My Inquiry
My Account
Infineon Technologies CYT4BB5CEBQ0AESGST
- Part No.:
- CYT4BB5CEBQ0AESGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
CYT4BB5CEBQ0AESGST.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 100QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,023
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4BB5CEBQ0AESGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 CPUs (250 MHz), one Arm® Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and LIN (16 channels). It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography (AES-256, ECC, SHA-512).
For engineers reviewing the CYT4BB5CEBQ0AESGST datasheet, CYT4BB5CEBQ0AESGST pinout, CYT4BB5CEBQ0AESGST application, or CYT4BB5CEBQ0AESGST equivalent, this page delivers verified technical context, validated package mapping (272-BGA, 16 × 16 mm, 0.8-mm ball pitch), confirmed pin functions, real-world use cases in automotive domain controllers, and two documented alternative MCUs with explicit functional and application-level differences.
Technical Context
The device implements a heterogeneous dual-core architecture: two lockstep-capable Cortex-M7 cores handle primary real-time control and signal processing, while the Cortex-M0+ manages peripheral offload, security services, and inter-processor communication via dedicated hardware mailbox. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM) and RWW flash supporting concurrent execution and FOTA updates in dual-bank mode.
Clocking supports multiple sources (IMO, ILO, ECO, WCO, PLL, FLL) with CSV supervision; power management offers five low-power modes (Active to Hibernate) with configurable BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA, 1.1 V on VCCD) and wakeup via GPIO, RTC, or EVTGEN timers. Safety mechanisms include SMPU, PPU, MCWDT, and LVD/OVD monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual Arm® Cortex®-M7 @ 250 MHz + single Cortex®-M0+ @ 100 MHz for peripheral/security offload |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA |
| RAM | 768 KB SRAM with selectable retention granularity per memory block |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 (non-ISO) |
| Ethernet Interface | 10/100 Mbps MAC with IEEE-802.1BA AVB and IEEE-1588 PTP support; MII/RMII PHY interface |
| Functional Safety | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC, MCWDT, CSV, LVD/BOD/OVD |
| Cryptography | HSM with AES-128/192/256, 3DES, RSA/ECC, SHA-1/2/3, CRC32, TRNG, and GCM mode |
Pinout & Package
This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm max, 0.8-mm ball pitch) with thermal pad and standard JEDEC footprint. Pin functions are defined per the CYT4BB series pin assignment table in Infineon's 002-26591 Rev. *H datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIOx | I/O supply rail | Configurable 1.8–5.5 V input per bank; enables mixed-voltage I/O interfacing |
| VDDD | Digital core supply | 1.1-V nominal regulated core voltage derived from 2.7–5.5 V input; monitored by BOD |
| VDDA | Analog supply | Separate 2.7–5.5 V rail for SAR ADCs and analog peripherals; independent BOD threshold |
| TCK/TMS/TDI/TDO | JTAG debug interface | IEEE-1149.1-compliant boundary-scan and programming access; supports ETM trace |
| SWDIO/SWCLK | Serial Wire Debug | Two-pin Arm® SWD interface for development and production programming |
| ETH_MDC/MDIO | Ethernet management interface | IEEE-802.3-compliant MDIO bus for PHY configuration and status polling |
| CANFDx_TX/CANFDx_RX | CAN FD transceiver interface | Differential pair per channel; supports up to 8 Mbps data rate with flexible bit timing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep support | Enables ASIL-B fault detection via hardware comparison of M7 core outputs during critical operations |
| Hardware Security Module (HSM) | Offloads cryptographic operations (AES-GCM, ECC signing) from application cores, reducing latency and attack surface |
| Smart I/O blocks | Five programmable logic units performing Boolean operations on GPIO signals without CPU intervention |
| Synchronized multi-ADC sampling | Simultaneous start of conversion across all three 12-bit SAR ADCs for motor current sensing and position estimation |
| Runtime-reconfigurable SCBs | 11 serial blocks each dynamically assignable as UART/I²C/SPI-enabling flexible peripheral routing in software-defined architectures |
Applications
| Body Control Module (BCM) | Advanced Lighting Control Unit |
|---|---|
Use Scenario: Centralized vehicle body electronics managing door locks, window lifts, mirror controls, and interior lighting. IC Role / Device Role / Timing Role: Primary controller executing real-time CAN FD messaging, LIN slave coordination, and PWM-based LED dimming with synchronized ADC feedback. Use Value: Dual M7 cores enable concurrent CAN FD stack processing and lighting algorithm execution; HSM secures OTA firmware updates against tampering. | Use Scenario: Adaptive front-lighting system (AFS) with dynamic beam shaping, glare-free high-beam, and ambient light compensation. IC Role / Device Role / Timing Role: Real-time motor control for stepper-driven headlamp actuators and closed-loop brightness regulation using SAR ADCs and TCPWM with dead-time insertion. Use Value: Synchronized 3-ADC sampling captures simultaneous phase currents; Smart I/O handles fast-response headlamp fail-safe logic without CPU load. |
| Automotive Gateway Controller | Electric Power Steering (EPS) Assist Module |
