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Infineon Technologies CYT3DLBBEBQ1BZSGST
- Part No.:
- CYT3DLBBEBQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBEBQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,145
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Product details
Overview
CYT3DLBBEBQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and ASIL-B functional safety for instrument cluster and HUD systems.
For engineers reviewing the CYT3DLBBEBQ1BZSGST datasheet, CYT3DLBBEBQ1BZSGST pinout, CYT3DLBBEBQ1BZSGST application, or CYT3DLBBEBQ1BZSGST equivalent, key selection criteria include dual-core real-time partitioning, on-the-fly display warping for HUDs, secure boot with eSHE/HSM, FPD-Link video output (1920×720 @ 110 MHz), and hardware-accelerated vector graphics rendering without frame buffers.
Technical Context
The device implements a heterogeneous dual-CPU architecture: the Cortex-M7 handles primary graphics, audio, and application processing with 16 KB I/D caches and TCM, while the Cortex-M0+ manages peripheral control, security services, and ASIL-B safety monitoring via dedicated SMPU/PPU. Inter-processor communication is hardware-accelerated with mailbox and shared memory.
Graphics subsystem includes a command sequencer, drawing engine, composition engine, and display engine supporting parallel RGB (800×600 @ 40 MHz) and single-lane FPD-Link (1920×720 @ 110 MHz), with real-time perspective warping and direct capture-to-display feed-through for HUD optical correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks |
| Memory | 4160 KB code-flash (RWW, dual-bank), 128 KB work-flash, 384 KB SRAM with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering with 2048 KB embedded VRAM, on-the-fly warping, and no-framebuffer vector graphics acceleration |
| Video I/O | FPD-Link single-lane output (1920×720 @ 110 MHz); MIPI CSI-2 2-/4-lane capture (up to 2880×1080 @ 220 MHz) |
| Communication | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with AVB/PTP |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, SECDED ECC on flash/SRAM/TCM, secure boot with digital signature |
| Safety | ASIL-B compliant: MPU, SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, and hardware error correction on all safety-critical memories |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated input with dual BOD thresholds (2.7 V / 3.0 V) for robust analog measurement integrity |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; monitored by BOD and OVD |
| VCORE | Core voltage reference | Supplies Cortex-M7/M0+ cores and TCM; protected by SMPU and hardware ECC |
| ETH_RXD[3:0] | Ethernet receive data | 4-bit RMII/MII interface supporting IEEE-802.3bw 10/100 Mbps with AVB/PTP timestamping |
| FPD_TX[3:0] | FPD-Link differential video output | Single-lane FPD-Link driving HUD displays up to 1920×720 @ 110 MHz with embedded clock recovery |
| CANFD0_TX/RX | CAN FD channel 0 differential pair | Compliant with ISO 11898-1:2015; supports non-ISO CAN FD V1.0 and 8 Mbps data rate |
| MIPI_CSI2_CLK | MIPI CSI-2 clock lane | Supports 2- or 4-lane capture at up to 220 MHz lane rate for high-res camera input (e.g., 2880×1080) |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly HUD warping | Hardware-accelerated perspective transformation applied during video output generation-no CPU or frame buffer overhead |
| Dual-bank flash update | Enables seamless Firmware Over-The-Air (FOTA) with zero downtime using independent code-flash banks |
| Secure boot with eSHE | Root-of-trust established via hardware-verified digital signature; prevents unauthorized firmware execution |
| Audio mixing & DAC | Two PCM mixers (5 inputs each) + integrated DAC enable in-system audio feedback without external codecs |
| Smart I/O logic | Boolean operations (AND/OR/XOR) executed directly on GPIO_STD pins-reduces interrupt load for sensor preprocessing |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards with animated transitions. IC Role / Device Role / Timing Role: Primary application processor with graphics acceleration, CAN FD gateway, and safety monitor via Cortex-M0+. Use Value: 240 MHz M7 + 2048 KB VRAM enables smooth 60 Hz UI updates; ASIL-B safety features satisfy ISO 26262 requirements for cluster instrumentation. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with optical distortion correction. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping; FPD-Link drives DLP/LCoS projector at 1920×720 @ 110 MHz. Use Value: Hardware warping eliminates need for external FPGA/GPU; low-latency capture-to-display path (< 2 ms) ensures driver-relevant timing. |
| Automotive Audio Gateway | ADAS Sensor Fusion Hub |
