My Inquiry
My Account
Infineon Technologies CYT3DLBBFBQ1BZSGS
- Part No.:
- CYT3DLBBFBQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBFBQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,171
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT3DLBBFBQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC, RSA). It targets instrument clusters and HUD systems requiring real-time rendering, secure boot, and ASIL-B functional safety compliance.
For engineers reviewing the CYT3DLBBFBQ1BZSGS datasheet, CYT3DLBBFBQ1BZSGS pinout, CYT3DLBBFBQ1BZSGS application, or CYT3DLBBFBQ1BZSGS equivalent, key selection criteria include dual-core deterministic execution, on-the-fly display warping for HUDs, FPD-Link video output (1920×720 @ 110 MHz), embedded VRAM (2048 KB), and HSM-enabled secure firmware update over-the-air (FOTA).
Technical Context
The device implements a heterogeneous dual-CPU architecture: the Cortex®-M7 handles high-throughput graphics and application logic with 16 KB I-cache/16 KB D-cache and 64 KB TCM per domain, while the Cortex®-M0+ manages peripheral control, security services, and ASIL-B safety monitoring via dedicated SMPU/PPU protection units. Inter-processor communication uses hardware mailbox and shared memory with SECDED ECC.
Graphics subsystem includes a command sequencer, drawing engine, composition engine, and display engine supporting direct capture-to-display feedthrough without frame buffers; video I/O supports parallel RGB (800×600 @ 40 MHz) and single-lane FPD-Link (1920×720 @ 110 MHz) with real-time perspective warping for HUD optical correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Arm® Cortex®-M0+, enabling real-time separation of safety-critical and application tasks |
| Graphics Memory | 2048 KB embedded VRAM, eliminating external video RAM and reducing BOM cost and board area in HUD/instrument cluster designs |
| Video Output | Single-lane FPD-Link interface supporting HD resolution (1920×720 @ 110 MHz), directly driving automotive-grade display modules |
| CAN FD Channels | Up to 4 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, enabling 8 Mbps data rate for high-bandwidth sensor fusion |
| Security Engine | HSM with AES-128/192/256, SHA-256/512, ECC, RSA, and secure boot using digital signature verification for OTA firmware integrity |
| Functional Safety | ASIL-B compliant with hardware MPU/SMPU/PPU, SECDED ECC on SRAM/flash/TCM, MCWDT, LVD/BOD/OVD/OCD, and CSV clock supervision |
| Package | 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch - optimized for thermal dissipation and routing density in automotive PCBs |
Pinout & Package
272-ball BGA package (16 mm × 16 mm, 0.8 mm pitch) with 135 programmable I/Os across four types: GPIO_STD, GPIO_ENH, GPIO_SMC, and HSIO_STDLN. Ball mapping includes dedicated FPD-Link differential pairs (FPD_P/N), CAN FD transceiver pins (CANFDx_TX/RX), Ethernet MII/RMII signals, and crypto engine debug interfaces (SWD/JTAG).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FPD0_P / FPD0_N | FPD-Link differential video output pair | Drives single-lane FPD-Link displays up to 1920×720 @ 110 MHz; requires controlled impedance routing (100 Ω differential) |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 transceiver interface | Supports 8 Mbps data rate; connects to external CAN FD transceiver (e.g., TJA1044) for automotive network backbone |
| ETH_MDC / ETH_MDIO | Ethernet management interface | Configures IEEE 802.3bw-compliant 10/100 Mbps MAC; enables AVB/PTP time-synchronized audio/video streaming |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables non-intrusive debugging and flash programming via Arm® SWD; compatible with IAR EWARM and GHS MULTI toolchains |
| VDDA_ADC | Analog supply for SAR ADC | 1.1 V regulated supply with dual BOD thresholds (2.7 V / 3.0 V); ensures stable 12-bit, 1 Msps ADC conversion under battery voltage fluctuation |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated perspective correction for HUD projection optics, eliminating software rendering latency and CPU load |
| Direct capture-to-display feedthrough | Zero-frame-buffer video path from MIPI CSI-2/RGB capture to FPD-Link output, enabling <10 ms end-to-end latency for driver assistance camera feeds |
| FOTA-ready flash architecture | 4160 KB code-flash + 128 KB work-flash with RWW and dual-bank mode, enabling atomic firmware updates without system reset |
| ASIL-B safety mechanisms | Hardware-enforced memory isolation (SMPU), peripheral protection (PPU), SECDED ECC on all safety-critical memories, and multi-counter watchdog (MCWDT) |
| Smart I/O Boolean logic | Programmable combinational logic on up to 8 GPIO_STD pins, enabling hardware-level signal conditioning without CPU intervention |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Digital gauge cluster with animated speedometers, navigation overlays, and ADAS warnings rendered at 60 Hz. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant graphics stack and real-time CAN FD message handling. Use Value: Dual-core separation allows M7 to render vector graphics while M0+ manages CAN FD bus arbitration and safety monitoring - meeting ASIL-B timing deadlines. | Use Scenario: Projection-based HUD displaying speed, navigation arrows, and lane departure alerts onto windshield with optical distortion correction. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping; FPD-Link outputs corrected image to DMD/LCoS controller. Use Value: Hardware warping engine reduces M7 CPU load by >70% vs. software-only implementation, enabling simultaneous camera feed processing and HUD rendering. |
