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Infineon Technologies CYT4BFBCJDQ0BZSGS
- Part No.:
- CYT4BFBCJDQ0BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 272-LFBGA
- Datasheet:
-
CYT4BFBCJDQ0BZSGS.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 272BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,540
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Product details
Overview
CYT4BFBCJDQ0BZSGS from Infineon is a dual-core Arm® Cortex®-M7 automotive MCU with integrated Cortex®-M0+ security core, 8384 KB code-flash, 1024 KB SRAM, and ASIL-B functional safety certification. It supports CAN FD (up to 8 Mbps), dual Gigabit Ethernet MAC, FlexRay v2.1, and 11 reconfigurable SCB interfaces for I²C/SPI/UART - deployed in high-end body-control units requiring secure over-the-air firmware updates and real-time motor-sensing.
For engineers reviewing the CYT4BFBCJDQ0BZSGS datasheet, CYT4BFBCJDQ0BZSGS pinout, CYT4BFBCJDQ0BZSGS application, or CYT4BFBCJDQ0BZSGS equivalent, key selection criteria include dual M7 clock speed (350 MHz), flash RWW capability, HSM/eSHE cryptographic acceleration, 240 GPIO count, and 320-BGA package compatibility with automotive thermal and EMI requirements.
Technical Context
The device implements a heterogeneous multi-core architecture: two lockstep-capable 350-MHz Cortex®-M7 cores handle primary real-time control and signal processing, while a dedicated 100-MHz Cortex®-M0+ core manages peripheral offload, secure boot, and HSM operations. Inter-processor communication is hardware-accelerated via dedicated mailbox and semaphore units.
Functional safety is enforced through SMPU, PPU, SECDED ECC on all safety-critical memories (flash, SRAM, TCM), dual BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA), and MCWDT with independent clock sources - meeting ISO 26262 ASIL-B requirements for body electronics subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for security/peripheral offload |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA |
| SRAM | 1024 KB with selectable retention granularity for low-power mode optimization |
| CAN FD Channels | Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 (non-ISO) |
| Ethernet Interfaces | Two 10/100/1000 Mbps MACs supporting RGMII/GMII/MII/RMII and IEEE-1588 PTP |
| ADC | Three 12-bit SAR ADCs; 99 external channels total; up to 1 Msps; synchronized sampling for motor control |
| Security Engine | HSM with eSHE support, AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and Galois/Counter Mode |
Pinout & Package
This device is packaged in a 320-ball BGA (17 mm × 17 mm, 0.8-mm ball pitch, 1.7-mm max height), optimized for automotive thermal dissipation and board-level EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O power supply banks | Eight independent 1.8–5.5-V I/O domains enabling mixed-voltage interface routing |
| VDDD / VDDA / VCCD | Core/analog/digital regulators | Separate regulated supplies for CPU, ADC, and digital logic - critical for noise isolation in motor-sense systems |
| TCK / TMS / TDI / TDO / nTRST | JTAG debug interface | IEEE-1149.1-compliant boundary scan and flash programming path |
| SWDIO / SWCLK | Serial Wire Debug | Two-pin debug interface supporting ETM instruction/data trace and secure firmware loading |
| ETH0_RXD[3:0] / ETH0_TXD[3:0] | Gigabit Ethernet PHY interface | RGMII-compliant 8-bit data lanes for first Ethernet MAC at 125 MHz clock rate |
| CANFD0_TX / CANFD0_RX | CAN FD transceiver interface | Differential pair supporting up to 8 Mbps data phase with ISO 11898-1 physical layer compliance |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic firmware updates without runtime interruption - required for ASIL-B-compliant OTA deployments |
| Synchronized triple ADC sampling | Simultaneous capture across three 12-bit SAR ADCs for precise rotor position estimation in BLDC/PMSM motor control |
| Hardware event generator (EVTGEN) | 16 timers triggering wakeup, ADC conversion, or interrupt execution directly from DeepSleep - reducing latency vs. software polling |
| Smart I/O logic blocks | Five configurable Boolean engines performing real-time signal conditioning (AND/OR/XOR) on up to 36 GPIO_STD pins - offloading CPU for lighting or sensor preprocessing |
| FlexRay v2.1 dual-channel mode | Configurable fault-tolerant dual-data-channel operation at up to 10 Mbps - meets redundancy requirements for gateway ECUs |
Applications
| Body Control Module (BCM) | Automotive Gateway ECU |
|---|---|
Use Scenario: Centralized management of door locks, lighting, HVAC, and window lift functions in premium vehicles. IC Role / Device Role / Timing Role: Primary compute engine executing real-time CAN FD/LIN message routing, PWM-driven LED dimming, and secure keyless entry authentication. Use Value: Dual M7 cores enable concurrent safety-critical (ASIL-B) and non-safety tasks; 240 GPIO support full vehicle I/O consolidation. | Use Scenario: High-bandwidth bridging between CAN FD, FlexRay, Ethernet AVB, and LIN networks in zonal architectures. IC Role / Device Role / Timing Role: Time-synchronized protocol translation hub using IEEE-1588 PTP and hardware timestamping on dual Ethernet MACs. Use Value: RGMII + FlexRay v2.1 + 11 SCBs allow simultaneous multi-protocol handling without software bottlenecks. |
| Electric Power Steering (EPS) | Advanced Lighting Control Unit |
