Infineon Technologies CYT4BFBCJDQ0BZEGS
- Part No.:
- CYT4BFBCJDQ0BZEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT4BFBCJDQ0BZEGS.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 272BGA
- Quantity:
- Payment:

- Shipping:

Inventory:897
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4BFBCJDQ0BZEGS from Infineon is a dual-core automotive microcontroller featuring two 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Cortex®-M0+ CPU, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, and FlexRay interfaces. It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and real-time motor control with synchronized 12-bit SAR ADCs.
For engineers reviewing the CYT4BFBCJDQ0BZEGS datasheet, CYT4BFBCJDQ0BZEGS pinout, CYT4BFBCJDQ0BZEGS application, or CYT4BFBCJDQ0BZEGS equivalent, this page delivers verified technical context on dual-CPU architecture, flash/SRAM partitioning, cryptographic acceleration (AES-256, ECC, SHA-512), and safety mechanisms including SECDED ECC, SMPU, and MCWDT - all critical for automotive ECU design and FOTA deployment.
Technical Context
The CYT4BFBCJDQ0BZEGS implements a heterogeneous multi-core architecture: dual Cortex®-M7 cores operate at 350 MHz with independent 16-KB I/D caches and TCM, while the Cortex®-M0+ handles peripheral offload and security tasks at 100 MHz. Inter-processor communication is hardware-accelerated via dedicated mailbox and semaphore units.
It integrates three DMA controllers (P-DMA0: 143 channels, P-DMA1: 65 channels, M-DMA0: 8 channels), supports RWW flash operation in single/dual-bank mode for FOTA, and delivers ASIL-B compliance through MPU, SMPU, PPU, SECDED ECC on SRAM/flash/TCM, and redundant clock supervision (CSV, FLL/PLL).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+, enabling real-time primary processing and secure peripheral management. |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash with Read-While-Write and dual-bank support for atomic firmware updates. |
| SRAM | 1024 KB with selectable retention granularity, allowing fine-grained power gating during DeepSleep/Hibernate modes. |
| CAN FD Channels | Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting data rates up to 8 Mbps. |
| Ethernet Interface | Two 10/100/1000 Mbps IEEE-802.3az MACs with RGMII/GMII/MII/RMII PHY support and IEEE-1588 PTP timing precision. |
| ADC System | Three 12-bit SAR ADCs, each with 99 external channel inputs and synchronized sampling capability for motor current sensing. |
| Security Engine | HSM-compliant cryptography accelerator supporting AES-128/192/256, RSA/ECC, SHA-512/256/160, TRNG, and GCM mode. |
Pinout & Package
This device is offered in a 320-ball BGA package (17 × 17 × 1.7 mm, 0.8-mm ball pitch) with thermal pad and standard JEDEC footprint. Pin assignment is defined per the CYT4BF family pinout specification (Infineon Doc ID 002-21617 Rev. *J, pages 22–24).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog supply input | 1.1-V core analog rail; requires separate filtering from digital VDDD for ADC reference stability. |
| VDDD | Digital supply input | 1.1-V digital core rail; decoupled independently to minimize switching noise coupling into analog domains. |
| VCCD | DeepSleep regulator input | Input for internal 1.1-V DeepSleep regulator; enables sub-μA retention current during Hibernate mode. |
| XTAL_IN / XTAL_OUT | External crystal oscillator terminals | Supports 1–50 MHz crystals for precise clock source; used by ECO block for system timing and CAN FD bit rate accuracy. |
| TCK / TMS / TDI / TDO | JTAG debug interface | IEEE-1149.1-compliant boundary-scan and debug access; required for SWD/JTAG programming and ETM trace capture. |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Gigabit Ethernet PHY interface | RGMII-compliant 4-bit nibble lanes; enables deterministic low-latency Ethernet communication without external PHY buffering. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic over-the-air (FOTA) firmware updates without runtime interruption or external memory dependency. |
| Synchronized triple 12-bit SAR ADCs | Allows simultaneous sampling of motor phase currents across all three converters for precise field-oriented control (FOC). |
| Hardware security module (HSM) | Provides tamper-resistant key storage, secure boot verification, and cryptographic acceleration meeting EVITA Medium requirements. |
| ASIL-B safety mechanisms | Includes SECDED ECC on all safety-critical memories, SMPU for inter-core memory isolation, and dual watchdogs (WDT + MCWDT). |
| Runtime-reconfigurable SCBs | 11 serial communication blocks dynamically assignable as UART/I²C/SPI, reducing pin count and PCB routing complexity. |
Applications
| Body Control Module (BCM) | Advanced Driver Assistance Systems (ADAS) Domain Controller |
|---|---|
Use Scenario: Centralized vehicle body electronics managing lighting, door locks, window lifts, and climate control via CAN FD and LIN networks. IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, coordinating multiple LIN slaves, and hosting secure OTA update stack. Use Value: Dual M7 cores handle concurrent body-control tasks and diagnostics, while M0+ isolates security-critical boot and crypto operations from application software. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for parking assistance and blind-spot detection. IC Role / Device Role / Timing Role: High-bandwidth data concentrator with Gigabit Ethernet MACs for time-synchronized sensor streaming and PTP-based timestamp alignment. Use Value: IEEE-1588 PTP support ensures sub-microsecond timestamp coherence across distributed ADAS sensors, critical for fusion accuracy. |
| Electric Power Steering (EPS) ECU | Automotive Gateway Module |
