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Infineon Technologies CYT4BFCCHDQ0BZEGS
- Part No.:
- CYT4BFCCHDQ0BZEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 320-LFBGA
- Datasheet:
-
CYT4BFCCHDQ0BZEGS.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 320BGA
- Quantity:
- Payment:
- Shipping:
Inventory:900
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Product details
Overview
CYT4BFCCHDQ0BZEGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller with dual Arm® Cortex®-M7 CPUs (350 MHz), one Arm® Cortex®-M0+ CPU (100 MHz), 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, FlexRay, and LIN (up to 20 channels). It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography acceleration.
For engineers reviewing the CYT4BFCCHDQ0BZEGS datasheet, CYT4BFCCHDQ0BZEGS pinout, CYT4BFCCHDQ0BZEGS application, or CYT4BFCCHDQ0BZEGS equivalent, this page delivers verified technical context, package mapping, real-world use cases, and validated alternative options for automotive ECU design and firmware-over-the-air (FOTA) deployment.
Technical Context
The device implements a heterogeneous multi-core architecture: two lockstep-capable Cortex-M7 cores handle primary real-time control and signal processing, while the Cortex-M0+ manages peripheral offload, security services, and inter-processor communication via hardware mailbox. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM) and RWW flash supporting dual-bank FOTA updates.
Clock and power management integrate five independent regulators (core internal/external, DeepSleep), multiple oscillators (IMO, ILO, ECO, WCO, PLL, FLL), and six low-power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA, 1.1 V on VCCD) and wakeup sources including up to 240 GPIOs and RTC alarms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for security/peripheral offload |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA |
| SRAM | 1024 KB with selectable retention granularity for low-power state preservation |
| CAN FD Channels | Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 (non-ISO) |
| Ethernet Interface | Two 10/100/1000 Mbps IEEE-802.3az MACs with MII/RMII/GMII/RGMII PHY support and IEEE-1588 PTP |
| Functional Safety | ASIL-B compliant with SMPU, PPU, MCWDT, SECDED ECC on SRAM/flash/TCM, and clock supervisor (CSV) |
| Cryptography Engine | HSM with AES-128/192/256, 3DES, RSA/ECC, SHA-256/512, TRNG, and GCM mode support |
Pinout & Package
This device is packaged in a 320-ball BGA (17 × 17 × 1.7 mm, 0.8-mm ball pitch), optimized for automotive ECU thermal and routing requirements. Pinout validation confirms 240 programmable I/Os across three types: GPIO_STD, GPIO_ENH, and HSIO_STD, with dedicated balls for CAN FD, Ethernet MAC, FlexRay, and SDHC interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog supply input | Provides regulated 2.7–5.5 V analog domain power; requires separate filtering for SAR ADC stability |
| VDDD | Digital core supply input | Feeds internal 1.1-V regulator; supports ASIL-B voltage monitoring with dual BOD thresholds |
| TCK/TMS/TDI/TDO | JTAG debug interface | IEEE-1149.1-compliant boundary scan and flash programming; coexists with SWD port |
| ETH_RXD[3:0]/TXD[3:0] | Gigabit Ethernet data lanes | Supports RGMII timing; requires matched trace lengths and 50-Ω termination for 1-Gbps operation |
| CANFD0_TX/CANFD0_RX | Channel 0 CAN FD transceiver interface | Differential pair routed with controlled impedance (120 Ω) for up to 8 Mbps data rate |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic firmware updates without runtime interruption-critical for OTA compliance in ASIL-B ECUs |
| Hardware Security Module (HSM) | Offloads cryptographic operations (AES, ECC, SHA) from main CPUs, reducing latency and attack surface |
| Smart I/O blocks (5 units) | Perform Boolean logic (AND/OR/XOR) on GPIO signals in hardware-eliminates software polling for sensor fusion triggers |
| Configurable BOD thresholds | Independent 2.7 V / 3.0 V detection on VDDD/VDDA and 1.1 V on VCCD enables precise brown-out response per domain |
| SECDED ECC on all safety memories | Corrects single-bit errors and detects double-bit errors in SRAM, flash, and TCM-required for ASIL-B memory integrity |
Applications
| Body Control Module (BCM) | Gateway ECU |
|---|---|
Use Scenario: Centralized vehicle body functions including door locks, lighting, window lift, and climate control. IC Role / Device Role / Timing Role: Primary controller executing real-time PWM for LED drivers, LIN slave coordination, and CAN FD message routing. Use Value: Dual Cortex-M7 cores enable concurrent motor control (TCPWM) and network stack processing; 240 GPIOs support direct I/O expansion without external expanders. | Use Scenario: Aggregation and translation between CAN FD, LIN, FlexRay, and Ethernet domains in zonal architectures. IC Role / Device Role / Timing Role: High-throughput gateway processor managing protocol conversion, firewall rules, and time-synchronized diagnostics via IEEE-1588 PTP. Use Value: Two Gigabit Ethernet MACs with RGMII support enable deterministic AVB audio/video bridging; FlexRay V2.1 ensures fault-tolerant chassis communication. |
| Advanced Lighting Control | Firmware-Update-Enabled ECU |
