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Infineon Technologies CYT3DLBBHBQ1BZSGS
- Part No.:
- CYT3DLBBHBQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT3DLBBHBQ1BZSGS.pdf
- Description:
- IC MCU 32BIT 4.063MB FLSH 272BGA
- Quantity:
- Payment:
- Shipping:
Inventory:935
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Product details
Overview
CYT3DLBBHBQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 (240 MHz) and Cortex®-M0+ (100 MHz) CPUs, 4160 KB code-flash, 384 KB SRAM, and integrated graphics/audio subsystems. It supports CAN FD (up to 8 Mbps), 10/100 Mbps Ethernet MAC with IEEE-1588 PTP, and is qualified for instrument clusters and HUD systems.
For engineers reviewing the CYT3DLBBHBQ1BZSGS datasheet, CYT3DLBBHBQ1BZSGS pinout, CYT3DLBBHBQ1BZSGS application, or CYT3DLBBHBQ1BZSGS equivalent, this part delivers deterministic real-time control, on-the-fly graphics composition, secure boot with AES-256/SHA-3, and ASIL-B functional safety compliance in automotive display and domain controller designs.
Technical Context
The device implements a heterogeneous dual-core architecture: the Cortex-M7 handles primary application processing and graphics rendering, while the Cortex-M0+ manages peripheral offload, security services, and real-time I/O control via hardware inter-processor communication. Its graphics subsystem includes a command sequencer, drawing engine, and composition engine enabling frame-bufferless 2D/2.5D rendering.
Functional safety is implemented at silicon level with SECDED ECC on all safety-critical memories (SRAM, flash, TCM), SMPU/PPU/MPU protection units, MCWDT, and dual-threshold BOD (2.7 V / 3.0 V on VDDD/VDDA_ADC). The crypto engine supports eSHE/HSM, RSA/ECC acceleration, and GCM-AES authenticated encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 240 MHz Arm® Cortex®-M7 + 100 MHz Cortex®-M0+, enabling real-time separation of safety-critical and application tasks |
| Memory | 4160 KB code-flash (RWW, dual-bank FOTA), 384 KB SRAM with configurable retention, 64 KB ITCM/64 KB DTCM |
| Graphics Engine | 2D/2.5D rendering engine with 2048 KB VRAM, on-the-fly warping, direct capture-to-display feed, no frame buffer required |
| Connectivity | 4× CAN FD (ISO 11898-1:2015), 12× reconfigurable SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 10/100 Mbps Ethernet MAC with IEEE-1588 PTP |
| Security | HSM-compliant crypto engine with AES-128/192/256, SHA-1/2/3, RSA/ECC, TRNG, GCM, and secure boot using digital signature verification |
| Safety Certification | ASIL-B compliant per ISO 26262:2018, with SECDED ECC on SRAM/flash/TCM, SMPU, PPU, MCWDT, and dual-threshold BOD |
| Power Range | 2.7 V to 5.5 V operation across five power modes (Active, Sleep, DeepSleep, Hibernate), with 1.1 V core regulator |
Pinout & Package
Package: 272-ball BGA, 16 mm × 16 mm × 1.7 mm (max), 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | Provides dedicated 2.7–5.5 V rail for 12-bit SAR ADC with internal temperature sensor and bandgap reference |
| VDDD | Digital core supply | Supplies 1.1 V core logic via internal regulator; supports brown-out detection at 2.7 V or 3.0 V thresholds |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables non-intrusive debugging, flash programming, and ETM instruction/data trace via Arm® SWD protocol |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Ethernet PHY data lanes | Supports MII/RMII interfaces for 10/100 Mbps AVB-capable Ethernet with IEEE-1588 timestamping |
| FPD_LINK_DATA / FPD_LINK_CLK | FPD-Link video output | Single-channel LVDS-compatible interface driving up to 1920×720 @ 110 MHz for HUD displays |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential pair | High-speed automotive bus interface supporting up to 8 Mbps data rate and ISO 11898-1:2015 compliance |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly graphics composition | Eliminates external frame buffer memory by composing layers directly into video output stream using internal VRAM and drawing engine |
| Dual-threshold BOD | Independent 2.7 V / 3.0 V detection on VDDD/VDDA_ADC enables robust analog/digital supply monitoring in automotive environments |
| Firmware update Over-The-Air (FOTA) | Dual-bank flash architecture allows safe background firmware updates without interrupting active application execution |
| Hardware crypto acceleration | Integrated vector unit performs RSA/ECC key generation and AES-GCM encryption/decryption at line rate for secure boot and OTA updates |
| ASIL-B safety mechanisms | SECDED ECC on all safety-critical memories plus SMPU/PPU/MPU enforcement ensures runtime integrity for automotive display controllers |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD cluster panels with dynamic gauge animation. IC Role / Device Role / Timing Role: Primary application processor and graphics compositor; generates precise video timing signals (RGB/FPD-Link) synchronized to vehicle CAN FD bus events. Use Value: Enables smooth 60 Hz UI updates with zero-frame-buffer latency using on-the-fly rendering and 2048 KB VRAM. | Use Scenario: Projection of speed, warning icons, and AR navigation onto windshield via optical combiner with geometric correction. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and overlay composition; CPU subsystem processes camera/LiDAR inputs via CAN FD/Ethernet. Use Value: On-the-fly display warping eliminates need for external GPU, reducing BOM cost and thermal load in compact HUD modules. |
| Automotive Domain Controller | Digital Rearview Mirror |
