Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CYT3DLBBGBQ1BZSGST

Part No.:
CYT3DLBBGBQ1BZSGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
272-LFBGA
Datasheet:
AetrixCYT3DLBBGBQ1BZSGST.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,801

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CYT3DLBBGBQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® cores (240 MHz Cortex®-M7 + 100 MHz Cortex®-M0+), 4160 KB code-flash, 384 KB SRAM, and integrated 2D/2.5D graphics engine with 2048 KB VRAM. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC, and hardware security including AES-256, SHA-512, and secure boot - deployed in automotive instrument clusters and HUD systems.

For engineers reviewing the CYT3DLBBGBQ1BZSGST datasheet, CYT3DLBBGBQ1BZSGST pinout, CYT3DLBBGBQ1BZSGST application, or CYT3DLBBGBQ1BZSGST equivalent, key selection criteria include ASIL-B functional safety compliance, on-the-fly display warping for HUD, dual-CPU inter-processor communication, FPD-Link video output (1920×720 @ 110 MHz), and crypto-accelerated secure firmware updates via SWD/JTAG.

Technical Context

The CYT3DLBBGBQ1BZSGST implements a heterogeneous dual-core architecture: the Cortex®-M7 handles high-performance graphics rendering and real-time control, while the Cortex®-M0+ manages peripheral orchestration, security services, and LIN/CXPI protocol stacks. Hardware inter-processor communication (IPC) enables lock-free message passing between cores without software arbitration.

Its graphics subsystem includes a command sequencer, drawing engine, composition engine, and display engine - all operating without frame buffers via on-the-fly rendering. The video pipeline supports direct capture-to-display feed-through with overlay, ITU-656/RGB/MIPI CSI-2 input (up to 2880×1080 @ 220 MHz on 4-lane MIPI), and parallel RGB/FPD-Link output with perspective warping for HUD optical correction.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core(s)Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, with hardware IPC and separate TCM (64 KB ITCM + 64 KB DTCM)
Memory4160 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 384 KB SRAM with configurable retention granularity
Graphics Engine2D/2.5D rendering engine with 2048 KB VRAM; supports on-the-fly warping, no frame buffer required for HUD projection
Video I/OFPD-Link single-lane output (1920×720 @ 110 MHz); MIPI CSI-2 4-lane input (2880×1080 @ 220 MHz); ITU-656/RGB capture up to 800×480
SecurityHSM-compliant crypto engine: AES-128/192/256, SHA-512/256/160, RSA/ECC acceleration, TRNG, GCM, eSHE, and fast secure boot
Automotive Interfaces4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC (IEEE-802.3bw, AVB, PTP)
Power & SafetyASIL-B certified; SECDED ECC on flash/SRAM/TCM; SMPU/PPU/MPU; LVD/BOD/OVD/OCD; 5 power modes (Hibernate to Active)

Pinout & Package

Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm max, 0.8 mm ball pitch, RoHS-compliant, automotive-grade (AEC-Q100 Grade 2).

Pin/TerminalCircuit RoleDesign Meaning
VDDA_ADCAnalog supply for ADC1.1 V ±5% regulated supply; supports 12-bit SAR ADC sampling at 1 Msps with internal temperature/voltage monitoring
VCORECore voltage supply1.1 V nominal core rail generated internally from 2.7–5.5 V input; regulated by DeepSleep/Core PMIC blocks
SWDIO / SWCLKSerial Wire Debug interfaceTwo-pin debug port supporting full ETM trace, secure firmware update, and JTAG fallback; essential for ASIL-B validation
ETH_RXD0–3 / ETH_TXD0–3Ethernet PHY data lanesSupports RMII/MII interfaces; enables IEEE-1588 PTP synchronization and AVB streaming in automotive domain controllers
FPD_IN0–7FPD-Link differential video inputSingle-lane FPD-Link receiver for HD video input (1920×720); used for camera feed integration in HUD systems
DISP_R/G/B[7:0]Parallel RGB display output8-bit RGB interface driving 800×600 displays at 40 MHz; used in legacy instrument cluster implementations

Key Features

FeatureDesign Value
On-the-fly HUD warpingHardware-accelerated perspective transformation applied during video output generation - eliminates need for GPU memory bandwidth or external frame buffers
Dual-CPU security partitioningCortex®-M0+ executes HSM firmware and secure boot verification independently; M7 runs application code in isolated TCM with MPU-enforced boundaries
FOTA-ready flash architectureDual-bank code-flash enables atomic firmware swap during runtime - critical for zero-downtime over-the-air updates in connected vehicles
MIPI CSI-2 4-lane captureDirect sensor interface supporting 2880×1080@220 MHz - enables high-resolution surround-view camera input without external deserializers
Audio/video bridging (AVB)Ethernet MAC complies with IEEE-802.1BA - allows time-synchronized audio/video streaming across vehicle networks without jitter-sensitive buffering

Applications

Instrument Cluster DisplayHead-Up Display (HUD)

Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD dashboards with animated transitions.

IC Role / Device Role / Timing Role: Primary application processor executing graphics stack and CAN FD gateway logic; generates precise video timing via display engine.

Use Value: 240 MHz Cortex®-M7 + 2048 KB VRAM enables smooth 60 Hz UI rendering without external GPU; RWW flash permits live firmware patching during vehicle operation.

Use Scenario: Projection of speed, warning icons, and AR navigation onto windshield using optical combiner and laser scanning.

IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and overlay composition; FPD-Link drives DMD/LCoS controller at 1920×720 resolution.

Use Value: On-the-fly warping eliminates latency-inducing frame buffer reads; dedicated drawing engine accelerates vector-based icon rendering for low-power HUD operation.

