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Infineon Technologies CYT4BFBCHDQ0BZSGS
- Part No.:
- CYT4BFBCHDQ0BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT4BFBCHDQ0BZSGS.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 272BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,329
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Product details
Overview
CYT4BFBCHDQ0BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Arm® Cortex®-M0+ CPU, 8384 KB code-flash + 256 KB work-flash, hardware-accelerated cryptography (AES-128/192/256, RSA/ECC, SHA-512), and ASIL-B functional safety compliance. It targets high-end body-control units with integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, FlexRay, and LIN (up to 20 channels).
For engineers reviewing the CYT4BFBCHDQ0BZSGS datasheet, CYT4BFBCHDQ0BZSGS pinout, CYT4BFBCHDQ0BZSGS application, or CYT4BFBCHDQ0BZSGS equivalent, key selection criteria include dual-core deterministic real-time execution, secure boot with digital signature verification, RWW flash for FOTA updates, and hardware safety mechanisms including SECDED ECC on SRAM/flash/TCM.
Technical Context
The device implements a heterogeneous multi-core architecture: two lockstep-capable Cortex-M7 cores handle primary control and signal processing, while the Cortex-M0+ manages peripheral offload and security services including eSHE/HSM. Inter-processor communication is handled via dedicated hardware mailboxes and shared memory with SMPU enforcement.
Its safety architecture includes MPU per core, shared memory protection unit (SMPU), peripheral protection unit (PPU), multi-counter watchdog (MCWDT), brown-out detection at three voltage domains (VDDD/VDDA/VCCD), and SECDED ECC applied to all safety-critical memories-SRAM, flash, and TCM-meeting ISO 26262 ASIL-B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+, enabling real-time task partitioning and security isolation. |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash, supporting Read-While-Write and dual-bank firmware update for FOTA. |
| SRAM | 1024 KB with selectable retention granularity, allowing selective power gating during low-power modes. |
| Cryptographic Acceleration | AES-128/192/256, 3DES, RSA/ECC, SHA-1/2/3, CRC32, TRNG/PRNG, and GCM mode-all hardware-accelerated. |
| Safety Certification | ISO 26262 ASIL-B compliant with SECDED ECC on SRAM/flash/TCM, MPUs, PPU, MCWDT, and BOD/OVD/LVD monitoring. |
| Communication Interfaces | Up to 10 CAN FD (8 Mbps), 2x Gigabit Ethernet MAC (MII/RMII/GMII/RGMII), 20 LIN, FlexRay V2.1, and 11 SCB (I²C/SPI/UART). |
| Analog Peripherals | Three 12-bit SAR ADCs (99 external channels, 1 Msps), synchronized sampling for motor control, and internal temperature/voltage monitoring. |
Pinout & Package
CYT4BFBCHDQ0BZSGS is packaged in a 320-ball BGA (17 × 17 × 1.7 mm, 0.8-mm ball pitch), optimized for automotive ECU routing density and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIOx / VSSIOx | I/O Power Supply / Ground | Multiple independent I/O banks support mixed-voltage operation (1.8 V / 3.3 V) with bank-specific voltage configuration. |
| VDDD / VSSD | Digital Core Supply / Ground | 1.1-V nominal core supply generated internally; supports low-power active/sleep/deepsleep/hibernate modes. |
| VDDA / VSSA | Analog Supply / Ground | Dedicated 2.7–5.5-V analog domain for SAR ADCs, bandgap reference, and temperature sensor with dual BOD thresholds. |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator Input/Output | Supports 1–50 MHz crystal for precise clock generation; used with ECO block for system timing stability. |
| TCK / TMS / TDI / TDO / nTRST | JTAG Debug Interface | IEEE-1149.1-compliant boundary-scan interface for production test and debug; supports SWD fallback. |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Ethernet PHY Data Lines | Supports GMII/RGMII interfaces for IEEE-802.3az energy-efficient Ethernet and IEEE-1588 PTP timestamping. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two Cortex-M7 cores run at 350 MHz with independent caches, TCM, and MPUs-enabling time-critical control + background processing without OS interference. |
| Secure boot with hardware root-of-trust | eSHE/HSM enforces authenticated boot using ECDSA signatures; prevents unauthorized firmware execution at power-on reset. |
| FOTA-ready flash architecture | Dual-bank flash + RWW allows seamless over-the-air firmware updates without halting real-time operations or losing state. |
| ASIL-B safety mechanisms | Hardware-enforced memory protection (SMPU/PPU), SECDED ECC on all safety-critical memories, and redundant watchdogs meet ISO 26262 requirements. |
| Automotive-grade connectivity | Integrated 10× CAN FD (8 Mbps), 2× Gigabit Ethernet MAC, FlexRay, and 20× LIN eliminate need for external protocol bridges in body domain ECUs. |
Applications
| Body Control Module (BCM) | Gateway ECU |
|---|---|
|
Use Scenario: Centralized management of lighting, door locks, window lifts, and climate actuators across vehicle zones. IC Role / Device Role / Timing Role: Primary controller executing real-time PWM for LED dimming, LIN slave coordination, and CAN FD message routing between domains. Use Value: Dual M7 cores enable concurrent motor control (TCPWM) and network stack processing; 240 GPIOs support direct actuator drive without external expanders. |
Use Scenario: Aggregation and translation of data between CAN FD, LIN, FlexRay, and Ethernet domains in zonal architectures. IC Role / Device Role / Timing Role: High-throughput gateway processor running AUTOSAR COM stack, firewall logic, and time-synchronized PTP forwarding. Use Value: Two Gigabit Ethernet MACs with RGMII support AVB/TSN-aware routing; hardware crypto accelerates TLS/IPsec for secure OTA updates. |
| Advanced Lighting Control Unit | Electric Power Steering (EPS) Support MCU |
|
Use Scenario: Dynamic headlight beam shaping, adaptive driving beam (ADB), and ambient interior lighting with pixel-level control. IC Role / Device Role / Timing Role: Real-time image processing front-end with synchronized SAR ADC sampling and high-resolution PWM generation. Use Value: Three SAR ADCs with synchronized sampling capture camera/photodiode inputs; TCPWM blocks deliver 150+ PWM outputs with dead-time insertion for LED drivers. |
Use Scenario: Secondary controller supporting torque sensing, motor phase current monitoring, and fail-safe torque limiting in EPS systems. IC Role / Device Role / Timing Role: Safety-monitoring co-processor validating primary EPS MCU outputs using independent M0+ core and redundant ADCs. Use Value: Cortex-M0+ runs certified safety monitor firmware; SECDED ECC and PPU isolate critical motor control peripherals from non-safety partitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 (320 MHz), no Cortex-M0+; 4 MB flash, no work-flash; supports CAN FD and Ethernet but lacks FlexRay. | Targeted at mid-tier body/gateway applications without FlexRay requirement or FOTA complexity. | Prefer when cost-sensitive design omits FlexRay and requires simpler dual-core safety partitioning. |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), 8 MB flash, no hardware crypto acceleration; ASIL-D capable but higher software overhead for security. | Used in powertrain and chassis where ASIL-D is mandatory and deterministic interrupt latency outweighs crypto needs. | Choose only when ASIL-D certification is required and hardware crypto is delegated to external HSM. |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT4BFBCHDQ0BZSGS uniquely combines dual M7 cores, integrated FlexRay, work-flash for FOTA, and hardware-accelerated crypto within an ASIL-B platform-making it optimal for next-gen automotive gateways and high-end BCMs requiring both performance and secure update capability.
Availability
CYT4BFBCHDQ0BZSGS is available at Aetrix Electronics and suitable for automotive body control modules, zonal gateways, advanced lighting systems, and electric power steering support ECUs requiring stable component supply, long lifecycle commitment, and AEC-Q100 Grade 2 qualification.
Supply support for CYT4BFBCHDQ0BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
CYT4BFBCHDQ0BZSGS belongs to the TRAVEO™ T2G family-designed specifically for automotive body and gateway applications demanding real-time performance, functional safety, and secure over-the-air updates.
FAQ
What is the maximum operating frequency of the Cortex-M7 cores in CYT4BFBCHDQ0BZSGS?
The dual Arm® Cortex®-M7 CPUs operate at up to 350 MHz each, with independent 16-KB instruction and data caches, 16-KB TCM, and single-cycle multiply/FPU support. This frequency is sustained under AEC-Q100 Grade 2 conditions (−40°C to +105°C ambient) with appropriate thermal design and power supply regulation.
Does CYT4BFBCHDQ0BZSGS support hardware-based secure boot with cryptographic verification?
Yes. It implements Enhanced Secure Hardware Extension (eSHE) and Hardware Security Module (HSM) with ECDSA signature verification, AES-GCM decryption, and immutable boot ROM. Secure boot validates firmware authenticity before execution using keys stored in OTP eFuses and performs integrity checks on flash contents via SHA-256 hashing.
How many CAN FD channels does CYT4BFBCHDQ0BZSGS support, and what is the maximum data rate?
CYT4BFBCHDQ0BZSGS supports up to 10 CAN FD channels, each capable of data rates up to 8 Mbps in the data phase, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Physical layer limitations (transceiver and topology) determine actual achievable speed in deployed systems.
Is CYT4BFBCHDQ0BZSGS qualified for automotive use, and what is its AEC-Q100 grade?
Yes. CYT4BFBCHDQ0BZSGS is qualified per AEC-Q100 Grade 2 (−40°C to +105°C junction temperature), with built-in diagnostics including BOD, OVD, LVD, clock supervision, and SECDED ECC on all safety-critical memories-ensuring reliability in under-hood and cabin-mounted automotive ECUs.
CYT4BFBCHDQ0BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFBCHDQ0BZSGS FAQ
1.How can I place an order for CYT4BFBCHDQ0BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFBCHDQ0BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFBCHDQ0BZSGS reliable?
The price and inventory of CYT4BFBCHDQ0BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFBCHDQ0BZSGS is usually 5 days.
3.What payment methods are accepted for CYT4BFBCHDQ0BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFBCHDQ0BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BFBCHDQ0BZSGS?
CYT4BFBCHDQ0BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFBCHDQ0BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFBCHDQ0BZSGS?
For technical support, including CYT4BFBCHDQ0BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFBCHDQ0BZSGS requirements.
6.How does Aetrix verify that CYT4BFBCHDQ0BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT4BFBCHDQ0BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFBCHDQ0BZSGS meets industry standards.
7.What is the process for return or replacement of CYT4BFBCHDQ0BZSGS?
All CYT4BFBCHDQ0BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFBCHDQ0BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFBCHDQ0BZSGS part is unused and in its original packaging.
Return procedure for CYT4BFBCHDQ0BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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