Use Scenario: Aggregation and mixing of audio streams from multiple microphones, infotainment head unit, and hands-free telephony. IC Role / Device Role / Timing Role: Sound subsystem handles four TDM interfaces, two PCM-PWM links, and five sound generators with integrated DAC. Use Value: On-chip audio mixing avoids external codec; TDM/PCM flexibility supports legacy and next-gen automotive audio topologies. | Use Scenario: Time-synchronized ingestion of camera (MIPI CSI-2), radar (CAN FD), and ultrasonic (LIN) sensor data for fusion algorithms. IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-1588 PTP provides sub-microsecond time stamping; CAN FD/LIN/CXPI handle multi-protocol sensor interfacing. Use Value: Hardware timestamping across interfaces enables deterministic sensor alignment; ASIL-B safety monitors critical fusion paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 (320 MHz), no integrated graphics engine or VRAM; relies on external GPU for HUD rendering | Lacks on-chip 2D/2.5D graphics acceleration and FPD-Link output-requires companion display controller | Select when graphics workload is minimal or offloaded externally; preferred for powertrain/safety ECU roles over HUD-focused designs |
| Renesas RH850/U2A | Tri-core (3× RXv3), no Arm architecture; fixed-function graphics IP limited to 2D only; no Ethernet MAC or FPD-Link | Targeted at body control and gateway applications-not qualified for HUD video pipeline or AVB networking | Choose for legacy RH850 ecosystem compatibility and deterministic real-time control-but not for display-intensive automotive HMI |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBEBQ1BZSGST uniquely integrates HUD-optimized graphics, FPD-Link, and AVB-capable Ethernet in a single ASIL-B-certified package-enabling consolidated instrument cluster + HUD platforms without external video processors.
Availability
CYT3DLBBEBQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, audio gateways, and ADAS sensor fusion hubs requiring stable component supply, long lifecycle support, and ASIL-B compliance.
Supply support for CYT3DLBBEBQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G family-designed specifically for automotive human-machine interface (HMI) applications requiring integrated graphics, audio, safety, and multi-protocol connectivity in a single chip.
FAQ
What is the maximum resolution supported by the FPD-Link interface?
The FPD-Link single-lane interface supports up to 1920×720 pixels at 110 MHz, sufficient for standard HD HUD projection. This is achieved using embedded clock recovery and differential signaling compliant with industry-standard FPD-Link III specifications-no external serializer/deserializer required.
Does CYT3DLBBEBQ1BZSGST support secure firmware updates over CAN FD?
Yes-it supports Firmware Over-The-Air (FOTA) via dual-bank flash architecture and secure boot with digital signature verification. CAN FD serves as the transport layer for authenticated firmware images, with the HSM performing AES-GCM decryption and SHA-256 integrity checks before write-to-flash.
How many CAN FD channels are implemented, and what is their physical layer compliance?
CYT3DLBBEBQ1BZSGST integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0 (non-ISO). Each supports data rates up to 8 Mbps, subject to transceiver and topology limitations, and includes ISO 16845:2015 conformance certification.
Is the MIPI CSI-2 interface capable of handling four-lane camera input at full bandwidth?
Yes-the MIPI CSI-2 interface supports up to four lanes at 220 MHz per lane, enabling capture of 2880×1080 video at 30 fps. Lane configuration is runtime-reconfigurable, and the capture engine supports ITU-R BT.656, parallel RGB/YUV, and MIPI CSI-2 simultaneously with multiplexed routing.
CYT3DLBBEBQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBEBQ1BZSGST FAQ
1.How can I place an order for CYT3DLBBEBQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBEBQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBEBQ1BZSGST reliable?
The price and inventory of CYT3DLBBEBQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBEBQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT3DLBBEBQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBEBQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBEBQ1BZSGST?
CYT3DLBBEBQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBEBQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBEBQ1BZSGST?
For technical support, including CYT3DLBBEBQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBEBQ1BZSGST requirements.
6.How does Aetrix verify that CYT3DLBBEBQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBEBQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBEBQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT3DLBBEBQ1BZSGST?
All CYT3DLBBEBQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBEBQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBEBQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT3DLBBEBQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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