My Inquiry
My Account
Infineon Technologies CYT4BFBCHDQ0BZEGST
- Part No.:
- CYT4BFBCHDQ0BZEGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT4BFBCHDQ0BZEGST.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 272BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,316
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4BFBCHDQ0BZEGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Arm® Cortex®-M0+ CPU, 8384 KB code-flash + 256 KB work-flash, 1024 KB SRAM, hardware cryptography (AES-128/192/256, RSA/ECC, SHA-512), and ASIL-B functional safety compliance. It targets high-end body-control units with integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, FlexRay, and LIN (up to 20 channels).
For engineers reviewing the CYT4BFBCHDQ0BZEGST datasheet, CYT4BFBCHDQ0BZEGST pinout, CYT4BFBCHDQ0BZEGST application, or CYT4BFBCHDQ0BZEGST equivalent, key selection criteria include dual-core deterministic real-time processing, secure boot with eSHE/HSM, RWW flash for FOTA updates, and automotive-grade peripheral integration including ISO 11898-1:2015 CAN FD and IEEE-802.3az Ethernet.
Technical Context
The device implements a heterogeneous multi-core architecture: two lockstep-capable Cortex-M7 cores handle primary control and signal processing, while the Cortex-M0+ manages peripheral offload and security services via hardware inter-processor communication. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM) and configurable retention granularity in 1024-KB SRAM.
Clocking supports IMO/ILO/ECO/WCO oscillators plus PLL/FLL, enabling precise timing for AVB and PTP-compliant Ethernet. Peripheral protection includes SMPU, PPU, MCWDT, and BOD with dual thresholds (2.7 V / 3.0 V on VDDD/VDDA; 1.1 V on VCCD), meeting ASIL-B requirements per ISO 26262.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA |
| SRAM | 1024 KB with selectable retention granularity for low-power mode optimization |
| Cryptography | AES-128/192/256, 3DES, RSA/ECC, SHA-512/256/160, TRNG/PRNG, GCM mode |
| Safety Certification | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC, MCWDT, CSV, LVD/BOD/OVD |
| Automotive Interfaces | Up to 10 CAN FD (ISO 11898-1:2015), 2x Gigabit Ethernet MAC (MII/RMII/GMII/RGMII), FlexRay v2.1, 20x LIN |
| Analog Peripherals | 3× 12-bit SAR ADC (99 external channels, 1 Msps, synchronized sampling) |
Pinout & Package
Package: 320-ball BGA, 17 mm × 17 mm × 1.7 mm max, 0.8-mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO | I/O supply rail | 2.7–5.5 V tolerant; powers GPIO_STD, GPIO_ENH, HSIO_STD banks |
| VDDD | Digital core supply | 1.1 V nominal regulated output from internal core regulator |
| VDDA | Analog supply | Separate 2.7–5.5 V input for ADC reference and analog circuitry |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–50 MHz ECO; enables precise clock source for CAN FD and Ethernet timing |
| TCK / TMS / TDI / TDO / nTRST | JTAG debug interface | IEEE-1149.1 compliant; enables boundary scan, flash programming, and ETM trace |
| SWDIO / SWCLK | Serial Wire Debug interface | 2-pin alternative to JTAG; supports secure debug access and firmware update |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two independent Cortex-M7 cores with separate 16-KB I/D caches and TCM enable time-critical task partitioning without OS interference |
| Secure boot with hardware acceleration | eSHE + HSM enforce authenticated boot using digital signatures and fast secure boot path, preventing unauthorized firmware execution |
| FOTA-ready flash architecture | Code-flash and work-flash support RWW and dual-bank mode, enabling seamless over-the-air firmware updates without system interruption |
| ASIL-B safety mechanisms | Hardware-enforced memory protection (MPU/SMPU/PPU), SECDED ECC on all critical memories, and redundant watchdogs meet ISO 26262 requirements |
| Automotive network convergence | Integrated CAN FD (8 Mbps), Gigabit Ethernet (IEEE-802.3az/1588/1BA), FlexRay, and LIN eliminate need for external protocol bridges in body domain ECUs |
Applications
| Body Control Module (BCM) | Gateway ECU |
|---|---|
Use Scenario: Centralized management of lighting, door locks, window lifts, and seat controls in premium vehicles. IC Role / Device Role / Timing Role: Primary controller executing real-time body logic, coordinating CAN FD and LIN subnets, and managing secure OTA updates. Use Value: Dual M7 cores deliver deterministic response under concurrent PWM motor control and cryptographic authentication, reducing MCU count vs. legacy multi-chip solutions. | Use Scenario: Aggregation and routing between powertrain CAN FD, infotainment Ethernet, and chassis FlexRay networks. IC Role / Device Role / Timing Role: High-throughput protocol gateway with hardware-accelerated encryption for secure vehicle-to-cloud telemetry. Use Value: Integrated dual Ethernet MAC + 10 CAN FD + FlexRay eliminates external transceivers and bridge ICs, lowering BOM cost and PCB area by >35%. |
| Advanced Lighting Control | Electric Power Steering (EPS) Support |
