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Infineon Technologies CYT4BBBCEBQ0BZEGS

Part No.:
CYT4BBBCEBQ0BZEGS
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
272-LFBGA
Datasheet:
AetrixCYT4BBBCEBQ0BZEGS.pdf
Description:
IC MCU 32BT 4.0625MB FLSH 272BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:840

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Product details

Overview

CYT4BBBCEBQ0BZEGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual Arm® Cortex®-M7 CPUs (250 MHz), one Arm® Cortex®-M0+ CPU (100 MHz), 4160 KB code-flash, 768 KB SRAM, and hardware security including AES-128/192/256, RSA/ECC, SHA-256/512, and TRNG - deployed in high-end body-control units with CAN FD, Ethernet, and LIN connectivity.

For engineers reviewing the CYT4BBBCEBQ0BZEGS datasheet, CYT4BBBCEBQ0BZEGS pinout, CYT4BBBCEBQ0BZEGS application, or CYT4BBBCEBQ0BZEGS equivalent, this MCU supports ASIL-B functional safety, dual-bank FOTA updates, RWW flash operation, IEEE-802.3bw 10/100 Mbps Ethernet MAC, and up to eight CAN FD channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0.

Technical Context

The device implements a heterogeneous dual-core architecture: two lockstep-capable Cortex-M7 cores for primary real-time control and a dedicated Cortex-M0+ core for peripheral management and security offload. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM), dual-bank flash for atomic firmware updates, and configurable retention granularity across 768 KB SRAM.

Clocking uses multiple sources - IMO, ILO, ECO, WCO, PLL, and FLL - with hardware clock supervision (CSV) and multi-counter watchdog (MCWDT). Peripheral protection includes SMPU, PPU, and MPU, enabling partitioned execution environments for ASIL-B compliance in automotive body electronics.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core(s) Dual 250-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+
Flash Memory 4160 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA
SRAM 768 KB with selectable retention granularity per memory region
CAN FD Channels Up to 8 channels; compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0; up to 8 Mbps data rate
Ethernet Interface IEEE-802.3bw 10/100 Mbps MAC with MII/RMII PHY support; IEEE-1588 PTP and AVB compliant
Security Engine HSM with eSHE, AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and secure boot via digital signature verification
Functional Safety ASIL-B compliant: SECDED ECC on SRAM/flash/TCM, SMPU, PPU, MCWDT, CSV, BOD/OVD/LVD

Pinout & Package

This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm, 0.8-mm ball pitch) with thermal pad. Pin functions are defined per the CYT4BB series pinout specification and include dedicated power domains (VDDD, VDDA, VCCD), high-speed I/O banks, and dedicated debug (SWD/JTAG), CAN FD, Ethernet RMII/MII, and SCB interface pins.

Pin/Terminal Circuit Role Design Meaning
VDDD / VDDA / VCCD Core, analog, and digital supply rails Independent regulation paths enable precise noise isolation and ASIL-B voltage monitoring (BOD at 2.7 V / 3.0 V / 1.1 V)
TCK / TMS / TDI / TDO / nTRST JTAG debug interface IEEE-1149.1-compliant boundary scan and programming; supports ETM instruction/data trace
SWDIO / SWCLK Serial Wire Debug interface Reduced-pin-count debug path supporting flash programming and real-time trace over SWD
CANFD0_TX / CANFD0_RX Channel 0 CAN FD transceiver interface Differential signaling pair supporting up to 8 Mbps; requires external CAN FD transceiver (e.g., TJA1145)
ETH_MDIO / ETH_MDC / ETH_TXD[3:0] / ETH_RXD[3:0] Ethernet MAC physical layer interface RMII/MII-configurable signals; enables time-sensitive networking (TSN) via IEEE-1588 PTP timestamping

Key Features

Feature Design Value
Dual Cortex-M7 with cache 16-KB instruction + 16-KB data cache per M7 core; enables deterministic real-time response in body domain controllers
Hardware Security Module (HSM) On-die cryptographic acceleration for AES-GCM, RSA-4096, ECC-384, SHA-512, and secure boot with public-key verification
ASIL-B Safety Mechanisms MPU/SMPU/PPU partitioning, SECDED ECC on all critical memories, MCWDT, and clock supervision for fault containment
FOTA-ready Flash Architecture Dual-bank flash with atomic swap and RWW capability allows seamless in-vehicle firmware updates without system downtime
Configurable I/O Types GPIO_STD, GPIO_ENH, and HSIO_STD support mixed-signal timing requirements - e.g., LIN bus drive strength or CAN FD edge rate control

Applications

Body Control Module (BCM) Gateway Controller

Use Scenario: Centralized management of lighting, door locks, window lifts, and seat controls in premium vehicles.

IC Role / Device Role / Timing Role: Primary real-time controller executing ASIL-B-compliant diagnostics and LIN/CAN FD message routing.

Use Value: Dual M7 cores handle concurrent PWM motor control and secure CAN FD communication while M0+ manages crypto operations and peripheral arbitration.

Use Scenario: Aggregation and translation between vehicle subnetworks (CAN FD, LIN, Ethernet) in zonal architectures.

IC Role / Device Role / Timing Role: High-throughput gateway processor with integrated Ethernet MAC and eight CAN FD channels.