Use Scenario: Centralized control of lighting, HVAC, and infotainment functions with secure over-the-air updates and diagnostics. IC Role / Device Role / Timing Role: Dual-core isolation: Cortex-M7 runs AUTOSAR Adaptive stack; Cortex-M0+ handles UDS diagnostics, CAN FD gatewaying, and HSM-secured key management. Use Value: Hardware-enforced core separation meets ASIL-B requirements while enabling concurrent high-throughput Ethernet and low-latency CAN FD traffic. | Use Scenario: Processing wide-angle camera input (MIPI CSI-2), applying distortion correction, and driving high-resolution LCD mirror display. IC Role / Device Role / Timing Role: Capture engine ingests 1920×720@60 fps MIPI CSI-2 video; graphics engine composites grid lines and blind-spot alerts onto live feed. Use Value: Direct capture-to-display path with hardware composition reduces end-to-end latency to <12 ms, critical for driver response time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive display controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 core (320 MHz), no integrated graphics engine, relies on external GPU or software rendering | Targeted at body control and gateway applications; lacks native HUD warping or VRAM | Select when graphics offload is handled externally and higher CPU clock speed is prioritized over integrated display pipeline |
| Renesas RH850/U2A | Tri-core (RH850 + 2x RISC-V), 160 MHz max, no Ethernet MAC or FPD-Link interface, limited audio subsystem | Focused on powertrain and chassis control; not qualified for HUD or cluster display timing requirements | Select for ASIL-D powertrain control where display functionality is absent and deterministic interrupt latency is paramount |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT3DLBBHBQ1BZSGS uniquely integrates graphics composition, FPD-Link output, and ASIL-B safety mechanisms in a single die-reducing system-level complexity and eliminating external video interface ICs required by alternatives.
Availability
CYT3DLBBHBQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, domain controllers, and digital rearview mirrors requiring stable component supply, long-term lifecycle support, and ASIL-B certified silicon.
Supply support for CYT3DLBBHBQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT3DL belongs to the TRAVEO™ T2G product line, engineered specifically for automotive human-machine interface (HMI) systems demanding integrated graphics, real-time networking, and functional safety certification.
FAQ
Does CYT3DLBBHBQ1BZSGS support IEEE-1588 Precision Time Protocol?
Yes. The integrated 10/100 Mbps Ethernet MAC fully complies with IEEE-1588-2008 (PTPv2) and supports hardware timestamping for sub-microsecond synchronization across automotive networks. This enables deterministic time-coordinated operations between instrument clusters, ADAS ECUs, and central gateways without external timing ICs.
What is the maximum resolution supported by the FPD-Link interface?
The FPD-Link interface supports up to 1920 × 720 pixels at 110 MHz pixel clock, sufficient for HD-wide HUD projections. It operates in single-lane LVDS-compatible mode and includes built-in equalization for cable lengths up to 10 meters, meeting automotive EMC and signal integrity requirements.
How does the dual-bank flash architecture enable safe firmware updates?
Dual-bank flash allows one bank to execute active firmware while the other receives and validates new firmware images. Upon successful CRC and signature verification, the bootloader atomically switches banks-ensuring zero downtime and rollback capability if update fails, critical for ASIL-B-compliant OTA deployments.
Is the crypto engine enabled on CYT3DLBBHBQ1BZSGS per the datasheet footnote [1]?
Yes. Footnote [1] confirms crypto features-including AES-128/192/256, SHA-1/2/3, RSA/ECC acceleration, TRNG, and GCM-are implemented and functional on CYT3DLBBHBQ1BZSGS. These capabilities are verified in the production mask set and enabled via HSM firmware keys provisioned during secure boot.
CYT3DLBBHBQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz
- Connectivity:
- DMA, I2S, LVD, Temp Sensor, WDT
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 135
- Program Memory Size:
- 4.063MB (4.063M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT3DLBBHBQ1BZSGS FAQ
1.How can I place an order for CYT3DLBBHBQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT3DLBBHBQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT3DLBBHBQ1BZSGS reliable?
The price and inventory of CYT3DLBBHBQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT3DLBBHBQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT3DLBBHBQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT3DLBBHBQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT3DLBBHBQ1BZSGS?
CYT3DLBBHBQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT3DLBBHBQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT3DLBBHBQ1BZSGS?
For technical support, including CYT3DLBBHBQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT3DLBBHBQ1BZSGS requirements.
6.How does Aetrix verify that CYT3DLBBHBQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT3DLBBHBQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT3DLBBHBQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT3DLBBHBQ1BZSGS?
All CYT3DLBBHBQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT3DLBBHBQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT3DLBBHBQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT3DLBBHBQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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