Infineon Technologies CYT4BFBCJDQ0BZEGST
- Part No.:
- CYT4BFBCJDQ0BZEGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT4BFBCJDQ0BZEGST.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 272BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,540
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Product details
Overview
CYT4BFBCJDQ0BZEGST from Infineon is a dual-core automotive microcontroller featuring two 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Cortex®-M0+ CPU, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, and FlexRay interfaces. It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography acceleration.
For engineers reviewing the CYT4BFBCJDQ0BZEGST datasheet, CYT4BFBCJDQ0BZEGST pinout, CYT4BFBCJDQ0BZEGST application, or CYT4BFBCJDQ0BZEGST equivalent, key selection criteria include dual-CPU architecture for real-time task partitioning, RWW flash for FOTA updates, eSHE/HSM security compliance, and multi-protocol communication support across CAN FD, LIN, Ethernet, and FlexRay.
Technical Context
The device implements a heterogeneous multi-core architecture with hardware inter-processor communication, three DMA controllers (P-DMA0: 143 channels, P-DMA1: 65 channels, M-DMA0: 8 channels), and shared memory protection unit (SMPU) for ASIL-B compliance. Clock subsystem includes IMO, ILO, ECO, WCO, PLL, and FLL with configurable frequency synthesis.
Security is enforced via dedicated HSM with AES-128/192/256, SHA-256/512, RSA/ECC acceleration, TRNG, and SECDED ECC on all safety-critical memories (flash, SRAM, TCM). Analog subsystem comprises three 12-bit SAR ADCs (99 external channels, 1 Msps), synchronized sampling, and motor-sense ready sequencers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Two 350-MHz Arm® Cortex®-M7 + one 100-MHz Cortex®-M0+ for security/peripheral offload |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash with Read-While-Write and dual-bank FOTA support |
| SRAM | 1024 KB with selectable retention granularity for low-power mode optimization |
| CAN FD Channels | Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 |
| Ethernet MAC | Two 10/100/1000 Mbps IEEE-802.3az interfaces supporting RGMII/GMII/MII/RMII PHYs |
| Functional Safety | ASIL-B certified with SMPU, PPU, MCWDT, SECDED ECC on flash/SRAM/TCM, and BOD/OVD/LVD |
| Cryptography Engine | HSM with AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and Galois/Counter Mode (GCM) |
Pinout & Package
Package: 320-ball BGA, 17 mm × 17 mm × 1.7 mm max, 0.8-mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | 1.1-V core analog rail with independent brown-out detection at 1.1 V |
| VDDD | Digital power supply | 2.7–5.5-V input regulated to 1.1 V; dual BOD thresholds (2.7 V / 3.0 V) |
| SWDIO/SWCLK | Serial Wire Debug interface | ARM SWD port for programming, debug, and trace; supports ETM instruction/data trace |
| ETH_RXD[3:0]/TXD[3:0] | Gigabit Ethernet physical layer interface | RGMII-compliant 4-bit receive/transmit data lanes with clock and control signals |
| CANFD_TX[9:0]/RX[9:0] | CAN FD transceiver interface | 10 independent differential CAN FD channel pairs supporting up to 8 Mbps data rate |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Independent M7 cores with 16-KB TCM each enable hard real-time control + application processing separation |
| Firmware update over-the-air (FOTA) | Dual-bank flash architecture allows atomic firmware swap without system interruption |
| Hardware security module (HSM) | On-die HSM implements secure boot, digital signature verification, and cryptographic acceleration per ISO 15408 |
| Motor-sense synchronized sampling | Three SAR ADCs support simultaneous conversion across all channels for precise rotor position estimation |
| Flexible power management | Five low-power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable wakeup sources |
Applications
| High-End Body Control Module (BCM) | Automotive Gateway Unit |
|---|---|
Use Scenario: Centralized vehicle body electronics managing lighting, door locks, windows, and climate functions in premium vehicles. IC Role / Device Role / Timing Role: Primary compute engine executing real-time control tasks on M7 cores while M0+ handles LIN/CAN message routing and security checks. Use Value: Dual-core isolation ensures deterministic response to safety-critical events (e.g., automatic door lock during crash) while maintaining infotainment connectivity. | Use Scenario: In-vehicle network bridge aggregating CAN FD, LIN, FlexRay, and Ethernet traffic between domain controllers. IC Role / Device Role / Timing Role: Protocol translation hub with hardware-accelerated packet filtering, timestamping (IEEE-1588 PTP), and secure message forwarding. Use Value: Integrated dual Ethernet MAC + 10 CAN FD + FlexRay enables seamless domain integration without external protocol bridges or FPGA glue logic. |
| Electric Powertrain Control | Advanced Driver Assistance Systems (ADAS) Sensor Hub |
