My Inquiry
My Account
Infineon Technologies CYT4BF8CEDQ0AEEGS
- Part No.:
- CYT4BF8CEDQ0AEEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
CYT4BF8CEDQ0AEEGS.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 176QFP
- Quantity:
- Payment:
- Shipping:
Inventory:624
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4BF8CEDQ0AEEGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Arm® Cortex®-M0+ CPU, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, and FlexRay for high-end body-control units.
For engineers reviewing the CYT4BF8CEDQ0AEEGS datasheet, CYT4BF8CEDQ0AEEGS pinout, CYT4BF8CEDQ0AEEGS application, or CYT4BF8CEDQ0AEEGS equivalent, this MCU delivers ASIL-B functional safety, hardware-accelerated cryptography (AES-128/192/256, ECC, SHA-256/512), RWW flash, and 240 GPIOs with wake-from-Hibernate capability - critical for automotive ECU design and OTA firmware updates.
Technical Context
The CYT4BF8CEDQ0AEEGS implements a heterogeneous multi-core architecture: two lockstep-capable Cortex-M7 cores handle real-time control and signal processing, while the Cortex-M0+ manages peripheral offload and security services including secure boot via digital signature verification and HSM-compliant eSHE.
Its system-level timing and safety infrastructure includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM), SMPU/PPU-based memory/peripheral protection, MCWDT, CSV, and dual-threshold BOD (2.7 V / 3.0 V on VDDD/VDDA; 1.1 V on VCCD), enabling compliance with ISO 26262 ASIL-B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for asymmetric workload partitioning |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash with Read-While-Write and dual-bank FOTA support |
| SRAM | 1024 KB with selectable retention granularity for low-power mode optimization |
| Cryptographic Acceleration | AES-128/192/256, 3DES, RSA/ECC, SHA-1/2/3 (up to SHA-512), TRNG, GCM mode |
| Automotive Interfaces | Up to 10 CAN FD (8 Mbps), 2x Gigabit Ethernet MAC (MII/RMII/RGMII), FlexRay v2.1 (10 Mbps), 20 LIN |
| Safety Certification | AEC-Q100 qualified; ASIL-B compliant with MPU/SMPU/PPU, SECDED ECC, MCWDT, CSV, BOD/OVD/LVD |
| I/O Count | Up to 240 programmable GPIOs across three I/O types (GPIO_STD, GPIO_ENH, HSIO_STD) |
Pinout & Package
Package: 320-BGA, 17 × 17 × 1.7 mm (max), 0.8-mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA, VDDD, VCCD | Analog/Digital/Core supply rails | Independent 2.7–5.5 V inputs with dedicated BOD thresholds (2.7/3.0 V for VDDA/VDDD; 1.1 V for VCCD) |
| XTAL_IN/XTAL_OUT | External crystal oscillator interface | Supports ECO up to 40 MHz for precise clock generation and PLL/FLL reference |
| ETH_RXD[3:0]/TXD[3:0] | Gigabit Ethernet PHY data lanes | RGMII-compliant 4-bit receive/transmit paths enabling 1000BASE-T operation |
| CANFD_TX[9:0]/RX[9:0] | CAN FD transceiver signal pairs | 10 independent differential CAN FD channels supporting ISO 11898-1:2015 and Bosch CAN FD v1.0 |
| JTAG_TCK/TMS/TDI/TDO, SWDIO/SWCLK | Debug interface signals | IEEE-1149.1 JTAG and Arm SWD ports supporting ETM instruction/data trace and secure debug authentication |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep support | Enables ASIL-B fault detection via M7 core comparison without external watchdog dependency |
| Hardware Secure Boot | Verifies firmware authenticity using ECDSA signatures before execution, preventing unauthorized code injection |
| Flexible Power Modes | Five modes (Active, Sleep, Low-power Sleep, Deep Sleep, Hibernate) with configurable wake sources including 2-pin Hibernate wakeup |
| On-the-fly External Memory Encryption | Decrypts XIP-executed code from SPI/HYPERBUS™ interfaces in real time using AES-GCM keys stored in eFuses |
| Smart I/O Boolean Logic | Five independent Smart I/O blocks perform combinational logic (AND/OR/XOR) on up to 36 GPIO_STD pins without CPU intervention |
Applications
| Body Control Module (BCM) | Advanced Driver Assistance Systems (ADAS) Domain Controller |
|---|---|
Use Scenario: Centralized vehicle body management including lighting, door locks, window lifts, and climate control. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant BSW and complex application software with real-time CAN FD and LIN coordination. Use Value: Dual M7 cores enable concurrent execution of safety-critical (e.g., anti-pinch) and non-safety tasks; 10 CAN FD channels reduce gateway complexity in zonal architectures. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for parking assistance and blind-spot detection. IC Role / Device Role / Timing Role: High-bandwidth data concentrator with Gigabit Ethernet MACs synchronizing time-sensitive sensor streams via IEEE-1588 PTP. Use Value: RGMII interfaces support deterministic latency <1 µs; hardware CRC32 and SHA-256 accelerate secure sensor data integrity checks. |
| Electric Power Steering (EPS) ECU | Vehicle-to-Everything (V2X) Communication Gateway |
