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Infineon Technologies CYT3DLBBFBQ1BZSGST
- Part No.:
- CYT3DLBBFBQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBFBQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:1,961
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Product details
Overview
CYT3DLBBFBQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and FPD-Link video output for instrument cluster and HUD applications.
For engineers reviewing the CYT3DLBBFBQ1BZSGST datasheet, CYT3DLBBFBQ1BZSGST pinout, CYT3DLBBFBQ1BZSGST application, or CYT3DLBBFBQ1BZSGST equivalent, key selection criteria include ASIL-B functional safety compliance, on-the-fly display warping capability, secure boot with eSHE/HSM, dual-CPU inter-processor communication, and hardware-accelerated vector graphics rendering without frame buffers.
Technical Context
The device implements a heterogeneous dual-core architecture: the Cortex®-M7 handles primary real-time graphics and application processing with 16 KB I-cache/16 KB D-cache and 64 KB TCM per domain, while the Cortex®-M0+ manages peripheral control, security services, and low-latency I/O handling. Hardware inter-processor communication uses dedicated mailbox and semaphore peripherals.
Graphics subsystem includes a command sequencer, drawing engine, composition engine, and display engine - enabling real-time HUD warping, direct capture-to-display feed-through, and layer-based scene composition. Video I/O supports parallel RGB (800×600 @ 40 MHz), FPD-Link single-lane (1920×720 @ 110 MHz), and MIPI CSI-2 (up to 2880×1080 @ 220 MHz on four lanes).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Arm® Cortex®-M0+, with hardware mailbox for IPC |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly warping, no-framebuffer operation |
| Video I/O | FPD-Link single-lane (HD resolution), parallel RGB (800×600), MIPI CSI-2 (2-/4-lane, up to 2880×1080) |
| Networking | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 1× 10/100 Mbps Ethernet MAC (IEEE-802.3bw, AVB/PTP) |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, SECDED ECC on all safety-critical memories |
| Safety | ASIL-B compliant: SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, hardware error correction on flash/SRAM/TCM |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V regulated supply with dedicated BOD threshold (1.1 V) for ADC accuracy and fault detection |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; monitored by dual-threshold BOD (2.7 V / 3.0 V) |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports ECO (up to 50 MHz) and WCO (32.768 kHz); enables precise clock sourcing for RTC and timing-critical peripherals |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Ethernet PHY data interface | MII/RMII-capable pins for 10/100 Mbps Ethernet; support IEEE-1588 PTP timestamping and AVB traffic shaping |
| FPD_DAT[7:0] / FPD_CLK | FPD-Link video data and clock | Single-lane FPD-Link interface driving HD-resolution displays (1920×720 @ 110 MHz) with embedded sync and data recovery |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential pair | High-speed physical layer interface compliant with ISO 11898-1:2015; supports bit rates up to 8 Mbps with flexible data-rate arbitration |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly HUD warping | Hardware-accelerated perspective transformation applied directly to video stream without frame buffer, reducing latency and memory bandwidth |
| Dual-CPU inter-processor communication | Dedicated hardware mailbox and semaphore blocks enable deterministic, lock-free message passing between M7 and M0+ cores |
| Secure boot with fast authentication | Hardware-accelerated digital signature verification (RSA/ECC) and AES-GCM decryption ensure authenticated firmware load in <100 ms |
| Graphics rendering without frame buffers | Command sequencer drives drawing/composition engines directly from instruction memory, eliminating external DRAM dependency for basic HUD layers |
| ASIL-B safety mechanisms | Integrated SMPU, PPU, and SECDED ECC across flash, SRAM, and TCM enforce memory isolation and detect/correct single-bit errors in real time |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, navigation arrows, and ADAS alerts on TFT-LCD dashboards with animated transitions. IC Role / Device Role / Timing Role: Primary graphics controller and system orchestrator; M7 executes UI framework while M0+ handles CAN FD telemetry parsing and safety monitoring. Use Value: 2048 KB VRAM and on-the-fly composition enable smooth 60 Hz layer blending without external memory, reducing BOM cost and board area. | Use Scenario: Projection of vehicle speed, lane departure warnings, and AR navigation onto windshield with geometric correction for driver eye position. IC Role / Device Role / Timing Role: Dedicated graphics pipeline with hardware warping engine; M7 processes camera input and renders warped overlay; M0+ manages timing-critical PWM dimming and thermal monitoring. Use Value: On-the-fly perspective warping eliminates need for pre-rendered lookup tables or external FPGA, cutting latency to <5 ms and simplifying calibration. |
| Automotive Digital Rearview Mirror | Central Domain Controller Interface |
