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Infineon Technologies CYT4BFBCHDQ0BZEGS

Name: CYT4BFBCHDQ0BZEGS
Brand: Infineon Technologies
SKU: CYT4BFBCHDQ0BZEGS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYT4BFBCHDQ0BZEGS

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 272-LFBGA

Datasheet:: CYT4BFBCHDQ0BZEGS.pdf

Description:: IC MCU 32BT 8.1875MB FLSH 272BGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYT4BFBCHDQ0BZEGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Cortex®-M0+ CPU, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, FlexRay, and LIN interfaces. It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography acceleration.

For engineers reviewing the CYT4BFBCHDQ0BZEGS datasheet, CYT4BFBCHDQ0BZEGS pinout, CYT4BFBCHDQ0BZEGS application, or CYT4BFBCHDQ0BZEGS equivalent, this page delivers verified technical context, package mapping, real-world use cases in automotive domain controllers, and validated alternative options for ECU design continuity.

Technical Context

The device implements a heterogeneous multi-core architecture: two lockstep-capable Cortex®-M7 cores handle primary real-time control and signal processing, while the Cortex®-M0+ manages peripheral offload, security services, and inter-processor communication via hardware mailbox. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM) and RWW flash supporting FOTA updates in dual-bank mode.

Clock and power management integrate IMO/ILO/ECO/WCO oscillators with PLL/FLL, plus five low-power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA; 1.1 V on VCCD) and wakeup sources including 240 GPIOs, RTC alarms, and event generators.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core(s)	Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+
Flash Memory	8384 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA
SRAM	1024 KB with selectable retention granularity for low-power state preservation
CAN FD Channels	Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0
Ethernet MAC	Two 10/100/1000 Mbps IEEE-802.3az-compliant interfaces with RGMII/GMII/MII/RMII PHY support
Functional Safety	ASIL-B compliant with SMPU, PPU, MCWDT, SECDED ECC, and clock/voltage supervision
Cryptography Engine	HSM with AES-128/192/256, SHA-512/256/160, RSA/ECC, TRNG, and GCM mode

Pinout & Package

Package: 320-ball BGA, 17 mm × 17 mm × 1.7 mm max, 0.8-mm ball pitch.

Pin/Terminal	Circuit Role	Design Meaning
VDDD / VDDA	Core & Analog Power Supply	2.7–5.5 V input; regulated internally to 1.1 V core supply with brown-out detection at 2.7 V / 3.0 V
VCCD	Digital I/O Supply	1.1 V nominal; brown-out detection threshold at 1.1 V for I/O domain integrity
TCK / TMS / TDI / TDO	JTAG Debug Interface	IEEE-1149.1-compliant boundary scan and debug access; supports ETM instruction/data trace
SWDIO / SWCLK	Serial Wire Debug	Arm® SWD port for low-pin-count debug and programming via SWD interface
ETH_RXD[3:0] / ETH_TXD[3:0]	Gigabit Ethernet Data Lanes	RGMII interface pins supporting 1000 Mbps operation with precise timing alignment
CANFD0_TX / CANFD0_RX	CAN FD Channel 0 Differential Pair	Physical layer interface for up to 8 Mbps data rate; requires external CAN FD transceiver

Key Features

Feature	Design Value
Dual-core lockstep support	Enables ASIL-B compliance through redundant M7 execution and hardware comparison logic
Hardware Security Module (HSM)	Offloads cryptographic operations (AES, SHA, RSA/ECC) from main cores, enabling secure boot and OTA firmware validation
Flexible TCPWM blocks	102 × 16-bit + 16 × 32-bit timers supporting motor control PWM_DT, quadrature decoding, and synchronized ADC sampling
Runtime-reconfigurable SCBs	11 serial communication blocks each configurable as UART, SPI, or I²C - no fixed peripheral pin assignment required
Smart I/O logic	Five programmable logic blocks performing Boolean operations on up to 36 GPIO_STD signals for hardware-level event filtering

Applications

Body Control Module (BCM)

Gateway ECU

Use Scenario: Centralized vehicle body functions including door locks, lighting, window lift, and seat control.

IC Role / Device Role / Timing Role: Primary controller executing real-time CAN FD messaging, LIN slave coordination, and secure firmware updates.

Use Value: Dual M7 cores enable concurrent safety-critical actuation and diagnostics; HSM ensures authenticated FOTA without host CPU involvement.

Use Scenario: Aggregation and routing of data between CAN FD, FlexRay, Ethernet, and LIN domains in zonal architectures.

IC Role / Device Role / Timing Role: High-throughput gateway processor managing time-synchronized AVB/PTP traffic and protocol translation.

Use Value: Two IEEE-802.3az Ethernet MACs with RGMII support enable deterministic 1 Gbps backbone connectivity; FlexRay V2.1 ensures fault-tolerant chassis communication.

Advanced Lighting Controller

Power Distribution Unit (PDU)

Use Scenario: Adaptive front-lighting systems (AFS) with dynamic beam shaping and thermal monitoring.

IC Role / Device Role / Timing Role: Real-time PWM generation for LED drivers, SAR ADC acquisition for temperature/current feedback, and CAN FD status reporting.

Use Value: 15 × 16-bit motor-control timers deliver precise dead-time PWM; 12-bit SAR ADCs sample 99 channels at 1 Msps for closed-loop thermal regulation.

Use Scenario: Smart 12 V/48 V power switching with load monitoring, short-circuit protection, and energy logging.

