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Infineon Technologies CYT3DLBBDBQ1BZSGST
- Part No.:
- CYT3DLBBDBQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBDBQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:1,122
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Product details
Overview
CYT3DLBBDBQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), 4160 KB code-flash, 384 KB SRAM, and integrated graphics/audio subsystems. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC with IEEE-1588 PTP, and is qualified for ASIL-B functional safety in instrument clusters and HUD systems.
For engineers reviewing the CYT3DLBBDBQ1BZSGST datasheet, CYT3DLBBDBQ1BZSGST pinout, CYT3DLBBDBQ1BZSGST application, or CYT3DLBBDBQ1BZSGST equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping for HUD, secure boot with eSHE/HSM, and FPD-Link/LVDS video output supporting up to 1920×720 at 110 MHz.
Technical Context
The device implements hardware-isolated inter-processor communication between M7 and M0+ cores, enabling concurrent safety-critical peripheral management and high-performance application execution. Its graphics subsystem includes a command sequencer, drawing engine, and composition engine - all operating without frame buffers via on-the-fly rendering.
Functional safety is enforced through SMPU, PPU, SECDED ECC on SRAM/flash/TCM, and multi-level BOD (2.7 V / 3.0 V / 1.1 V thresholds). The crypto engine supports AES-128/192/256, SHA-256/512, RSA/ECC, and GCM mode - all accessible via HSM-compliant secure boot flow.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of application and safety firmware |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly display warping, and direct capture-to-display feed for HUD |
| Video I/O | FPD-Link single-lane (1920×720 @ 110 MHz) + Parallel RGB (800×600 @ 40 MHz); MIPI CSI-2 2-/4-lane capture (up to 2880×1080) |
| Networking | 4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 1× 10/100 Mbps Ethernet MAC with IEEE-1588 PTP and AVB support |
| Security | HSM-compliant crypto engine with AES, SHA-256/512, RSA/ECC, TRNG, and secure boot using digital signature verification |
| Safety | ASIL-B certified with SMPU, PPU, SECDED ECC on all safety-critical memories, MCWDT, and multi-threshold BOD/LVD/OVD |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm (max), 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input with dedicated BOD threshold (1.1 V) for analog accuracy and fault detection |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; monitored by dual-threshold BOD (2.7 V / 3.0 V) |
| SWDIO/SWCLK | Serial Wire Debug interface | Two-pin debug port supporting Arm® SWD protocol, trace-capable via ETM, compatible with IAR EWARM/GHS MULTI |
| ETH_RXD0–ETH_RXD3 | Ethernet receive data lines | RMII/MII-compatible inputs supporting 10/100 Mbps operation and IEEE-1588 timestamp alignment |
| FPD_D0–FPD_D7 | FPD-Link data lanes | Single-lane FPD-Link interface driving HD-resolution displays (1920×720) at 110 MHz with embedded clock recovery |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core isolation | Hardware-enforced IPC and memory protection enables independent M7 application runtime and M0+ security/peripheral stack execution |
| On-the-fly graphics | Rendering pipeline bypasses frame buffer storage - reduces latency and memory bandwidth for HUD warping and overlay compositing |
| FOTA-ready flash | Dual-bank code-flash architecture allows seamless background firmware updates without system interruption or external memory |
| Audio/video synchronization | IEEE-1588 PTP support in Ethernet MAC and TDM/PCM-PWM interfaces enables sub-microsecond timing alignment across audio/video streams |
| Secure boot enforcement | HSM-managed boot process verifies digital signatures before loading firmware, preventing unauthorized code execution at power-on reset |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD cluster with animated transitions. IC Role / Device Role / Timing Role: Primary application MCU executing graphics-intensive UI with deterministic response under ASIL-B constraints. Use Value: Integrated 2D/2.5D engine and 2048 KB VRAM eliminate external GPU, reducing BOM cost and board space while meeting <100 ms UI update latency. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with geometric correction for driver eye position. IC Role / Device Role / Timing Role: Graphics controller performing real-time perspective warping and video layer composition synchronized to vehicle motion sensors. Use Value: On-the-fly warping engine eliminates need for pre-rendered frame buffers, cutting VRAM usage by >60% and enabling dynamic distortion compensation. |
| Automotive Digital Radio | Central Domain Controller Gateway |