| Automotive Ethernet Gateway | Secure Telematics Control Unit |
Use Scenario: In-vehicle gateway bridging CAN FD, LIN, and Ethernet domains for OTA updates and diagnostics. IC Role / Device Role / Timing Role: Ethernet MAC processes IEEE 802.1BA AVB streams and IEEE 1588 PTP timestamps; SCBs route legacy protocols. Use Value: Integrated 10/100 Mbps Ethernet with MII/RMII PHY support eliminates external PHY IC, reducing component count and EMI risk. | Use Scenario: Secure telematics unit performing encrypted vehicle data logging, remote diagnostics, and signed firmware validation. IC Role / Device Role / Timing Role: Crypto engine executes AES-GCM encryption, SHA-256 signature verification, and ECC key exchange during FOTA handshake. Use Value: HSM-certified hardware acceleration achieves 128-bit AES encryption at >50 MB/s - enabling full-image OTA updates within 30 seconds over LTE. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and connectivity MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Arm® Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, 1.5 MB SRAM, supports CAN FD/Ethernet but lacks FPD-Link and VRAM | Targeted at gateway and motor control; not suitable for HUD/instrument cluster graphics rendering without external GPU | Select when primary need is high-speed control + networking, not embedded display processing |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), ASIL-D capable, 8 MB flash, 2 MB SRAM, supports CAN FD/LIN/Ethernet but no hardware graphics accelerator or video interfaces | Focused on powertrain and chassis control; requires external display controller for any graphical UI | Select for ASIL-D safety-critical control applications where graphics are handled externally |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBFBQ1BZSGS uniquely integrates dual-core processing, on-die 2D/2.5D graphics, FPD-Link output, and HSM crypto - making it the only solution among the three that eliminates external GPU, video PHY, and secure element ICs in automotive display systems.
Availability
CYT3DLBBFBQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, Ethernet gateways, and secure telematics control units requiring stable component supply, long lifecycle support, and ASIL-B certification.
Supply support for CYT3DLBBFBQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.
CYT3DL belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for next-generation digital cockpits requiring integrated graphics, real-time networking, functional safety, and hardware-enforced security.
FAQ
What is the maximum display resolution supported by CYT3DLBBFBQ1BZSGS via FPD-Link?
The device supports single-lane FPD-Link output at up to 1920×720 resolution @ 110 MHz pixel clock, sufficient for wide-aspect automotive HUDs and mid-tier instrument clusters. This is implemented using dedicated differential FPD0_P/FPD0_N ball pairs routed with 100 Ω differential impedance.
Does CYT3DLBBFBQ1BZSGS support secure boot with public-key verification?
Yes - the integrated HSM performs digital signature verification using ECDSA or RSA during boot, validating firmware authenticity against keys stored in eFuse or protected flash. Secure boot completes in <150 ms and supports both signed images and chain-of-trust loading.
How many CAN FD channels are physically implemented on this specific MPN?
CYT3DLBBFBQ1BZSGS implements 4 fully independent CAN FD controllers compliant with ISO 11898-1:2015, each supporting up to 8 Mbps data rate and configurable bit timing. All 4 channels are accessible via dedicated TX/RX ball pairs and support loopback, silent, and normal operating modes.
Is the 2048 KB VRAM separate from main SRAM, and can it be accessed by both CPU cores?
Yes - the 2048 KB VRAM is a dedicated, low-latency memory block mapped exclusively to the graphics subsystem. It is not part of the 384 KB general-purpose SRAM and is inaccessible to CPU cores; instead, graphics engines (drawing/composition/display) access it directly via AXI bus with hardware arbitration.
CYT3DLBBFBQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBFBQ1BZSGS FAQ
1.How can I place an order for CYT3DLBBFBQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBFBQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBFBQ1BZSGS reliable?
The price and inventory of CYT3DLBBFBQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBFBQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT3DLBBFBQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBFBQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBFBQ1BZSGS?
CYT3DLBBFBQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBFBQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBFBQ1BZSGS?
For technical support, including CYT3DLBBFBQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBFBQ1BZSGS requirements.
6.How does Aetrix verify that CYT3DLBBFBQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBFBQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBFBQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT3DLBBFBQ1BZSGS?
All CYT3DLBBFBQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBFBQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBFBQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT3DLBBFBQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT3DLBBFBQ1BZSGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