IC Role / Device Role / Timing Role: Safety-monitored power manager using SMPU/PPU to isolate critical loads and enforce ASIL-B fault response.

Use Value: Peripheral Protection Unit (PPU) enforces memory-mapped register access control per channel; SECDED ECC prevents silent corruption in power-state configuration registers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP S32K344	Single 320-MHz Arm® Cortex®-M7 core; 8 MB flash; no integrated Ethernet MAC; supports CAN FD (up to 8 ch) and FlexRay	Lacks dual M7 lockstep and Gigabit Ethernet; optimized for chassis/safety ECUs rather than high-bandwidth gateways	Select when Ethernet is not required and cost-sensitive ASIL-B designs prioritize toolchain maturity over bandwidth
Renesas RH850/U2A	400-MHz RH850 core (not Arm); 16 MB flash; 10 CAN FD ch; no integrated Ethernet; supports GbE only via external PHY + PCIe	Stronger legacy automotive software ecosystem; no native HSM-security relies on external SBC or discrete HSM	Prefer for brownfield programs migrating from RH850 legacy platforms where Arm ecosystem adoption is constrained

Compared with NXP S32K344 and Renesas RH850/U2A, CYT4BFBCHDQ0BZEGS uniquely integrates dual lockstep M7 cores, two native Gigabit Ethernet MACs, and a certified HSM-enabling single-chip gateway, lighting, and PDU solutions with full ASIL-B evidence coverage and reduced BOM count.

Availability

CYT4BFBCHDQ0BZEGS is available at Aetrix Electronics and suitable for automotive body-control modules, zonal gateways, adaptive lighting systems, and smart power distribution units requiring stable component supply across extended production lifecycles.

Supply support for CYT4BFBCHDQ0BZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT4BF belongs to the TRAVEO™ T2G family, designed specifically for next-generation automotive domain controllers requiring ASIL-B compliance, high-speed interconnect consolidation (CAN FD/Ethernet/FlexRay), and hardware-accelerated security for over-the-air updates.

FAQ

What is the maximum CAN FD data rate supported by CYT4BFBCHDQ0BZEGS?

CYT4BFBCHDQ0BZEGS supports CAN FD up to 8 Mbps, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. The actual achievable rate depends on physical layer topology and external transceiver performance-not internal controller limitation. All 10 CAN FD channels share this capability.

Does CYT4BFBCHDQ0BZEGS include built-in Ethernet PHY functionality?

No. CYT4BFBCHDQ0BZEGS integrates two IEEE-802.3az-compliant Ethernet MACs but requires external PHY devices. It supports MII, RMII, GMII, and RGMII interfaces, with RGMII being the most common for 1000BASE-T implementations due to reduced pin count and timing margin advantages.

How is functional safety (ASIL-B) implemented in CYT4BFBCHDQ0BZEGS?

ASIL-B compliance is achieved through hardware-enforced mechanisms: Shared Memory Protection Unit (SMPU), Peripheral Protection Unit (PPU), Multi-Counter Watchdog Timer (MCWDT), SECDED ECC on SRAM/flash/TCM, voltage/clock supervision (LVD/BOD/OVD/CSV), and lockstep-capable dual Cortex®-M7 cores with hardware comparator. These are documented in Infineon's ISO 26262-certified safety manual.

Can CYT4BFBCHDQ0BZEGS execute code directly from external HyperBus™ memory?

Yes. The device supports Execute-In-Place (XIP) from external memory via its HyperBus™ interface, with on-the-fly encryption/decryption enabled by the integrated HSM. This allows secure expansion of executable code space beyond internal flash, essential for large automotive middleware stacks.

CYT4BFBCHDQ0BZEGS Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 272-LFBGA

Series:: Traveo™ T2G

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Core Processor:: ARM® Cortex®-M0+, ARM® Cortex®-M4F

Core Size:: 32-Bit Quad-Core

Speed:: 100MHz, 350MHz

Connectivity:: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART

Peripherals:: Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O:: 220

Program Memory Size:: 8.1875MB (8.1875M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 256 x 8

RAM Size:: 1M x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 5.5V

Data Converters:: A/D 114x12b SAR

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

CYT4BFBCHDQ0BZEGS FAQ

1.How can I place an order for CYT4BFBCHDQ0BZEGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4BFBCHDQ0BZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4BFBCHDQ0BZEGS reliable?

The price and inventory of CYT4BFBCHDQ0BZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFBCHDQ0BZEGS is usually 5 days.

3.What payment methods are accepted for CYT4BFBCHDQ0BZEGS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFBCHDQ0BZEGS transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT4BFBCHDQ0BZEGS?

CYT4BFBCHDQ0BZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4BFBCHDQ0BZEGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4BFBCHDQ0BZEGS?

For technical support, including CYT4BFBCHDQ0BZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFBCHDQ0BZEGS requirements.

6.How does Aetrix verify that CYT4BFBCHDQ0BZEGS is sourced from the original manufacturer or authorized distributors?

All CYT4BFBCHDQ0BZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFBCHDQ0BZEGS meets industry standards.

7.What is the process for return or replacement of CYT4BFBCHDQ0BZEGS?

All CYT4BFBCHDQ0BZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFBCHDQ0BZEGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4BFBCHDQ0BZEGS part is unused and in its original packaging.

Return procedure for CYT4BFBCHDQ0BZEGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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