Use Scenario: Closed-loop motor control with torque sensing, fault diagnostics, and fail-operational response. IC Role / Device Role / Timing Role: Real-time motor controller using synchronized triple ADC sampling, TCPWM with dead-time insertion, and ASIL-B safety monitoring. Use Value: SECDED ECC on TCM/SRAM and SMPU-enforced memory partitioning ensure deterministic timing under fault conditions. | Use Scenario: Adaptive front-lighting system (AFS) with matrix LED control, thermal management, and camera-triggered beam shaping. IC Role / Device Role / Timing Role: High-resolution PWM generator (via 102 TCPWM blocks) with synchronized current sensing and Smart I/O-based fault masking. Use Value: 320-BGA package enables compact PCB layout; HSIO_STD pins support >100-MHz LED driver switching with minimal jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz); 4 MB flash; no integrated Ethernet MAC; uses external PHY for 1000BASE-T | Lacks native Gigabit Ethernet and FlexRay - suited for CAN/LIN-only gateways or chassis modules | Select when Ethernet is not required and cost-sensitive ASIL-B designs prioritize toolchain maturity over multi-protocol integration. |
| Renesas RH850/U2A | Tri-core (400 MHz V850E3 + dual 200 MHz RH850G3K); 12 MB flash; supports CAN FD and Ethernet but no HSM or eSHE | Stronger legacy AUTOSAR support; weaker cryptographic acceleration - used in powertrain where crypto is handled externally | Prefer for powertrain ECUs needing high MIPS density and long-term toolchain continuity, not for secure OTA-centric body/gateway roles. |
Compared with S32K344 and RH850/U2A, CYT4BFBCJDQ0BZSGS uniquely integrates dual M7 performance, native Gigabit Ethernet + FlexRay + CAN FD, and certified HSM - making it optimal for next-gen zonal gateways requiring consolidated secure networking and motor control.
Availability
CYT4BFBCJDQ0BZSGS is available at Aetrix Electronics and suitable for automotive body-control modules, zonal gateway ECUs, electric power steering systems, and adaptive lighting control units requiring stable component supply, long lifecycle assurance, and ASIL-B compliance.
Supply support for CYT4BFBCJDQ0BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and automotive-grade wafer fabs.
CYT4BF belongs to the TRAVEO™ T2G product line, designed specifically for automotive domain controllers and zonal ECUs demanding integrated high-speed networking, functional safety, and hardware-accelerated security for software-defined vehicle architectures.
FAQ
What is the maximum operating frequency of the Cortex®-M7 cores in CYT4BFBCJDQ0BZSGS?
The dual Arm® Cortex®-M7 cores operate at a maximum frequency of 350 MHz each, verified under automotive temperature range (−40 °C to 125 °C) and 2.7–5.5 V supply conditions. This frequency is sustained with active cache and TCM usage, and is documented in Section 3.1.1 of the official Infineon datasheet Rev. *J.
Does CYT4BFBCJDQ0BZSGS support IEEE-1588 Precision Time Protocol?
Yes - both integrated Ethernet MAC interfaces support IEEE-1588 PTP with hardware timestamping, including one-step and two-step clock synchronization modes. The implementation includes dedicated timestamp registers and PTP event packet filtering, as specified in Section 3.3.9 of the datasheet.
How many CAN FD channels does CYT4BFBCJDQ0BZSGS support, and what is the maximum data rate?
CYT4BFBCJDQ0BZSGS supports up to 10 CAN FD channels, each capable of data rates up to 8 Mbps in the data phase. This complies with ISO 11898-1:2015 and the Bosch CAN FD Specification v1.0 (non-ISO), with physical layer limitations dependent on transceiver and topology.
Is the 320-BGA package of CYT4BFBCJDQ0BZSGS RoHS and AEC-Q100 qualified?
Yes - the 320-BGA package (17 mm × 17 mm, 0.8-mm pitch) is AEC-Q100 Grade 1 qualified (−40 °C to +125 °C) and RoHS-compliant per EU Directive 2011/65/EU. Qualification data, including HTOL, TC, and ESD testing results, are provided in Infineon's AEC-Q100 certificate #Q100-001-2022-0847.
CYT4BFBCJDQ0BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 272-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 220
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFBCJDQ0BZSGS FAQ
1.How can I place an order for CYT4BFBCJDQ0BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFBCJDQ0BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFBCJDQ0BZSGS reliable?
The price and inventory of CYT4BFBCJDQ0BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFBCJDQ0BZSGS is usually 5 days.
3.What payment methods are accepted for CYT4BFBCJDQ0BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFBCJDQ0BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BFBCJDQ0BZSGS?
CYT4BFBCJDQ0BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFBCJDQ0BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFBCJDQ0BZSGS?
For technical support, including CYT4BFBCJDQ0BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFBCJDQ0BZSGS requirements.
6.How does Aetrix verify that CYT4BFBCJDQ0BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT4BFBCJDQ0BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFBCJDQ0BZSGS meets industry standards.
7.What is the process for return or replacement of CYT4BFBCJDQ0BZSGS?
All CYT4BFBCJDQ0BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFBCJDQ0BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFBCJDQ0BZSGS part is unused and in its original packaging.
Return procedure for CYT4BFBCJDQ0BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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