Use Scenario: Adaptive front-lighting systems (AFS) with dynamic beam shaping and diagnostics. IC Role / Device Role / Timing Role: Real-time PWM generation for LED drivers, SAR ADC monitoring of thermal sensors, and LIN communication to headlamp modules. Use Value: 15 dedicated 16-bit motor-control timers with dead-time insertion ensure precise LED current regulation while maintaining ASIL-B fault coverage. | Use Scenario: Secondary controller for EPS motor sensing, torque feedback, and CAN FD diagnostic reporting. IC Role / Device Role / Timing Role: Safety-monitoring co-processor handling ADC sampling, CRC validation, and watchdog supervision alongside main EPS MCU. Use Value: Cortex-M0+ subsystem with dedicated PPU and SMPU isolates safety-critical monitoring tasks from application software, simplifying ASIL-D decomposition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 core (320 MHz); 4 MB flash; no integrated Ethernet MAC; supports CAN FD and LIN only | Lacks Gigabit Ethernet and FlexRay; optimized for chassis/safety domains rather than gateway convergence | Select when Ethernet/FlexRay are not required and cost-sensitive ASIL-B body applications dominate |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz); 12 MB flash; no hardware crypto accelerator; supports CAN FD, LIN, and Ethernet via external PHY | No integrated HSM/eSHE; requires external security chip for secure boot; higher flash density but lower peripheral integration | Choose for legacy RH850 ecosystem migration where external security and PHY are already deployed |
Compared with S32K344 and RH850/U2A, CYT4BFBCHDQ0BZEGST uniquely integrates dual M7 cores, hardware-accelerated cryptography, dual Ethernet MAC, and FlexRay in a single ASIL-B-certified package-enabling consolidated gateway and high-end BCM designs without external protocol bridges or security co-processors.
Availability
CYT4BFBCHDQ0BZEGST is available at Aetrix Electronics and suitable for automotive body-control modules, gateway ECUs, advanced lighting systems, and electric power steering support requiring stable component supply across extended temperature ranges (–40°C to +125°C) and long lifecycle commitments.
Supply support for CYT4BFBCHDQ0BZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure supporting automotive AEC-Q100 qualification.
CYT4BF belongs to the TRAVEO™ T2G product line, designed specifically for automotive domain controllers requiring high-performance real-time processing, hardware-based security, and multi-protocol networking convergence in body, gateway, and lighting applications.
FAQ
What is the maximum operating frequency of the Cortex-M7 cores in CYT4BFBCHDQ0BZEGST?
The dual Arm® Cortex®-M7 CPUs operate at up to 350 MHz each, with individual 16-KB instruction and data caches, TCM, and single-cycle multiply units. This frequency is sustained under full ASIL-B safety monitoring with SECDED ECC enabled on TCM and flash, verified per Infineon's characterization across –40°C to +125°C.
Does CYT4BFBCHDQ0BZEGST support IEEE-1588 Precision Time Protocol for Ethernet synchronization?
Yes, both integrated Gigabit Ethernet MAC interfaces comply with IEEE-1588 PTP, enabling hardware timestamping of packets at the MAC layer. The device supports PTP event message handling and transparent clock functionality when paired with a compliant PHY, essential for time-sensitive automotive networking like AVB and TSN.
How many CAN FD channels does CYT4BFBCHDQ0BZEGST support, and what is the maximum data rate?
CYT4BFBCHDQ0BZEGST supports up to 10 CAN FD channels, each capable of data rates up to 8 Mbps in the data phase, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Physical layer limitations (transceiver and topology) determine actual achievable speed, not the MCU itself.
Is external memory encryption supported, and how is it implemented?
Yes, the external memory interface supports on-the-fly AES-128 encryption and decryption for SPI or HYPERBUS™ devices. Encryption keys are stored in protected OTP eFuses and managed by the HSM; XIP (execute-in-place) remains fully functional while encrypted, ensuring secure boot and runtime code integrity without performance penalty.
CYT4BFBCHDQ0BZEGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFBCHDQ0BZEGST FAQ
1.How can I place an order for CYT4BFBCHDQ0BZEGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFBCHDQ0BZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFBCHDQ0BZEGST reliable?
The price and inventory of CYT4BFBCHDQ0BZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFBCHDQ0BZEGST is usually 5 days.
3.What payment methods are accepted for CYT4BFBCHDQ0BZEGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFBCHDQ0BZEGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BFBCHDQ0BZEGST?
CYT4BFBCHDQ0BZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFBCHDQ0BZEGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFBCHDQ0BZEGST?
For technical support, including CYT4BFBCHDQ0BZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFBCHDQ0BZEGST requirements.
6.How does Aetrix verify that CYT4BFBCHDQ0BZEGST is sourced from the original manufacturer or authorized distributors?
All CYT4BFBCHDQ0BZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFBCHDQ0BZEGST meets industry standards.
7.What is the process for return or replacement of CYT4BFBCHDQ0BZEGST?
All CYT4BFBCHDQ0BZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFBCHDQ0BZEGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFBCHDQ0BZEGST part is unused and in its original packaging.
Return procedure for CYT4BFBCHDQ0BZEGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4BFBCHDQ0BZEGST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
