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Infineon Technologies CYT4BF8CDDQ0AEEGS
- Part No.:
- CYT4BF8CDDQ0AEEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
CYT4BF8CDDQ0AEEGS.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 176QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,200
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Product details
Overview
CYT4BF8CDDQ0AEEGS from Infineon is a dual-core automotive microcontroller featuring two 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Cortex®-M0+ CPU, 8384 KB code-flash with RWW support, ASIL-B functional safety certification, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, and FlexRay interfaces-designed for high-end body-control units in modern vehicles.
For engineers reviewing the CYT4BF8CDDQ0AEEGS datasheet, CYT4BF8CDDQ0AEEGS pinout, CYT4BF8CDDQ0AEEGS application, or CYT4BF8CDDQ0AEEGS equivalent, key selection criteria include dual-M7 core timing determinism, flash update flexibility via FOTA-ready dual-bank mode, hardware-accelerated cryptography (AES-256, ECC, SHA-512), and multi-protocol communication concurrency across CAN FD, LIN, Ethernet, and FlexRay.
Technical Context
The CYT4BF8CDDQ0AEEGS implements a heterogeneous multi-CPU architecture: primary real-time processing is handled by two lockstep-capable Cortex®-M7 cores with 16-KB I/D caches and TCM, while the Cortex®-M0+ manages peripheral offload and security services including eSHE/HSM boot verification and AES-GCM encryption. Inter-processor communication uses dedicated hardware mailboxes and shared memory with SMPU enforcement.
Its safety architecture includes SECDED ECC on all SRAM, flash, and TCM; MPU/SMPU/PPU protection layers; MCWDT and CSV clock supervision; and BOD/OVD/LVD monitoring across VDDD, VDDA, and VCCD rails-enabling ASIL-B compliance per ISO 26262 without external safety monitors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Two 350-MHz Arm® Cortex®-M7 + one 100-MHz Cortex®-M0+, enabling deterministic real-time control with secure peripheral management |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash, supporting Read-While-Write and dual-bank FOTA updates |
| SRAM | 1024 KB with configurable retention granularity for low-power state preservation |
| Cryptographic Acceleration | AES-128/192/256, 3DES, RSA/ECC, SHA-1/2/3, TRNG, and GCM mode-hardware-accelerated for secure boot and OTA firmware signing |
| Communication Interfaces | Up to 10 CAN FD (8 Mbps), 11 SCB (I²C/SPI/UART), 20 LIN, 2x Gigabit Ethernet MAC (RGMII/GMII), and FlexRay v2.1 (10 Mbps) |
| Analog Peripherals | Three 12-bit SAR ADCs (99 external channels, 1 Msps), synchronized sampling for motor-sense applications |
| Safety Certification | ASIL-B compliant per ISO 26262 with SECDED ECC, SMPU, PPU, MCWDT, and voltage/clock supervision |
Pinout & Package
Package: 320-ball BGA, 17 mm × 17 mm × 1.7 mm max, 0.8-mm ball pitch, RoHS-compliant, automotive-grade (–40°C to +125°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 1.71–5.5-V I/O banks enabling mixed-voltage interface design |
| VDDD/VDDA/VCCD | Core/Analog/DDR Supply | Dedicated regulated rails: 1.1-V core, 2.7–5.5-V analog, and DDR I/O supply with BOD thresholds at 1.1 V, 2.7 V, and 3.0 V |
| TCK/TMS/TDO/TDI/nTRST | JTAG Debug Interface | IEEE-1149.1-compliant boundary scan and debug access for production test and firmware validation |
| SWDIO/SWCLK | Serial Wire Debug | Two-pin Arm® SWD interface supporting ETM instruction/data trace and secure debug authentication |
| ETH_RXD[0:3]/ETH_TXD[0:3] | Gigabit Ethernet PHY Interface | RGMII-compliant 4-bit receive/transmit data lanes with clock enable and control signals for deterministic AVB/PTP timing |
| CANFD0_TX/CANFD0_RX | CAN FD Channel 0 Physical Layer | Differential transceiver interface supporting ISO 11898-1:2015 and Bosch CAN FD v1.0 up to 8 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic firmware updates over-the-air without halting real-time execution or requiring external memory |
| Hardware Security Module (HSM) | Provides tamper-resistant key storage, secure boot verification, and cryptographic acceleration independent of main CPU execution |
| ASIL-B safety mechanisms | Includes hardware-enforced memory protection (SMPU/PPU), clock/voltage supervisors, and SECDED ECC on all safety-critical memories |
| Multi-protocol concurrency | Simultaneous operation of CAN FD, LIN, Ethernet, and FlexRay with dedicated DMA controllers (P-DMA0/P-DMA1/M-DMA0) preventing bus contention |
| Smart I/O logic blocks | Five programmable Boolean logic units supporting autonomous GPIO signal conditioning without CPU intervention |
Applications
| Body Control Module (BCM) | Advanced Driver Assistance Systems (ADAS) Domain Controller |
|---|---|
Use Scenario: Centralized vehicle body functions including lighting, door locks, window lift, and climate control with OTA update capability. IC Role / Device Role / Timing Role: Primary application processor managing real-time PWM for LED dimming, LIN for mirror/seat modules, and CAN FD for gateway communication. Use Value: Dual M7 cores ensure deterministic response to safety-critical inputs (e.g., brake light activation), while HSM secures firmware updates against unauthorized modification. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic data for parking assist and blind-spot detection. IC Role / Device Role / Timing Role: High-bandwidth data concentrator using Gigabit Ethernet MAC for camera streaming and CAN FD for actuator command distribution. Use Value: RGMII interface supports 1 Gbps video transport with IEEE-1588 PTP timestamping for sub-microsecond sensor synchronization. |
| Electric Powertrain Gateway | Automotive Audio Domain Controller |