Use Scenario: Motor control and battery management coordination in 48-V mild-hybrid or BEV architectures. IC Role / Device Role / Timing Role: Real-time motor control using TCPWM blocks and synchronized 12-bit ADC sampling across three converters for current/voltage/temperature sensing. Use Value: Hardware-enforced timing precision (sub-µs PWM dead-time control) and ASIL-B safety mechanisms meet ISO 26262 requirements for torque control loops. | Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before transmission to central ADAS ECU. IC Role / Device Role / Timing Role: Secure edge node performing time-synchronized sensor fusion, encrypted data packaging, and low-latency Ethernet streaming. Use Value: On-chip HSM and IEEE-1588 PTP support enable cryptographically signed, time-coordinated sensor data delivery required for sensor fusion algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single 32-bit Arm® Cortex®-M7 core (up to 320 MHz); no integrated FlexRay; 6 MB flash, 2 MB SRAM | Lacks FlexRay and dual Ethernet MAC; optimized for chassis/safety domains rather than gateway/body control | Select when FlexRay is not required and cost-sensitive ASIL-D safety certification is needed |
| Renesas RH850/U2A | 32-bit RH850 core (up to 400 MHz); 8 MB flash, 2.5 MB SRAM; supports CAN FD and Ethernet but no native HSM | Relies on external security ICs for secure boot; lacks integrated cryptography acceleration and PTP timestamping | Select for legacy RH850 toolchain compatibility and higher single-thread performance in non-security-critical gateways |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT4BFBCJDQ0BZEGST uniquely combines dual M7 cores, FlexRay, dual Ethernet MAC with IEEE-1588, and on-die HSM - making it optimal for next-gen automotive gateways requiring protocol diversity, time synchronization, and embedded security without external components.
Availability
CYT4BFBCJDQ0BZEGST is available at Aetrix Electronics and suitable for high-end body control modules, automotive gateway units, electric powertrain control systems, and ADAS sensor hubs requiring stable component supply, long lifecycle support, and automotive-grade qualification.
Supply support for CYT4BFBCJDQ0BZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
CYT4BF belongs to the TRAVEO™ T2G family, designed specifically for automotive domain controllers requiring ASIL-B functional safety, multi-protocol connectivity, and hardware-enforced security for software-defined vehicle architectures.
FAQ
What is the maximum CAN FD data rate supported by CYT4BFBCJDQ0BZEGST?
CYT4BFBCJDQ0BZEGST supports CAN FD up to 8 Mbps, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. The actual achievable rate depends on physical layer topology and transceiver capabilities, not internal controller limitations. All 10 CAN FD channels share this capability.
Does CYT4BFBCJDQ0BZEGST support IEEE-1588 Precision Time Protocol?
Yes - both integrated Ethernet MAC interfaces support IEEE-1588 PTP with hardware timestamping, enabling sub-microsecond time synchronization across distributed automotive ECUs. This is essential for time-coordinated sensor fusion and deterministic networking in domain-centralized architectures.
How is functional safety implemented for memory subsystems?
Functional safety is enforced via SECDED (Single Error Correction, Double Error Detection) ECC on all safety-critical memories: code-flash, work-flash, SRAM, and TCM. Memory Protection Units (MPU), Shared MPU (SMPU), and Peripheral Protection Unit (PPU) provide runtime access control and fault isolation per ISO 26262 ASIL-B requirements.
Can CYT4BFBCJDQ0BZEGST execute code directly from external memory?
Yes - the HYPERBUS™ or SPI octal interface supports Execute-In-Place (XIP) from external memory with on-the-fly encryption/decryption. This enables scalable code storage beyond on-chip flash while maintaining security and deterministic latency for real-time applications.
CYT4BFBCJDQ0BZEGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFBCJDQ0BZEGST FAQ
1.How can I place an order for CYT4BFBCJDQ0BZEGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFBCJDQ0BZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFBCJDQ0BZEGST reliable?
The price and inventory of CYT4BFBCJDQ0BZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFBCJDQ0BZEGST is usually 5 days.
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CYT4BFBCJDQ0BZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFBCJDQ0BZEGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFBCJDQ0BZEGST?
For technical support, including CYT4BFBCJDQ0BZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFBCJDQ0BZEGST requirements.
6.How does Aetrix verify that CYT4BFBCJDQ0BZEGST is sourced from the original manufacturer or authorized distributors?
All CYT4BFBCJDQ0BZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFBCJDQ0BZEGST meets industry standards.
7.What is the process for return or replacement of CYT4BFBCJDQ0BZEGST?
All CYT4BFBCJDQ0BZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFBCJDQ0BZEGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFBCJDQ0BZEGST part is unused and in its original packaging.
Return procedure for CYT4BFBCJDQ0BZEGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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