Use Scenario: Real-time torque assist calculation using motor position, current, and vehicle speed feedback. IC Role / Device Role / Timing Role: Motor controller with synchronized triple ADC sampling, TCPWM blocks for gate drive generation, and CAN FD for vehicle network integration. Use Value: Simultaneous 12-bit ADC sampling across all three phases eliminates timing skew, improving FOC loop stability and torque ripple reduction. | Use Scenario: Protocol translation bridge between CAN FD, FlexRay, LIN, and Ethernet domains in zonal architectures. IC Role / Device Role / Timing Role: Multi-protocol gateway processor with hardware-accelerated message routing, firewall rules, and secure boot enforcement. Use Value: Integrated FlexRay (V2.1) and 10-CAN FD channels enable deterministic high-speed communication with chassis and powertrain ECUs without external protocol translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single 32-bit Arm® Cortex®-R52 core (up to 300 MHz); no dual M7 architecture; includes HSE security engine but lacks integrated FlexRay. | Targeted at mid-tier body/gateway applications; does not support FlexRay-based chassis communication or synchronized triple ADC for motor control. | Select when FlexRay is not required and cost-sensitive ASIL-B designs prioritize R52 safety-certified toolchain maturity over dual-M7 compute density. |
| Renesas RH850/U2A | 32-bit RH850 core (up to 400 MHz); proprietary architecture; supports CAN FD and LIN but no Ethernet MAC or integrated cryptography engine. | Focused on powertrain and chassis control; lacks Gigabit Ethernet and HSM-level crypto acceleration needed for domain controllers and OTA security. | Select for legacy powertrain ECU migration where RH850 ecosystem compatibility and ASIL-D certification path outweigh need for Ethernet or FOTA acceleration. |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT4BFBCJDQ0BZEGS uniquely combines dual high-frequency M7 cores, integrated FlexRay + Gigabit Ethernet + HSM, and synchronized triple ADC - making it optimal for next-generation automotive domain controllers requiring consolidated compute, networking, and functional safety.
Availability
CYT4BFBCJDQ0BZEGS is available at Aetrix Electronics and suitable for automotive body-control modules, ADAS domain controllers, electric power steering ECUs, and zonal gateway systems requiring stable component supply, long lifecycle assurance, and ASIL-B certified silicon.
Supply support for CYT4BFBCJDQ0BZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line was designed specifically for automotive body, gateway, and domain controller applications demanding high-performance computing, multi-protocol connectivity, and hardware-enforced functional safety and security.
FAQ
What is the maximum operating frequency of the Cortex®-M7 cores in CYT4BFBCJDQ0BZEGS?
The dual Arm® Cortex®-M7 cores operate at a maximum frequency of 350 MHz, each with dedicated 16-KB instruction and data caches plus 16-KB TCM. This frequency is sustained under full voltage and temperature specifications per Infineon's characterization data in Rev. *J datasheet Section 3.1.1.
Does CYT4BFBCJDQ0BZEGS support IEEE-1588 Precision Time Protocol?
Yes, CYT4BFBCJDQ0BZEGS includes two IEEE-802.3az-compliant Gigabit Ethernet MACs with full IEEE-1588 PTP hardware timestamping support, enabling sub-microsecond synchronization across distributed automotive sensors and actuators as documented in Section 3.3.9 of the datasheet.
How many CAN FD channels does CYT4BFBCJDQ0BZEGS integrate, and what is their data rate capability?
CYT4BFBCJDQ0BZEGS integrates up to 10 CAN FD channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting data rates up to 8 Mbps - limited only by physical layer transceiver and topology constraints, as specified in Section 3.3.6 of the datasheet.
Is external memory encryption supported, and how is it implemented?
Yes, CYT4BFBCJDQ0BZEGS supports on-the-fly encryption and decryption of external memory accessed via its SPI or HYPERBUS™ interface using the integrated HSM. The cryptography engine applies AES-128/192/256 in GCM mode, ensuring confidentiality and integrity without software overhead, as described in Section 3.1.6 and 3.3.10 of the datasheet.
CYT4BFBCJDQ0BZEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFBCJDQ0BZEGS FAQ
1.How can I place an order for CYT4BFBCJDQ0BZEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFBCJDQ0BZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFBCJDQ0BZEGS reliable?
The price and inventory of CYT4BFBCJDQ0BZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFBCJDQ0BZEGS is usually 5 days.
3.What payment methods are accepted for CYT4BFBCJDQ0BZEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFBCJDQ0BZEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BFBCJDQ0BZEGS?
CYT4BFBCJDQ0BZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFBCJDQ0BZEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFBCJDQ0BZEGS?
For technical support, including CYT4BFBCJDQ0BZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFBCJDQ0BZEGS requirements.
6.How does Aetrix verify that CYT4BFBCJDQ0BZEGS is sourced from the original manufacturer or authorized distributors?
All CYT4BFBCJDQ0BZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFBCJDQ0BZEGS meets industry standards.
7.What is the process for return or replacement of CYT4BFBCJDQ0BZEGS?
All CYT4BFBCJDQ0BZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFBCJDQ0BZEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFBCJDQ0BZEGS part is unused and in its original packaging.
Return procedure for CYT4BFBCJDQ0BZEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4BFBCJDQ0BZEGS Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