Use Scenario: In-vehicle network bridge aggregating CAN FD, LIN, and Ethernet traffic between domain controllers and ADAS ECUs. IC Role / Device Role / Timing Role: Ethernet MAC handles time-sensitive AVB streams; CAN FD interfaces route diagnostic and control messages; PPU isolates domains at hardware level. Use Value: IEEE-1588 PTP synchronization ensures deterministic latency for camera/video streaming; ASIL-B safety mechanisms protect gateway integrity. | Use Scenario: Torque assist computation and motor phase control in column-assist EPS systems with torque sensor feedback and motor temperature monitoring. IC Role / Device Role / Timing Role: High-speed TCPWM generation with dead-time control for 3-phase inverter; SAR ADC reads torque sensor, motor winding temp, and DC-link voltage. Use Value: 1 Msps ADC sampling enables precise current reconstruction; SECDED ECC on SRAM prevents silent corruption in torque calculation path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 @ 320 MHz; no Cortex-M0+; 4 MB flash; supports CAN XL (not CAN FD only); different HSM implementation (SE05x co-processor) | Better suited for CAN XL migration paths and higher clock-frequency deterministic control loops; lacks native LIN master capability | Select when future-proofing for CAN XL or requiring >300 MHz deterministic execution; verify LIN stack compatibility |
| Renesas RH850/U2A | Dual RH850 cores (not Arm); 3 MB flash; 512 KB RAM; supports CAN FD and Ethernet but no AVB/PTP; different safety architecture (no SECDED on all SRAM) | Stronger legacy AUTOSAR toolchain support; optimized for traditional ECU consolidation; limited crypto acceleration (no ECC/GCM) | Select for AUTOSAR Classic compliance and existing RH850 ecosystem integration; avoid if AVB or hardware ECC required |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT4BB5CEBQ0AESGST uniquely combines dual Arm M7 lockstep, integrated LIN masters, AVB/PTP Ethernet, and full HSM cryptography in a single die-making it optimal for next-gen body domain controllers requiring both safety and secure connectivity.
Availability
CYT4BB5CEBQ0AESGST is available at Aetrix Electronics and suitable for automotive body control modules, advanced lighting systems, gateway controllers, and electric power steering assist modules requiring stable component supply, long lifecycle support, and ASIL-B certification.
Supply support for CYT4BB5CEBQ0AESGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT4BB belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for high-integrity body and gateway applications demanding ASIL-B compliance, secure over-the-air updates, and heterogeneous multi-core processing.
FAQ
What is the maximum CAN FD data rate supported by CYT4BB5CEBQ0AESGST?
The device supports up to 8 Mbps CAN FD data rate per channel, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification v1.0 (non-ISO). Actual achievable rate depends on physical layer topology, transceiver selection, and bus length-verified through Infineon's ISO 16845:2015 conformance testing.
Does CYT4BB5CEBQ0AESGST include hardware support for IEEE-1588 Precision Time Protocol?
Yes, the integrated Ethernet MAC fully supports IEEE-1588 PTP, including timestamping of ingress/egress frames at the MAC layer. Hardware timestamp registers and event-triggered interrupts enable sub-microsecond synchronization accuracy in AVB audio/video bridging applications.
How many independent LIN channels does CYT4BB5CEBQ0AESGST support?
The device supports up to 16 independent LIN channels, each compliant with ISO 17987. Each channel operates as a LIN master or slave with configurable baud rates, checksum types, and frame scheduling-managed via dedicated LIN peripheral blocks without CPU overhead.
Is external memory encryption supported on CYT4BB5CEBQ0AESGST?
Yes, the external memory interface supports on-the-fly AES-128 encryption and decryption for data transferred over SPI or HYPERBUS™. This feature enables secure XIP execution from external flash while preventing unauthorized readout of firmware images.
CYT4BB5CEBQ0AESGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 72
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 55x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BB5CEBQ0AESGST FAQ
1.How can I place an order for CYT4BB5CEBQ0AESGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BB5CEBQ0AESGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BB5CEBQ0AESGST reliable?
The price and inventory of CYT4BB5CEBQ0AESGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BB5CEBQ0AESGST is usually 5 days.
3.What payment methods are accepted for CYT4BB5CEBQ0AESGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BB5CEBQ0AESGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BB5CEBQ0AESGST?
CYT4BB5CEBQ0AESGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BB5CEBQ0AESGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BB5CEBQ0AESGST?
For technical support, including CYT4BB5CEBQ0AESGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BB5CEBQ0AESGST requirements.
6.How does Aetrix verify that CYT4BB5CEBQ0AESGST is sourced from the original manufacturer or authorized distributors?
All CYT4BB5CEBQ0AESGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BB5CEBQ0AESGST meets industry standards.
7.What is the process for return or replacement of CYT4BB5CEBQ0AESGST?
All CYT4BB5CEBQ0AESGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BB5CEBQ0AESGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BB5CEBQ0AESGST part is unused and in its original packaging.
Return procedure for CYT4BB5CEBQ0AESGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4BB5CEBQ0AESGST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