Automotive Domain ControllerSecure Gateway Module

Use Scenario: Aggregation and routing of CAN FD, LIN, CXPI, and Ethernet traffic between body, chassis, and infotainment domains.

IC Role / Device Role / Timing Role: Dual-core coordination: M0+ handles protocol translation and firewall rules; M7 manages packet scheduling and AVB timestamping.

Use Value: 4× CAN FD channels + IEEE-1588 PTP enable deterministic cross-domain messaging; hardware crypto offloads TLS/IPsec processing from main application thread.

Use Scenario: Secure boot, OTA update authentication, and encrypted CAN FD message signing in vehicle telematics gateways.

IC Role / Device Role / Timing Role: HSM-compliant crypto engine performs ECDSA signature verification and AES-GCM decryption before firmware execution or CAN message forwarding.

Use Value: eSHE + secure boot prevents unauthorized firmware injection; TRNG and SHA-512 ensure cryptographic key integrity across vehicle lifecycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single-core Arm® Cortex®-M7 (320 MHz), no integrated graphics engine, 8 MB flash, supports ASIL-D but lacks on-the-fly warpingBetter suited for safety-critical chassis control than HUD rendering; requires external GPU or FPGA for graphicsSelect when functional safety level > ASIL-B is required and graphics processing is offloaded externally
Renesas RH850/U2A32-bit RXv3 core (400 MHz), 12 MB flash, no crypto accelerator, no Ethernet MAC, supports CAN FD and LIN onlyOptimized for powertrain and brake ECU; lacks video I/O, VRAM, and AVB support needed for cockpit domainSelect for non-cockpit, high-reliability powertrain applications where Ethernet and graphics are unnecessary

Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBGBQ1BZSGST uniquely integrates HUD-optimized graphics, FOTA-ready dual-bank flash, and AVB-capable Ethernet - making it purpose-built for next-generation digital cockpit domain controllers requiring concurrent safety, connectivity, and visual intelligence.

Availability

CYT3DLBBGBQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, domain controllers, and secure gateways requiring stable component supply across extended vehicle production lifecycles.

Supply support for CYT3DLBBGBQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and automotive qualification expertise.

The TRAVEO™ T2G product line targets digital cockpit systems, integrating graphics, audio, networking, and hardware security into a single ASIL-B-certified MCU platform for instrument clusters and HUDs.

FAQ

What is the maximum resolution supported by the FPD-Link interface?

The FPD-Link single-lane interface supports up to 1920×720 resolution at 110 MHz pixel clock. This is validated for direct drive of DMD or LCoS microdisplays in HUD applications and includes built-in skew calibration and channel equalization for robust signal integrity over automotive harness lengths.

Does CYT3DLBBGBQ1BZSGST support secure boot with public-key verification?

Yes - it implements fast secure boot using ECDSA or RSA digital signature verification against keys stored in OTP eFuses. The boot ROM validates the signature of the first-stage bootloader before execution, ensuring only cryptographically authenticated firmware loads into SRAM or TCM.

How many CAN FD channels are implemented, and what is their compliance status?

CYT3DLBBGBQ1BZSGST integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Each channel supports bit rates up to 8 Mbps and includes ISO 16845:2015 conformance testing capability for interoperability validation.

Is the MIPI CSI-2 interface capable of handling four-lane operation at full bandwidth?

Yes - the MIPI CSI-2 receiver supports four physical lanes operating at 220 MHz per lane, enabling capture of 2880×1080 video at 30 fps. Lane synchronization, embedded clock recovery, and error detection are handled in hardware, eliminating software overhead for high-speed camera sensor interfacing.

CYT3DLBBGBQ1BZSGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
272-LFBGA
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 240MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
135
Program Memory Size:
4.06MB (4.06M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT3DLBBGBQ1BZSGST FAQ

1.How can I place an order for CYT3DLBBGBQ1BZSGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT3DLBBGBQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT3DLBBGBQ1BZSGST reliable?

The price and inventory of CYT3DLBBGBQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBGBQ1BZSGST is usually 5 days.

3.What payment methods are accepted for CYT3DLBBGBQ1BZSGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBGBQ1BZSGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT3DLBBGBQ1BZSGST?

CYT3DLBBGBQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT3DLBBGBQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT3DLBBGBQ1BZSGST?

For technical support, including CYT3DLBBGBQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBGBQ1BZSGST requirements.

6.How does Aetrix verify that CYT3DLBBGBQ1BZSGST is sourced from the original manufacturer or authorized distributors?

All CYT3DLBBGBQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBGBQ1BZSGST meets industry standards.

7.What is the process for return or replacement of CYT3DLBBGBQ1BZSGST?

All CYT3DLBBGBQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBGBQ1BZSGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT3DLBBGBQ1BZSGST part is unused and in its original packaging.

Return procedure for CYT3DLBBGBQ1BZSGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYT3DLBBGBQ1BZSGST Tags

  • CYT3DLBBGBQ1BZSGST
  • CYT3DLBBGBQ1BZSGST PDF
  • CYT3DLBBGBQ1BZSGST Datasheet
  • CYT3DLBBGBQ1BZSGST Specifications
  • CYT3DLBBGBQ1BZSGST Images
  • Infineon Technologies
  • Infineon Technologies CYT3DLBBGBQ1BZSGST
  • Buy CYT3DLBBGBQ1BZSGST
  • CYT3DLBBGBQ1BZSGST Price
  • CYT3DLBBGBQ1BZSGST Distributor
  • CYT3DLBBGBQ1BZSGST Supplier
  • CYT3DLBBGBQ1BZSGST Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER