Infineon Technologies CYT4BB7CEBQ0AESGS
- Part No.:
- CYT4BB7CEBQ0AESGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
CYT4BB7CEBQ0AESGS.pdf
- Description:
- IC MCU 32BT 4.0625MB FLSH 144QFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,315
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4BB7CEBQ0AESGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 250-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 4160 KB code-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and LIN (16 channels). It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography (AES-256, ECC, SHA-512).
For engineers reviewing the CYT4BB7CEBQ0AESGS datasheet, CYT4BB7CEBQ0AESGS pinout, CYT4BB7CEBQ0AESGS application, or CYT4BB7CEBQ0AESGS equivalent, this page delivers verified technical context, package mapping, real-world use scenarios, and validated alternative options for automotive ECU design and FOTA-capable systems.
Technical Context
The device implements a heterogeneous dual-CPU architecture: two lockstep-capable 250-MHz Cortex®-M7 cores handle primary control and signal processing, while the 100-MHz Cortex®-M0+ manages peripheral offload and security services including eSHE/HSM. Inter-processor communication is hardware-accelerated via dedicated mailbox and semaphore units.
Functional safety is enforced through MPU, SMPU, PPU, SECDED ECC on flash/SRAM/TCM, MCWDT, and dual-threshold BOD (2.7 V / 3.0 V on VDDD/VDDA; 1.1 V on VCCD). Clocking includes IMO, ILO, ECO, WCO, PLL, and FLL with CSV supervision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual 250-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 4160 KB code-flash + 256 KB work-flash; supports RWW and dual-bank FOTA |
| SRAM | 768 KB with configurable retention granularity |
| CAN FD Channels | Up to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 |
| Ethernet Interface | 10/100 Mbps MAC supporting MII/RMII, IEEE-1588 PTP, and AVB |
| Security Engine | HSM with AES-128/192/256, 3DES, RSA/ECC, SHA-512/256/160, TRNG, GCM |
| ADC | Three 12-bit SAR ADCs (75 total external channels, up to 1 Msps, synchronized sampling) |
| Package | 272-ball BGA, 16 × 16 × 1.7 mm, 0.8-mm ball pitch |
Pinout & Package
CYT4BB7CEBQ0AESGS is housed in a 272-ball BGA package (16 × 16 × 1.7 mm, 0.8-mm ball pitch) with thermal pad and standard automotive I/O drive strength. Pin functions are defined per the CYT4BB series peripheral I/O map and include dedicated CAN FD transceiver pins (CAN0_TX/CAN0_RX through CAN7_TX/CAN7_RX), Ethernet PHY interface signals (TXD0–3, RXD0–3, CRS, COL, etc.), and multi-function GPIO banks supporting GPIO_STD, GPIO_ENH, and HSIO_STD modes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA, VDDD, VCCD | Analog/Digital/Core Power Supplies | Independent 2.7–5.5 V inputs with dedicated BOD thresholds (2.7 V/3.0 V on VDDD/VDDA; 1.1 V on VCCD) |
| CAN0_TX / CAN0_RX | CAN FD Channel 0 Differential Pair | High-speed (up to 8 Mbps) physical layer interface compliant with ISO 11898-1:2015 |
| ETH_TXD0–3, ETH_RXD0–3 | Ethernet MAC Data Bus | Supports MII or RMII PHY connection; enables IEEE-1588 timestamping and AVB traffic scheduling |
| SWDIO / SWCLK | Serial Wire Debug Interface | Enables non-intrusive debugging, flash programming, and ETM instruction/data trace |
| RTC_XTAL_IN / RTC_XTAL_OUT | Real-Time Clock Crystal Oscillator | Drives 32.768 kHz WCO for battery-backed timekeeping with automatic leap-year correction |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic firmware updates over-the-air without runtime interruption or external memory |
| Synchronized triple ADC sampling | Supports simultaneous current/voltage acquisition for field-oriented motor control with <100 ns skew |
| Hardware event generator (EVTGEN) | Provides deterministic wakeup from DeepSleep mode using programmable timers or peripheral triggers |
| Smart I/O logic blocks | Five configurable Boolean units enable real-time signal conditioning (AND/OR/XOR) at I/O level without CPU intervention |
| ASIL-B safety mechanisms | Includes SECDED ECC on all safety-critical memories, SMPU for inter-core memory isolation, and MCWDT with independent clock source |
Applications
| Body Control Module (BCM) | Advanced Gateway ECU |
|---|---|
Use Scenario: Centralized vehicle power distribution, lighting control, door/window actuation, and climate fan management. IC Role / Device Role / Timing Role: Primary controller executing ASIL-B-compliant safety routines, managing CAN FD backbone, and coordinating LIN slave nodes. Use Value: Dual Cortex-M7 cores allow separation of safety-critical (e.g., power cutoff) and non-safety tasks (e.g., UI animation), while 220 GPIOs support direct drive of relays and LEDs. | Use Scenario: Aggregation and routing of data between CAN FD domains, Ethernet backbone, and LIN subnetworks in zonal architectures. IC Role / Device Role / Timing Role: High-throughput gateway processor with concurrent CAN FD (8 ch), Ethernet MAC, and 16 LIN channels. Use Value: Hardware-accelerated packet filtering and time-synchronized forwarding via IEEE-1588 PTP ensures deterministic latency for ADAS sensor fusion traffic. |
| Electric Power Steering (EPS) Support MCU | Secure OTA Update Controller |
Use Scenario: Secondary controller monitoring torque sensor, motor phase currents, and EPS motor position feedback. IC Role / Device Role / Timing Role: Safety-assist node performing redundant ADC sampling, PWM generation with dead-time insertion, and fault reporting over CAN FD. Use Value: Synchronized triple ADC sampling and TCPWM blocks with PWM_DT mode enable precise motor phase control and real-time fault detection within <1 µs timing budget. | Use Scenario: Dedicated secure boot and firmware update manager co-located with main ECU application processor. IC Role / Device Role / Timing Role: HSM-executed cryptographic verification of signed firmware images prior to flash programming. Use Value: AES-256-GCM decryption and ECDSA signature validation occur in hardware, reducing update verification time to <50 ms and eliminating software-side crypto attack surface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single 320-MHz Cortex-M7 core; no Cortex-M0+ companion; 4 MB flash; supports CAN XL (not CAN FD only) | Lacks dual-core isolation for safety partitioning; requires external security co-processor for full HSM functionality | Preferred when CAN XL readiness and higher single-thread performance outweigh need for hardware-enforced core separation |
| Renesas RH850/U2A | Tri-core (400-MHz V850E3 + dual 200-MHz RH850 cores); 8 MB flash; proprietary toolchain; no native Ethernet MAC | Stronger ASIL-D capability but limited networking flexibility; relies on external PHY and switch for Ethernet connectivity | Selected for ultra-high-reliability powertrain applications where Ethernet is not required and legacy toolchain compatibility is critical |
Compared with S32K344 and RH850/U2A, CYT4BB7CEBQ0AESGS uniquely integrates dual M7 cores with an M0+ security coprocessor, on-die Ethernet MAC, and dual-bank flash-enabling certified ASIL-B gateways with autonomous FOTA and deterministic time-sensitive networking in a single package.
Availability
CYT4BB7CEBQ0AESGS is available at Aetrix Electronics and suitable for automotive body control modules, zonal gateway ECUs, electric power steering support units, and secure OTA update controllers requiring stable component supply across extended temperature ranges (–40°C to +125°C) and long lifecycle commitments.
Supply support for CYT4BB7CEBQ0AESGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure serving Tier-1 automotive suppliers and industrial OEMs.
CYT4BB belongs to the TRAVEO™ T2G family-designed specifically for next-generation automotive domain and zonal controllers requiring integrated functional safety, secure communication, and high-bandwidth interconnectivity (CAN FD + Ethernet).
FAQ
What is the maximum CAN FD data rate supported by CYT4BB7CEBQ0AESGS?
CYT4BB7CEBQ0AESGS supports CAN FD up to 8 Mbps per channel, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification v1.0. Actual achievable rate depends on physical layer topology and external transceiver capabilities-not internal controller limits.
Does CYT4BB7CEBQ0AESGS include hardware support for IEEE-1588 Precision Time Protocol?
Yes-the integrated Ethernet MAC includes full IEEE-1588 PTP hardware timestamping with sub-microsecond accuracy on transmit and receive paths, enabling time-synchronized communication across distributed automotive ECUs without software overhead.
How does the dual-bank flash architecture enable safe firmware updates?
Dual-bank flash allows one bank to execute active firmware while the other receives and validates new firmware images. Upon successful CRC and signature verification, the boot vector is atomically redirected-ensuring zero-downtime updates and guaranteed rollback on corruption or authentication failure.
Is external RAM required to use the SDHC interface?
No-SDHC interface supports direct attachment of eMMC, SD, or SDIO devices (e.g., Wi-Fi modules) without external RAM. It operates independently of internal SRAM and uses dedicated DMA channels for high-speed transfers up to 52 MHz DDR (eMMC) or 50 MHz (SD High Speed).
CYT4BB7CEBQ0AESGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 250MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 70x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BB7CEBQ0AESGS FAQ
1.How can I place an order for CYT4BB7CEBQ0AESGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BB7CEBQ0AESGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BB7CEBQ0AESGS reliable?
The price and inventory of CYT4BB7CEBQ0AESGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BB7CEBQ0AESGS is usually 5 days.
3.What payment methods are accepted for CYT4BB7CEBQ0AESGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BB7CEBQ0AESGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BB7CEBQ0AESGS?
CYT4BB7CEBQ0AESGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BB7CEBQ0AESGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BB7CEBQ0AESGS?
For technical support, including CYT4BB7CEBQ0AESGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BB7CEBQ0AESGS requirements.
6.How does Aetrix verify that CYT4BB7CEBQ0AESGS is sourced from the original manufacturer or authorized distributors?
All CYT4BB7CEBQ0AESGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BB7CEBQ0AESGS meets industry standards.
7.What is the process for return or replacement of CYT4BB7CEBQ0AESGS?
All CYT4BB7CEBQ0AESGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BB7CEBQ0AESGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BB7CEBQ0AESGS part is unused and in its original packaging.
Return procedure for CYT4BB7CEBQ0AESGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4BB7CEBQ0AESGS Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

