD warping | Hardware-accelerated perspective transformation applied during video output generation - eliminates GPU memory bandwidth bottleneck |
| Secure boot with eSHE | Hardware-enforced chain-of-trust using ECDSA-signed images and immutable root key in OTP - prevents unauthorized firmware execution |
| FOTA-ready flash architecture | Dual-bank code-flash with RWW enables seamless background firmware updates without system interruption or external memory |
| ASIL-B safety mechanisms | Integrated SMPU/PPU, SECDED ECC on TCM/SRAM/flash, and redundant watchdogs meet ISO 26262 requirements without external safety MCU |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, ADAS alerts, and navigation overlays on TFT-LCD clusters. IC Role / Device Role / Timing Role: Primary application processor with deterministic graphics pipeline and safety-monitored M0+ co-processor. Use Value: 240 MHz M7 + 2048 KB VRAM enables 60 fps rendering of layered gauges and vector graphics without external DRAM. | Use Scenario: Projection of vehicle speed, lane departure, and AR navigation onto windshield via optical combiner. IC Role / Device Role / Timing Role: Graphics engine with hardware warping and direct capture-to-display feed-through for sub-16 ms end-to-end latency. Use Value: On-the-fly perspective correction eliminates need for external FPGA or GPU, reducing BOM cost and thermal load. |
| Automotive Audio Gateway | Central Domain Controller |
Use Scenario: Aggregation and routing of audio streams from microphones, infotainment, and ADAS alerts across TDM/PCM-PWM interfaces. IC Role / Device Role / Timing Role: Audio subsystem hub with dual 5-input PCM mixers, one DAC, and four TDM ports synchronized to master clock domain. Use Value: Integrated audio mixing and conversion avoids external codecs, simplifying layout and meeting ASIL-B timing constraints. | Use Scenario: Centralized control of CAN FD, LIN, CXPI, and Ethernet networks in zonal E/E architectures. IC Role / Device Role / Timing Role: Network convergence node with 4× CAN FD, 2× LIN, 2× CXPI, and 10/100 Mbps Ethernet MAC with IEEE-1588 timestamping. Use Value: Single-chip integration reduces interconnect complexity and enables precise time-synchronized diagnostics across domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and networking applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K388 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, 2 MB SRAM, 3× CAN FD, no Ethernet MAC | Targeted at body control and gateway functions - lacks HUD warping, VRAM, and FPD-Link output | Select when graphics acceleration and display output are unnecessary, and higher CPU clock speed is prioritized over visual subsystem integration |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), no Arm architecture, 4 MB flash, 1.5 MB SRAM, 6× CAN FD, no graphics or Ethernet | Optimized for powertrain and chassis control - no video I/O, audio subsystem, or ASIL-B graphics pipeline | Select for legacy AUTOSAR-based powertrain applications requiring high determinism but no human-machine interface features |
Compared with S32K388 and RH850/U2A, CYT3DLBBDBQ1BZSGS uniquely delivers integrated HUD-grade graphics, FPD-Link output, and Ethernet AVB/PTP - making it the only option among the three capable of replacing discrete GPU + MCU + PHY combinations in next-gen digital cockpits.
Availability
CYT3DLBBDBQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, central domain controllers, and audio gateways requiring stable component supply across multi-year vehicle production cycles.
Supply support for CYT3DLBBDBQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line targets automotive human-machine interface (HMI) systems, integrating graphics, audio, networking, and functional safety into single-chip solutions for digital cockpits and ADAS visualization.
FAQ
What is the maximum display resolution supported by CYT3DLBBDBQ1BZSGS via FPD-Link?
The device supports single-lane FPD-Link output at up to 1920 × 720 resolution with a 110 MHz pixel clock, sufficient for HD HUD projection. This interface operates without external level shifters and complies with industry-standard FPD-Link timing specifications for automotive displays.
Does CYT3DLBBDBQ1BZSGS support secure over-the-air (FOTA) updates?
Yes - it includes dual-bank code-flash with Read-While-Write capability and hardware-assisted secure boot using ECDSA signatures. The eSHE/HSM crypto engine validates firmware images before execution, enabling authenticated, atomic, and rollback-safe FOTA updates without external security elements.
How many CAN FD channels does CYT3DLBBDBQ1BZSGS integrate, and what is their compliance status?
CYT3DLBBDBQ1BZSGS integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Each channel supports data rates up to 8 Mbps and has passed ISO 16845:2015 conformance testing for interoperability and robustness.
Is the graphics engine capable of rendering without frame buffers, and how is this implemented?
Yes - the drawing engine supports on-the-fly rendering without frame buffers by streaming pixel data directly to the display engine. This is achieved through command sequencer-driven pipelines that compose layers, apply warping, and generate timing signals in real time - reducing memory bandwidth and latency critical for HUD applications.
CYT3DLBBDBQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBDBQ1BZSGS FAQ
1.How can I place an order for CYT3DLBBDBQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBDBQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBDBQ1BZSGS reliable?
The price and inventory of CYT3DLBBDBQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBDBQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT3DLBBDBQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBDBQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBDBQ1BZSGS?
CYT3DLBBDBQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBDBQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBDBQ1BZSGS?
For technical support, including CYT3DLBBDBQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBDBQ1BZSGS requirements.
6.How does Aetrix verify that CYT3DLBBDBQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBDBQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBDBQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT3DLBBDBQ1BZSGS?
All CYT3DLBBDBQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBDBQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBDBQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT3DLBBDBQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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