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Infineon Technologies CYT4BFCCHDQ0BZEGST

Part No.:
CYT4BFCCHDQ0BZEGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
320-LFBGA
Datasheet:
AetrixCYT4BFCCHDQ0BZEGST.pdf
Description:
IC MCU 32BT 8.1875MB FLSH 320BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,571

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Product details

Overview

CYT4BFCCHDQ0BZEGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Arm® Cortex®-M0+ CPU, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, FlexRay, and LIN (up to 20 channels). It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography acceleration.

For engineers reviewing the CYT4BFCCHDQ0BZEGST datasheet, CYT4BFCCHDQ0BZEGST pinout, CYT4BFCCHDQ0BZEGST application, or CYT4BFCCHDQ0BZEGST equivalent, this page delivers verified technical context, package mapping, real-world use cases, and validated alternative options for automotive ECU design and firmware-over-the-air (FOTA) deployment.

Technical Context

The device implements a heterogeneous multi-core architecture with hardware inter-processor communication between two Cortex-M7 cores and one Cortex-M0+ core, enabling separation of safety-critical peripheral management from primary application processing. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM), RWW flash operation, and dual-bank flash for atomic FOTA updates.

Clock system integrates IMO, ILO, ECO, WCO, PLL, and FLL with CSV supervision; power management supports five low-power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V/3.0 V on VDDD/VDDA, 1.1 V on VCCD) and wakeup via up to 240 GPIOs or dedicated event generators.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Arm® Cortex®-M0+, enabling real-time task partitioning and ASIL-B safety isolation.
Flash Memory 8384 KB code-flash + 256 KB work-flash, supporting Read-While-Write and dual-bank mode for seamless FOTA updates.
SRAM 1024 KB with selectable retention granularity, allowing fine-grained power gating during low-power modes.
CAN FD Channels Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, enabling 8 Mbps data rate in compatible physical layers.
Ethernet MAC Two 10/100/1000 Mbps IEEE-802.3az-compliant interfaces with MII/RMII/GMII/RGMII PHY support and IEEE-1588 PTP timing precision.
Security Engine HSM with eSHE, AES-128/192/256, SHA-256/512, RSA/ECC acceleration, TRNG, and secure boot via digital signature verification.
ADC Three 12-bit SAR ADCs, each with up to 99 external channels and 1 Msps sampling rate; supports synchronized sampling for motor control.

Pinout & Package

Package: 320-ball BGA, 17 mm × 17 mm × 1.7 mm max, 0.8-mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
VDDA Analog supply input 2.7–5.5 V analog domain supply; requires separate filtering from digital rails for ADC accuracy.
VDDD Digital core supply input 2.7–5.5 V digital domain supply; powers Cortex-M7/M0+ cores and digital peripherals.
VCCD Core regulator output 1.1 V nominal regulated core voltage generated internally; monitored by 1.1 V BOD threshold.
XTAL_IN / XTAL_OUT External crystal oscillator interface Supports 1–50 MHz crystals for precise clock source; used with ECO block for high-stability timing.
TCK / TMS / TDI / TDO JTAG debug interface IEEE-1149.1-compliant boundary-scan and debug access; enables full SWD/JTAG trace and programming.
ETH_RXD[3:0] / ETH_TXD[3:0] Gigabit Ethernet PHY data lanes RGMII interface pins; require controlled impedance routing and matched trace lengths for signal integrity at 1 Gbps.

Key Features

Feature Design Value
Dual-bank flash architecture Enables atomic firmware updates without halting application execution-critical for zero-downtime ECU reprogramming.
Hardware Security Module (HSM) Offloads cryptographic operations (AES, SHA, RSA/ECC) from main CPUs, reducing latency and improving runtime security posture.
ASIL-B safety mechanisms Includes SMPU, PPU, SECDED ECC on SRAM/flash/TCM, MCWDT, and CSV-provides certified fault containment for automotive systems.
Configurable Smart I/O blocks Five independent logic units performing Boolean operations on up to 36 GPIO_STD pins-enables hardware-accelerated signal conditioning without CPU load.
Synchronized multi-ADC sampling Simultaneous start of conversion across all three SAR ADCs-essential for accurate motor phase current sensing and field-oriented control.

Applications

Body Control Module (BCM) Advanced Gateway ECU

Use Scenario: Centralized vehicle body electronics managing lighting, door locks, window lifts, and climate control via CAN FD and LIN networks.

IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant software stack with real-time scheduling and secure OTA update capability.

Use Value: Dual Cortex-M7 cores handle concurrent LIN gateway translation and CAN FD message routing while M0+ manages secure boot and crypto key provisioning.

Use Scenario: High-bandwidth vehicle network gateway aggregating CAN FD, FlexRay, Ethernet, and LIN traffic between domain controllers and ADAS subsystems.

IC Role / Device Role / Timing Role: Multi-protocol bridge with IEEE-1588 PTP synchronization across Ethernet domains and deterministic CAN FD frame scheduling.

Use Value: Two Gigabit Ethernet MACs enable time-synchronized AVB streaming to infotainment, while FlexRay handles chassis control messaging with fault-tolerant dual-channel configuration.