Use Scenario: Real-time motor torque control and fault monitoring in steer-by-wire systems. IC Role / Device Role / Timing Role: Safety-critical controller running ASIL-B motor control algorithms with synchronized 12-bit SAR ADC sampling across 99 channels. Use Value: Simultaneous ADC scanning of motor phase currents and temperature sensors ensures sub-µs timing correlation; TCPWM blocks generate PWM_DT waveforms with programmable dead time. | Use Scenario: Secure DSRC/C-V2X message routing between onboard units (OBU) and roadside units (RSU). IC Role / Device Role / Timing Role: Cryptographic gateway performing TLS handshake acceleration, ECDSA signature verification, and AES-GCM encryption/decryption at line rate. Use Value: Dedicated crypto engine processes >1000 ECDSA verifications/sec; FlexRay interface enables legacy vehicle network bridging with fault-tolerant dual-channel operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K398 | Single 320-MHz Arm® Cortex®-M7 core; no Cortex®-M0+ companion; 6 MB flash; supports CAN XL but not FlexRay | Targeted at chassis/safety domains with CAN XL readiness; lacks FlexRay for legacy powertrain integration | Select when CAN XL adoption is prioritized over FlexRay compatibility and dual-core deterministic partitioning |
| Renesas RH850/U2A | 400-MHz RH850 core (not Arm); 12 MB flash; supports CAN FD and FlexRay; no integrated Ethernet MAC | Focused on powertrain and braking systems; requires external PHY for Ethernet connectivity | Choose for legacy RH850 toolchain continuity and maximum flash density where integrated Gigabit Ethernet is unnecessary |
Compared with S32K398 and RH850/U2A, CYT4BF8CEDQ0AEEGS uniquely combines dual Arm M7 cores, integrated Gigabit Ethernet MAC with RGMII, and FlexRay - making it optimal for next-gen zonal gateways requiring both legacy bus support and high-speed domain interconnect.
Availability
CYT4BF8CEDQ0AEEGS is available at Aetrix Electronics and suitable for automotive body control modules, ADAS domain controllers, electric power steering ECUs, and V2X communication gateways requiring stable component supply and long-term lifecycle assurance.
Supply support for CYT4BF8CEDQ0AEEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.
CYT4BF belongs to the TRAVEO™ T2G product line, designed specifically for ASIL-B automotive applications requiring high-performance multi-core processing, integrated networking (CAN FD, Ethernet, FlexRay), and hardware-enforced security for ECU consolidation.
FAQ
What is the maximum operating frequency of the Cortex-M7 cores in CYT4BF8CEDQ0AEEGS?
The dual Arm® Cortex®-M7 CPUs operate at up to 350 MHz each, with single-cycle multiply, FPU support, and 16-KB instruction/data caches. This frequency is sustained under automotive temperature range (–40 °C to +125 °C) with full voltage scaling and thermal derating per Infineon's AEC-Q100 qualification report.
Does CYT4BF8CEDQ0AEEGS support IEEE-1588 Precision Time Protocol?
Yes - both Gigabit Ethernet MAC interfaces comply with IEEE-1588-2008 and IEEE-1588-2019 (PTPv2), enabling hardware timestamping of ingress/egress frames with sub-100 ns accuracy and transparent clock functionality for time-synchronized ADAS sensor networks.
How many CAN FD channels does CYT4BF8CEDQ0AEEGS support, and what is the maximum data rate?
CYT4BF8CEDQ0AEEGS supports up to 10 CAN FD channels, each capable of data rates up to 8 Mbps in the fast-phase, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification v1.0. Physical layer limitations (transceiver and topology) govern actual achievable speed.
Is external memory encryption supported, and how is it implemented?
Yes - the external memory interface supports on-the-fly AES-128-GCM encryption/decryption for SPI and HYPERBUS™ devices. Keys are stored in one-time-programmable eFuses, and decryption occurs transparently during XIP fetches, ensuring code confidentiality without software overhead.
CYT4BF8CEDQ0AEEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+/M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 148
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 99x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BF8CEDQ0AEEGS FAQ
1.How can I place an order for CYT4BF8CEDQ0AEEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BF8CEDQ0AEEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BF8CEDQ0AEEGS reliable?
The price and inventory of CYT4BF8CEDQ0AEEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BF8CEDQ0AEEGS is usually 5 days.
3.What payment methods are accepted for CYT4BF8CEDQ0AEEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BF8CEDQ0AEEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BF8CEDQ0AEEGS?
CYT4BF8CEDQ0AEEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BF8CEDQ0AEEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BF8CEDQ0AEEGS?
For technical support, including CYT4BF8CEDQ0AEEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BF8CEDQ0AEEGS requirements.
6.How does Aetrix verify that CYT4BF8CEDQ0AEEGS is sourced from the original manufacturer or authorized distributors?
All CYT4BF8CEDQ0AEEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BF8CEDQ0AEEGS meets industry standards.
7.What is the process for return or replacement of CYT4BF8CEDQ0AEEGS?
All CYT4BF8CEDQ0AEEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BF8CEDQ0AEEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BF8CEDQ0AEEGS part is unused and in its original packaging.
Return procedure for CYT4BF8CEDQ0AEEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4BF8CEDQ0AEEGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