Use Scenario: Communication bridge between battery management system (BMS), motor controller, and infotainment over multiple isolated CAN FD networks. IC Role / Device Role / Timing Role: Fault-tolerant gateway with dual CAN FD controllers and FlexRay for redundancy-critical powertrain messaging. Use Value: FlexRay v2.1 interface provides deterministic 10 Mbps time-triggered communication for torque request arbitration and fault reporting. | Use Scenario: Digital audio routing and processing unit connecting microphones, amplifiers, and head unit via I²S/TDM interfaces. IC Role / Device Role / Timing Role: Audio subsystem controller with three independent I²S interfaces supporting master/slave TDM configurations for multi-zone audio. Use Value: Synchronized sampling across all three SAR ADCs enables phase-aligned acoustic echo cancellation across cabin microphone arrays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single 320-MHz Arm® Cortex®-M7 core; no Cortex®-M0+ security co-processor; 4 MB flash; supports CAN FD and Ethernet but lacks FlexRay | Targeted at mid-tier body electronics without FlexRay or dual-core real-time partitioning requirements | Select when FlexRay integration and hardware-enforced security separation are not required |
| Renesas RH850/U2A | 32-bit proprietary core (not Arm); 16 MB flash; ASIL-D capable; supports CAN FD and FlexRay but no integrated Ethernet MAC | Used in powertrain ECU where highest functional safety level and non-Arm toolchain compatibility are prioritized | Select when ASIL-D certification and legacy RH850 ecosystem integration outweigh need for Ethernet connectivity |
Compared with S32K344 and RH850/U2A, CYT4BF8CDDQ0AEEGS uniquely combines dual Arm® M7 real-time determinism, integrated Gigabit Ethernet MAC with AVB/PTP, FlexRay v2.1, and hardware HSM-all in a single ASIL-B-certified package optimized for domain-centralized automotive architectures.
Availability
CYT4BF8CDDQ0AEEGS is available at Aetrix Electronics and suitable for high-end body-control units, ADAS domain controllers, electric powertrain gateways, and automotive audio domain controllers requiring stable component supply across extended automotive temperature ranges and long lifecycle commitments.
Supply support for CYT4BF8CDDQ0AEEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure serving Tier-1 automotive suppliers and OEMs.
The TRAVEO™ T2G product line delivers scalable, ASIL-certified Arm®-based MCUs for automotive domain controllers-designed to consolidate body, chassis, and infotainment functions onto unified, secure, and upgradable platforms.
FAQ
What is the maximum operating temperature range for CYT4BF8CDDQ0AEEGS?
The CYT4BF8CDDQ0AEEGS is qualified for automotive operation from –40°C to +125°C ambient temperature, with full functionality and guaranteed electrical specifications across this range per AEC-Q100 Grade 1 requirements. Thermal derating is not required below 125°C junction temperature, and the device includes on-die temperature sensors calibrated for junction monitoring.
Does CYT4BF8CDDQ0AEEGS support secure boot with public-key verification?
Yes. CYT4BF8CDDQ0AEEGS implements hardware-accelerated secure boot using ECDSA or RSA-2048 digital signature verification against immutable ROM-based boot code. Public keys are stored in OTP eFuses, and the boot image must be signed with the corresponding private key-enforcing chain-of-trust before any user code executes.
How many CAN FD channels can operate simultaneously on CYT4BF8CDDQ0AEEGS?
CYT4BF8CDDQ0AEEGS supports up to 10 independent CAN FD channels, each configurable with separate bit-rate settings (up to 8 Mbps nominal), message RAM allocation, and interrupt vectors. All 10 channels can transmit and receive concurrently without CPU intervention using dedicated P-DMA0 channels and hardware message filtering.
Is external memory encryption supported when using the HYPERBUS™ interface?
Yes. The external memory interface supports on-the-fly AES-128 encryption and decryption of data transferred over HYPERBUS™ or SPI, using keys stored in the HSM's secure key store. Encryption is enabled per-memory-region configuration and operates transparently during Execute-In-Place (XIP) or DMA transfers without software overhead.
CYT4BF8CDDQ0AEEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 148
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 99x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BF8CDDQ0AEEGS FAQ
1.How can I place an order for CYT4BF8CDDQ0AEEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BF8CDDQ0AEEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BF8CDDQ0AEEGS reliable?
The price and inventory of CYT4BF8CDDQ0AEEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BF8CDDQ0AEEGS is usually 5 days.
3.What payment methods are accepted for CYT4BF8CDDQ0AEEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BF8CDDQ0AEEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BF8CDDQ0AEEGS?
CYT4BF8CDDQ0AEEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BF8CDDQ0AEEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BF8CDDQ0AEEGS?
For technical support, including CYT4BF8CDDQ0AEEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BF8CDDQ0AEEGS requirements.
6.How does Aetrix verify that CYT4BF8CDDQ0AEEGS is sourced from the original manufacturer or authorized distributors?
All CYT4BF8CDDQ0AEEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BF8CDDQ0AEEGS meets industry standards.
7.What is the process for return or replacement of CYT4BF8CDDQ0AEEGS?
All CYT4BF8CDDQ0AEEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BF8CDDQ0AEEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BF8CDDQ0AEEGS part is unused and in its original packaging.
Return procedure for CYT4BF8CDDQ0AEEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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