Electric Power Steering (EPS) Automotive Audio Domain Controller

Use Scenario: Real-time motor control and torque feedback processing in EPS systems requiring functional safety and fast current-loop response.

IC Role / Device Role / Timing Role: Safety-certified controller running motor control algorithms with synchronized 12-bit ADC sampling and PWM_DT generation for gate drivers.

Use Value: Three SAR ADCs sample motor phase currents simultaneously; TCPWM blocks generate dead-time-compensated PWM with <100 ns resolution for precise FET switching.

Use Scenario: Central audio processing unit routing multi-channel I2S/TDM streams between microphones, speakers, and DSPs in premium vehicle cabins.

IC Role / Device Role / Timing Role: Audio interface hub with three independent I2S controllers supporting master/slave, TDM, and left-justified formats at sample rates up to 192 kHz.

Use Value: Dedicated audio clock domains and programmable sample-rate generators eliminate jitter in multi-zone audio playback and ANC feedforward paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Single 320-MHz Arm® Cortex®-M7 core; no Cortex-M0+ companion core; 4 MB flash; supports CAN FD (12 ch), Ethernet (1x 1000BASE-T1), but lacks FlexRay. Better suited for mid-tier gateway or chassis ECUs where FlexRay is not required and single-core determinism suffices. Select when FlexRay integration is unnecessary and cost-sensitive BOM optimization is prioritized over dual-core safety partitioning.
Renesas RH850/U2A 32-bit RXv3 core (not Arm); 12 MB flash; supports CAN FD (16 ch), Ethernet (1x 1000BASE-T1), FlexRay (2 ch); ASIL-D capable but no integrated HSM. Targeted at powertrain and brake ECUs requiring highest ASIL-D compliance and larger code footprint, with external crypto co-processor needed. Choose when ASIL-D certification is mandatory and legacy RX ecosystem integration outweighs Arm toolchain advantages.

Compared with S32K344 and RH850/U2A, CYT4BFCCHDQ0BZEGST uniquely combines dual Cortex-M7 cores with integrated HSM and FlexRay-making it optimal for high-end body/gateway ECUs needing both safety partitioning and multi-protocol bridging without external security chips.

Availability

CYT4BFCCHDQ0BZEGST is available at Aetrix Electronics and suitable for automotive body-control modules, gateway ECUs, electric power steering systems, and audio domain controllers requiring stable component supply, long lifecycle support, and ASIL-B compliance.

Supply support for CYT4BFCCHDQ0BZEGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT4BF belongs to the TRAVEO™ T2G family-designed specifically for next-generation automotive ECUs demanding high-performance computing, multi-protocol connectivity, functional safety (ASIL-B), and hardware-enforced security for OTA-updatable systems.

FAQ

What is the maximum operating frequency of the Cortex-M7 cores in CYT4BFCCHDQ0BZEGST?

The dual Arm® Cortex®-M7 CPUs operate at up to 350 MHz each, with single-cycle multiply, FPU, and 16-KB instruction/data caches. This frequency is guaranteed across the full industrial temperature range (–40°C to +125°C) and supported by the internal PLL with CSV monitoring for clock stability validation.

Does CYT4BFCCHDQ0BZEGST support secure boot with public-key verification?

Yes-it implements fast secure boot using digital signature verification with RSA or ECC keys stored in OTP eFuse. The HSM validates firmware signatures before execution, and boot images must be signed using private keys corresponding to public keys fused into the device during manufacturing.

How many CAN FD channels does CYT4BFCCHDQ0BZEGST support, and what is the maximum data rate?

CYT4BFCCHDQ0BZEGST supports up to 10 CAN FD channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0. The theoretical maximum data rate is 8 Mbps, though actual performance depends on transceiver capabilities, bus topology, and termination-verified per ISO 16845:2015 conformance testing.

Is external memory interface supported, and what protocols are available?

Yes-the device includes one configurable interface supporting either SPI (single/dual/quad/octal) or HYPERBUS™ protocols. It enables Execute-In-Place (XIP) from external memory and supports on-the-fly encryption/decryption using the integrated HSM, allowing secure expansion of code and data space beyond on-chip flash/SRAM.

CYT4BFCCHDQ0BZEGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
320-LFBGA
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4BFCCHDQ0BZEGST FAQ

1.How can I place an order for CYT4BFCCHDQ0BZEGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4BFCCHDQ0BZEGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4BFCCHDQ0BZEGST reliable?

The price and inventory of CYT4BFCCHDQ0BZEGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFCCHDQ0BZEGST is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFCCHDQ0BZEGST transactions.

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CYT4BFCCHDQ0BZEGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4BFCCHDQ0BZEGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4BFCCHDQ0BZEGST?

For technical support, including CYT4BFCCHDQ0BZEGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFCCHDQ0BZEGST requirements.

6.How does Aetrix verify that CYT4BFCCHDQ0BZEGST is sourced from the original manufacturer or authorized distributors?

All CYT4BFCCHDQ0BZEGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFCCHDQ0BZEGST meets industry standards.

7.What is the process for return or replacement of CYT4BFCCHDQ0BZEGST?

All CYT4BFCCHDQ0BZEGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFCCHDQ0BZEGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4BFCCHDQ0BZEGST part is unused and in its original packaging.

Return procedure for CYT4BFCCHDQ0BZEGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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