Use Value: IEEE-1588 PTP timestamping enables synchronized diagnostics across domains; RMII interface reduces PHY component count vs. MII.

Advanced Lighting Control Unit Secure Telematics Control Unit

Use Scenario: Adaptive front-lighting systems (AFS) requiring precise PWM dimming, thermal monitoring, and over-the-air calibration.

IC Role / Device Role / Timing Role: Real-time motor and LED driver controller with SAR ADC temperature sensing and TCPWM dead-time insertion.

Use Value: Synchronized sampling across three 12-bit SAR ADCs enables correlated thermal/current feedback; 75 TCPWM blocks support independent channel timing.

Use Scenario: Cellular-connected telematics unit performing secure OTA updates, encrypted log storage, and GNSS-assisted positioning.

IC Role / Device Role / Timing Role: Secure host processor managing eMMC/SDHC storage, TLS offload, and secure boot chain validation.

Use Value: On-die HSM accelerates TLS handshake and firmware signature verification; SDHC interface supports eMMC 5.1 at 52-MHz DDR for fast update staging.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Single Cortex-M7 (320 MHz), 8 MB flash, no integrated Ethernet MAC, supports CAN FD and LIN only Lacks native 10/100 Mbps Ethernet; requires external PHY and switch for domain gateway use Select when Ethernet is not required and higher flash density is prioritized over integrated networking
Renesas RH850/U2A 32-bit RXv3 core (200 MHz), 4 MB flash, ASIL-D capable, no Cortex-M architecture or HSM-based crypto acceleration Targets powertrain/safety-critical domains; lacks TRAVEO T2G's flexible SCB reconfiguration and Smart I/O logic Select for ASIL-D powertrain integration where legacy RX toolchain and safety certification reuse are critical

Compared with S32K344 and RH850/U2A, CYT4BBBCEBQ0BZEGS uniquely integrates Ethernet MAC with PTP support, dual-bank FOTA flash, and HSM-accelerated cryptography - making it optimal for zonal gateways and secure body domain controllers requiring both high-speed interconnect and robust firmware integrity.

Availability

CYT4BBBCEBQ0BZEGS is available at Aetrix Electronics and suitable for automotive body control modules, zonal gateways, advanced lighting systems, and secure telematics units requiring stable component supply, long lifecycle support, and ASIL-B-certified silicon.

Supply support for CYT4BBBCEBQ0BZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT4BBBCEBQ0BZEGS belongs to the TRAVEO™ T2G family - designed specifically for automotive body and gateway applications demanding ASIL-B compliance, secure over-the-air updates, and integrated high-speed networking (CAN FD + Ethernet).

FAQ

Does CYT4BBBCEBQ0BZEGS support IEEE-1588 Precision Time Protocol?

Yes, the integrated Ethernet MAC fully supports IEEE-1588 PTP for hardware timestamping of ingress/egress frames. It provides sub-microsecond synchronization accuracy when paired with a compliant PHY and oscillator, enabling time-sensitive networking in zonal architectures without external timing ICs.

What is the maximum CAN FD data rate supported by this MCU?

CYT4BBBCEBQ0BZEGS supports CAN FD data rates up to 8 Mbps in the data phase, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification v1.0. Actual achievable rate depends on external transceiver performance and physical layer topology, not MCU internal limitations.

How does the dual-bank flash architecture enable safe firmware updates?

The 4160 KB code-flash is partitioned into two independently erasable banks. During FOTA, new firmware is written to the inactive bank while the system runs from the active bank. Upon successful verification, the boot vector is atomically redirected - eliminating risk of bricking during power loss or corruption.

Is external RAM required for operation?

No. CYT4BBBCEBQ0BZEGS contains 768 KB on-chip SRAM with configurable retention modes, sufficient for most automotive body/gateway applications. External memory interfaces (SPI/HYPERBUS/SDHC) are optional for extended code/data storage or XIP execution, not mandatory for basic operation.

CYT4BBBCEBQ0BZEGS Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
272-LFBGA
Series:
Traveo™ T2G
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 90x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4BBBCEBQ0BZEGS FAQ

1.How can I place an order for CYT4BBBCEBQ0BZEGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4BBBCEBQ0BZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4BBBCEBQ0BZEGS reliable?

The price and inventory of CYT4BBBCEBQ0BZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BBBCEBQ0BZEGS is usually 5 days.

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4.How is shipping managed for CYT4BBBCEBQ0BZEGS?

CYT4BBBCEBQ0BZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4BBBCEBQ0BZEGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4BBBCEBQ0BZEGS?

For technical support, including CYT4BBBCEBQ0BZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BBBCEBQ0BZEGS requirements.

6.How does Aetrix verify that CYT4BBBCEBQ0BZEGS is sourced from the original manufacturer or authorized distributors?

All CYT4BBBCEBQ0BZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BBBCEBQ0BZEGS meets industry standards.

7.What is the process for return or replacement of CYT4BBBCEBQ0BZEGS?

All CYT4BBBCEBQ0BZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BBBCEBQ0BZEGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4BBBCEBQ0BZEGS part is unused and in its original packaging.

Return procedure for CYT4BBBCEBQ0BZEGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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