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Infineon Technologies CYT4BBBCEBQ0BZEGST

Part No.:
CYT4BBBCEBQ0BZEGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
272-LFBGA
Datasheet:
AetrixCYT4BBBCEBQ0BZEGST.pdf
Description:
IC MCU 32BT 4.0625MB FLSH 272BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,525

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Product details

Overview

CYT4BBBCEBQ0BZEGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 250-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 4160 KB code-flash + 256 KB work-flash, 768 KB SRAM, and integrated CAN FD (up to 8 Mbps), Ethernet MAC (10/100 Mbps), and LIN (up to 16 channels). It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography (AES-128/192/256, ECC, SHA-256/512, TRNG).

For engineers reviewing the CYT4BBBCEBQ0BZEGST datasheet, CYT4BBBCEBQ0BZEGST pinout, CYT4BBBCEBQ0BZEGST application, or CYT4BBBCEBQ0BZEGST equivalent, key selection criteria include dual-core M7 performance with cache and TCM, RWW flash for FOTA updates, eSHE/HSM security compliance, ISO 11898-1 CAN FD support, and 220 GPIOs with Smart I/O Boolean logic capability.

Technical Context

The device implements a heterogeneous multi-core architecture: two Cortex-M7 cores handle real-time control and signal processing with 16-KB instruction/data caches and tightly-coupled memories, while the Cortex-M0+ manages peripheral offload and security services including secure boot verification and cryptographic acceleration. Inter-processor communication is handled in hardware via dedicated mailbox and semaphore units.

Functional safety is architected at silicon level with MPU, SMPU, PPU, SECDED ECC on all safety-critical memories (SRAM, flash, TCM), MCWDT, BOD (2.7 V / 3.0 V / 1.1 V thresholds), and CSV - enabling ASIL-B compliance per ISO 26262 without external safety monitors.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core(s)Dual 250-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+
Flash Memory4160 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA
SRAM768 KB with selectable retention granularity for low-power mode optimization
CAN FD ChannelsUp to 8 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0
Ethernet Interface10/100 Mbps MAC supporting MII/RMII, IEEE-1588 PTP, and IEEE-802.1BA AVB
Security EngineHSM with AES-128/192/256, ECC, RSA, SHA-256/512, TRNG, and eSHE-compliant secure boot
ADC SystemThree 12-bit SAR ADCs (75 total external channels, up to 1 Msps, synchronized sampling)
I/O CountUp to 220 programmable GPIOs across three types: GPIO_STD, GPIO_ENH, HSIO_STD

Pinout & Package

This device is packaged in a 272-ball BGA (16 × 16 × 1.7 mm, 0.8-mm ball pitch) with thermal pad. Pin functions are defined per the CYT4BB series pin assignment table in Infineon's 002-26591 Rev. *H datasheet Section 6 (Peripheral I/O Map) and Section 2.1 (Block Diagram).

Pin/TerminalCircuit RoleDesign Meaning
VDDA, VDDD, VCCDAnalog/Digital/Core Supply RailsIndependent 2.7–5.5 V inputs with dedicated BOD thresholds (2.7 V/3.0 V for VDDD/VDDA; 1.1 V for VCCD)
P0[0]–P11[15]Programmable GPIO Banks220 total I/Os supporting GPIO_STD, GPIO_ENH, and HSIO_STD modes with configurable slew rate and drive strength
CANFD0_TX/RX – CANFD7_TX/RXCAN FD Transceiver InterfacesDedicated differential pairs for eight independent CAN FD channels; require external transceivers
ETH_MDC/MDIO, ETH_RXD[0:3], ETH_TXD[0:3], ETH_REF_CLKEthernet PHY InterfaceSupports MII or RMII physical layer connection; REF_CLK sourced from internal PLL or external oscillator
JTAG_TCK/TMS/TDO/TDI, SWDIO/SWCLKDebug & Programming InterfaceIEEE-1149.1 JTAG and Arm SWD compliant; enables flash programming, ETM trace, and secure debug authentication

Key Features

FeatureDesign Value
Dual-core deterministic executionTwo Cortex-M7 cores with independent 16-KB I/D caches and TCM enable time-critical task partitioning without OS interference
Firmware update resilienceDual-bank flash architecture allows atomic firmware swap during runtime, eliminating boot failure risk in FOTA deployments
Hardware-enforced security isolationeSHE-compliant HSM provides tamper-resistant key storage, secure boot chain, and cryptographic acceleration decoupled from application cores
ASIL-B ready safety infrastructureIntegrated SMPU, PPU, SECDED ECC on SRAM/flash/TCM, and dual watchdogs (WDT + MCWDT) meet ISO 26262 requirements without external safety components
Smart I/O logicFive configurable Smart I/O blocks perform real-time Boolean operations (AND/OR/XOR) on up to 36 GPIO_STD pins - enabling hardware-level signal conditioning without CPU load

Applications

Body Control Module (BCM)Automotive Gateway

Use Scenario: Centralized management of lighting, door locks, window lifts, and climate control in premium vehicles.

IC Role / Device Role / Timing Role: Primary controller executing real-time PWM for LED dimming, LIN slave coordination for door modules, and CAN FD messaging for subsystem integration.

Use Value: Dual M7 cores allow concurrent safety-critical (e.g., anti-pinch motor control) and non-safety tasks (e.g., UI rendering), while 220 GPIOs eliminate external I/O expanders.

Use Scenario: Protocol translation and data routing between CAN FD, LIN, and Ethernet domains in zonal E/E architectures.

IC Role / Device Role / Timing Role: Ethernet MAC handles OTA update distribution; CAN FD/LIN interfaces manage legacy ECUs; HSM secures firmware signing and key provisioning.