Use Scenario: Multi-band AM/FM/DAB+ receiver with equalization, surround sound processing, and voice prompt playback. IC Role / Device Role / Timing Role: Audio subsystem host managing four TDM interfaces, two PCM-PWM outputs, and five sound generator channels. Use Value: Integrated DAC, mixers, and SG interfaces enable full audio signal chain without external codecs - simplifying layout and EMI control. | Use Scenario: In-vehicle network hub aggregating CAN FD, LIN, CXPI, and Ethernet traffic between ADAS, infotainment, and body domains. IC Role / Device Role / Timing Role: Protocol-agnostic gateway processor with hardware-accelerated packet filtering, timestamping, and routing logic. Use Value: Four CAN FD controllers + IEEE-1588 PTP allow deterministic cross-domain message scheduling with <1 μs timestamp resolution for time-sensitive ADAS coordination. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports CAN FD + Ethernet but lacks FPD-Link and HUD-specific warping acceleration | Better suited for gateway/control tasks than graphics-rich HUD/instrument cluster UI rendering | Select when prioritizing raw compute throughput and larger flash over display-specific hardware acceleration |
| Renesas RH850/U2A | Tri-core lockstep (3× 400 MHz), ASIL-D capable, no graphics subsystem, 12 MB flash, supports CAN FD + Ethernet but no MIPI CSI-2 or FPD-Link interfaces | Targeted at high-integrity powertrain/braking control rather than multimedia display systems | Select when ASIL-D certification and deterministic lockstep execution outweigh need for integrated graphics/audio I/O |
Compared with S32K344 and RH850/U2A, CYT3DLBBDBQ1BZSGST uniquely integrates HUD-optimized graphics acceleration, FPD-Link output, and MIPI CSI-2 capture - making it the only option among the three qualified for standalone automotive display controller functionality without external ASICs.
Availability
CYT3DLBBDBQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, digital radio systems, and central domain controller gateways requiring stable component supply across extended production lifecycles.
Supply support for CYT3DLBBDBQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for high-resolution, safety-certified human-machine interface (HMI) systems including digital cockpits and augmented reality HUDs.
FAQ
Does CYT3DLBBDBQ1BZSGST support functional safety certification for ASIL-B systems?
Yes. The device is certified for ASIL-B per ISO 26262, with hardware safety mechanisms including SECDED ECC on SRAM/flash/TCM, SMPU/PPU memory protection, multi-counter watchdog timers, and multi-threshold brown-out detection. Safety documentation and FMEDA reports are available under NDA from Infineon.
What display interfaces does CYT3DLBBDBQ1BZSGST natively support?
It supports two native video output interfaces: Parallel RGB (up to 800×600 @ 40 MHz) and single-lane FPD-Link (up to 1920×720 @ 110 MHz), plus one video capture interface with ITU-R BT.656, parallel RGB/YUV, or 2-/4-lane MIPI CSI-2 input capability.
Is secure boot implemented in hardware or firmware on this MCU?
Secure boot is implemented in hardware via the integrated Hardware Security Module (HSM) and Enhanced Secure Hardware Extension (eSHE). It performs digital signature verification of boot images using RSA/ECC keys stored in OTP eFuses before any code execution begins.
Can the graphics engine operate without external DRAM or frame buffers?
Yes. The graphics subsystem supports on-the-fly rendering without frame buffers - using internal VRAM and command sequencing to generate display output directly from geometry commands, reducing latency and eliminating external memory bottlenecks for HUD warping and overlay composition.
CYT3DLBBDBQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBDBQ1BZSGST FAQ
1.How can I place an order for CYT3DLBBDBQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBDBQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBDBQ1BZSGST reliable?
The price and inventory of CYT3DLBBDBQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBDBQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT3DLBBDBQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBDBQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBDBQ1BZSGST?
CYT3DLBBDBQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBDBQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBDBQ1BZSGST?
For technical support, including CYT3DLBBDBQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBDBQ1BZSGST requirements.
6.How does Aetrix verify that CYT3DLBBDBQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBDBQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBDBQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT3DLBBDBQ1BZSGST?
All CYT3DLBBDBQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBDBQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBDBQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT3DLBBDBQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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