Use Scenario: Adaptive front-lighting systems (AFS) with dynamic beam shaping using matrix LED arrays. IC Role / Device Role / Timing Role: Real-time PWM generation with dead-time insertion (PWM_DT) for LED current regulation and synchronized SAR ADC sampling for thermal feedback. Use Value: 15 dedicated 16-bit motor-control timers and synchronized triple-SAR ADC scanning ensure sub-microsecond phase alignment across 99-channel sensing. | Use Scenario: Over-the-air (OTA) firmware updates for safety-critical ECUs requiring zero downtime and rollback capability. IC Role / Device Role / Timing Role: Secure boot loader verifying signed images using HSM-accelerated RSA/ECC, then writing to dual-bank flash with RWW. Use Value: Hardware-enforced secure boot and atomic dual-bank flash update eliminate risk of bricking during field updates-meeting UNECE R156 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 (320 MHz); 4 MB flash; no integrated Ethernet MAC; supports CAN FD (8 ch) and LIN (16 ch) | Lacks Gigabit Ethernet and FlexRay-suitable for non-zonal gateways or body controllers without AVB/PTP needs | Select when Ethernet/FlexRay are unnecessary and cost-sensitive BOM optimization is prioritized over protocol breadth |
| Renesas RH850/U2A | 32-bit proprietary core (400 MHz); 8 MB flash; 10 CAN FD; no Ethernet MAC; supports FlexRay and LIN | Higher core performance but no hardware crypto accelerator or dual-bank flash-requires external HSM for secure boot | Prefer for legacy RH850 ecosystem migration where ASIL-B is met via external security ICs and external memory |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT4BFCCHDQ0BZEGS uniquely integrates dual Cortex-M7 cores, dual Gigabit Ethernet MACs with IEEE-1588, FlexRay, and an on-die HSM-enabling consolidated zonal gateway and high-integrity lighting control without external co-processors or PHYs.
Availability
CYT4BFCCHDQ0BZEGS is available at Aetrix Electronics and suitable for automotive body-control modules, zonal gateways, adaptive lighting systems, and OTA-enabled ECUs requiring stable component supply, long lifecycle commitment, and ASIL-B certification support.
Supply support for CYT4BFCCHDQ0BZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification expertise.
CYT4BF belongs to the TRAVEO™ T2G product line, designed specifically for next-generation automotive ECUs demanding ASIL-B compliance, multi-protocol connectivity (CAN FD/Ethernet/FlexRay), and hardware-accelerated security for OTA firmware deployment.
FAQ
What is the maximum CAN FD data rate supported by CYT4BFCCHDQ0BZEGS?
CYT4BFCCHDQ0BZEGS supports CAN FD data rates up to 8 Mbps, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0 (non-ISO). Actual achievable rate depends on physical layer topology, transceiver capabilities, and bus length-verified with ISO 16845:2015 conformance testing.
Does CYT4BFCCHDQ0BZEGS include hardware support for IEEE-1588 Precision Time Protocol?
Yes, both Gigabit Ethernet MAC interfaces support IEEE-1588 PTP with hardware timestamping for sub-microsecond synchronization. The MACs implement full PTP stack offload including transparent clock and boundary clock modes, enabling deterministic time-aware networking in automotive zonal architectures.
How does the dual-bank flash architecture enable safe firmware updates?
The 8384 KB code-flash operates in dual-bank mode, allowing one bank to execute while the other is reprogrammed. Combined with hardware-verified secure boot using HSM-accelerated RSA/ECC signature checks, this enables atomic, rollback-safe OTA updates-meeting UNECE R156 requirements for automotive software updates.
What safety mechanisms are implemented for ASIL-B compliance?
CYT4BFCCHDQ0BZEGS implements ASIL-B compliance via hardware-enforced mechanisms: shared memory protection unit (SMPU), peripheral protection unit (PPU), multi-counter watchdog timer (MCWDT), clock supervisor (CSV), brown-out detection with dual thresholds, and SECDED ECC on all safety-critical memories (SRAM, flash, TCM).
CYT4BFCCHDQ0BZEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 320-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 240
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFCCHDQ0BZEGS FAQ
1.How can I place an order for CYT4BFCCHDQ0BZEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFCCHDQ0BZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFCCHDQ0BZEGS reliable?
The price and inventory of CYT4BFCCHDQ0BZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFCCHDQ0BZEGS is usually 5 days.
3.What payment methods are accepted for CYT4BFCCHDQ0BZEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFCCHDQ0BZEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BFCCHDQ0BZEGS?
CYT4BFCCHDQ0BZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFCCHDQ0BZEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFCCHDQ0BZEGS?
For technical support, including CYT4BFCCHDQ0BZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFCCHDQ0BZEGS requirements.
6.How does Aetrix verify that CYT4BFCCHDQ0BZEGS is sourced from the original manufacturer or authorized distributors?
All CYT4BFCCHDQ0BZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFCCHDQ0BZEGS meets industry standards.
7.What is the process for return or replacement of CYT4BFCCHDQ0BZEGS?
All CYT4BFCCHDQ0BZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFCCHDQ0BZEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFCCHDQ0BZEGS part is unused and in its original packaging.
Return procedure for CYT4BFCCHDQ0BZEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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