Use Scenario: Capturing and enhancing rear camera feed (MIPI CSI-2) with dynamic contrast, noise reduction, and mirror geometry correction before display. IC Role / Device Role / Timing Role: Video capture engine (ITU656/RGB/CSI-2) feeds directly into graphics pipeline; M0+ handles LIN/CXPI side-mirror actuation commands. Use Value: Direct capture-to-display path with graphics overlay avoids intermediate frame storage, enabling sub-30 ms end-to-end latency for safety-critical vision feedback. | Use Scenario: Aggregating and routing sensor data (CAN FD, Ethernet, LIN) between ADAS ECUs, infotainment, and body control modules in zonal architecture. IC Role / Device Role / Timing Role: Network gateway and protocol translator; M7 runs AUTOSAR COM stack and firewall logic; M0+ handles secure key provisioning and crypto offload. Use Value: Integrated 4× CAN FD + 1× Ethernet + 2× LIN + 2× CXPI enables consolidated connectivity with deterministic latency under 100 µs per packet forwarding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and networking MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 8 MB flash, supports CAN FD + Ethernet but lacks FPD-Link or VRAM | Targeted at gateway/safety ECU roles; requires external GPU or display controller for HUD/instrument cluster | Select when prioritizing higher CPU performance and larger flash over integrated graphics acceleration |
| Renesas RH850/U2A | Dual RH850 cores (400 MHz each), no graphics subsystem, 12 MB flash, supports CAN FD + Ethernet + LIN but no MIPI CSI-2 or FPD-Link | Focused on powertrain and chassis control; lacks video I/O and real-time warping capability | Select for high-reliability motor control or safety-critical actuation where display functionality is handled externally |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBFBQ1BZSGST uniquely integrates graphics acceleration, FPD-Link, and MIPI CSI-2 in a single ASIL-B package - eliminating external video ICs and reducing system latency for HUD and digital mirror use cases.
Availability
CYT3DLBBFBQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, digital rearview mirrors, and central domain controllers requiring stable component supply, long lifecycle support, and ASIL-B compliance.
Supply support for CYT3DLBBFBQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G family - engineered specifically for automotive human-machine interface (HMI) systems demanding integrated graphics, multi-protocol networking, and functional safety up to ASIL-B.
FAQ
What is the maximum display resolution supported by CYT3DLBBFBQ1BZSGST via FPD-Link?
The device supports single-lane FPD-Link at up to 110 MHz, enabling HD resolution output of 1920 × 720 pixels. This is validated in the official Infineon datasheet (Rev. *K, page 2) and confirmed by timing analysis of the FPD_DAT[7:0] and FPD_CLK interface specifications.
Does CYT3DLBBFBQ1BZSGST include hardware support for secure boot and cryptographic operations?
Yes - it integrates a dedicated crypto engine supporting AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and GCM mode. Secure boot uses hardware-accelerated digital signature verification and fast authentication, as documented in the security features section (page 2, datasheet Rev. *K).
How many CAN FD channels does CYT3DLBBFBQ1BZSGST support, and what is the maximum data rate?
The device supports up to four CAN FD channels compliant with ISO 11898-1:2015, with data rates up to 8 Mbps. This is explicitly stated in the "Communication interfaces" feature list (page 3, datasheet Rev. *K) and verified against Infineon's certified test reports.
Is the graphics engine capable of performing display warping without external memory?
Yes - the on-the-fly warping engine operates directly on pixel streams using internal VRAM and command sequencer logic, requiring no external frame buffer. This capability is confirmed in the graphics subsystem description (page 2, datasheet Rev. *K) and enables sub-5 ms latency for HUD applications.
CYT3DLBBFBQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.06MB (4.06M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBFBQ1BZSGST FAQ
1.How can I place an order for CYT3DLBBFBQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBFBQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBFBQ1BZSGST reliable?
The price and inventory of CYT3DLBBFBQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBFBQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT3DLBBFBQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBFBQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBFBQ1BZSGST?
CYT3DLBBFBQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBFBQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBFBQ1BZSGST?
For technical support, including CYT3DLBBFBQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBFBQ1BZSGST requirements.
6.How does Aetrix verify that CYT3DLBBFBQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBFBQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBFBQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT3DLBBFBQ1BZSGST?
All CYT3DLBBFBQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBFBQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBFBQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT3DLBBFBQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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