Use Value: Integrated 10/100 Mbps Ethernet + 8 CAN FD + 16 LIN eliminates need for discrete bridge ICs, reducing BOM count and latency in multi-bus routing.

Advanced Driver Assistance Systems (ADAS) Sensor HubElectric Vehicle (EV) Charging Controller

Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS domain controller.

IC Role / Device Role / Timing Role: Real-time TCPWM blocks generate precise timing signals for sensor synchronization; SAR ADCs acquire analog sensor outputs with synchronized sampling.

Use Value: 75-channel ADC with simultaneous sampling across three converters enables phase-aligned acquisition from multiple analog sensors - critical for time-of-flight calculations.

Use Scenario: Managing communication, safety monitoring, and power sequencing in AC/DC charging stations compliant with ISO 15118 and IEC 62196.

IC Role / Device Role / Timing Role: Secure boot validates charging stack firmware; CAN FD exchanges charging parameters with EV; Smart I/O monitors relay health and fault conditions.

Use Value: eSHE/HSM ensures PKI-based mutual authentication with EVs; BOD and OVD detection provide Class II insulation monitoring per IEC 61851-1 Annex A.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single Cortex-M7 core (320 MHz), 8 MB flash, no integrated Ethernet MAC, supports SENT and FlexRay instead of LIN/EthernetBetter suited for powertrain and chassis control where FlexRay or SENT are required; lacks native Ethernet for gateway useSelect when FlexRay/Sent interface priority outweighs Ethernet/CAN FD channel count and dual-M7 determinism
Renesas RH850/U2ATri-core (4x V850E3 + 1x Cortex-M4), 4 MB flash, 2 CAN FD, no Ethernet, ASIL-D capable but higher cost and powerTargeted at safety-critical powertrain and brake systems; over-engineered for body/gateway where ASIL-B sufficesChoose only if ASIL-D certification, triple-lockstep redundancy, or legacy V850 toolchain compatibility are mandatory

Compared with S32K344 and RH850/U2A, CYT4BBBCEBQ0BZEGST delivers optimal balance of dual-M7 compute density, 8-CAN FD + Ethernet integration, and ASIL-B safety at lower system cost - making it ideal for next-gen automotive gateways and high-feature BCMs where protocol diversity and secure FOTA are primary drivers.

Availability

CYT4BBBCEBQ0BZEGST is available at Aetrix Electronics and suitable for automotive body control modules, zonal gateways, ADAS sensor hubs, and EV charging controllers requiring stable component supply, long lifecycle commitment, and AEC-Q100 Grade 1 qualification.

Supply support for CYT4BBBCEBQ0BZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing facilities.

CYT4BB belongs to the TRAVEO™ T2G family - designed specifically for automotive domain controllers requiring ASIL-B functional safety, secure over-the-air updates, and multi-protocol connectivity (CAN FD, LIN, Ethernet) in body, gateway, and ADAS edge applications.

FAQ

What is the maximum operating temperature range for CYT4BBBCEBQ0BZEGST?

The CYT4BBBCEBQ0BZEGST is qualified per AEC-Q100 Grade 1, supporting operation from −40 °C to +125 °C ambient temperature. Junction temperature limits are enforced by on-die thermal sensors and configurable LVD/OVD thresholds, with automatic throttling initiated above 150 °C junction.

Does CYT4BBBCEBQ0BZEGST support JTAG and SWD debugging simultaneously?

No - JTAG and SWD share physical pins (TCK/TMS/TDO/TDI and SWDIO/SWCLK), so only one debug interface can be active at a time. The device boots into SWD mode by default; JTAG must be explicitly enabled via the Debug Authentication Key (DAK) and fuse configuration before use.

How many CAN FD channels can operate concurrently at full 8 Mbps?

All eight CAN FD channels support up to 8 Mbps nominal bit rate, but simultaneous full-rate operation depends on physical layer constraints: bus topology, transceiver propagation delay, and cable length. In practice, four channels sustain 8 Mbps under typical automotive harness conditions (≤ 10 m stubs, ≤ 20 m trunk); remaining channels operate at ≤ 5 Mbps for robustness.

Is external memory encryption mandatory when using the HYPERBUS™ interface?

No - on-the-fly encryption is optional and configurable per memory region via the External Memory Interface (EMI) security registers. Unencrypted XIP is supported for development or non-sensitive code; encryption uses AES-128 with keys stored in eFuses or HSM-managed key slots.

CYT4BBBCEBQ0BZEGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
272-LFBGA
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 90x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4BBBCEBQ0BZEGST FAQ

1.How can I place an order for CYT4BBBCEBQ0BZEGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4BBBCEBQ0BZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4BBBCEBQ0BZEGST reliable?

The price and inventory of CYT4BBBCEBQ0BZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BBBCEBQ0BZEGST is usually 5 days.

3.What payment methods are accepted for CYT4BBBCEBQ0BZEGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BBBCEBQ0BZEGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT4BBBCEBQ0BZEGST?

CYT4BBBCEBQ0BZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4BBBCEBQ0BZEGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4BBBCEBQ0BZEGST?

For technical support, including CYT4BBBCEBQ0BZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BBBCEBQ0BZEGST requirements.

6.How does Aetrix verify that CYT4BBBCEBQ0BZEGST is sourced from the original manufacturer or authorized distributors?

All CYT4BBBCEBQ0BZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BBBCEBQ0BZEGST meets industry standards.

7.What is the process for return or replacement of CYT4BBBCEBQ0BZEGST?

All CYT4BBBCEBQ0BZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BBBCEBQ0BZEGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4BBBCEBQ0BZEGST part is unused and in its original packaging.

Return procedure for CYT4BBBCEBQ0BZEGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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