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Infineon Technologies CYT4BFCCHDQ0BZSGS

Part No.:
CYT4BFCCHDQ0BZSGS
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
320-LFBGA
Datasheet:
AetrixCYT4BFCCHDQ0BZSGS.pdf
Description:
IC MCU 32BT 8.1875MB FLSH 320BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,207

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Product details

Overview

CYT4BFCCHDQ0BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Arm® Cortex®-M0+ CPU, 8384 KB code-flash with RWW support, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, FlexRay, and LIN interfaces. It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography acceleration.

For engineers reviewing the CYT4BFCCHDQ0BZSGS datasheet, CYT4BFCCHDQ0BZSGS pinout, CYT4BFCCHDQ0BZSGS application, or CYT4BFCCHDQ0BZSGS equivalent, this MCU delivers deterministic real-time control, multi-domain security isolation via dedicated M0+ subsystem, and flexible peripheral routing for complex automotive domain controllers.

Technical Context

The CYT4BFCCHDQ0BZSGS implements a heterogeneous dual-core architecture where two Cortex-M7 cores handle primary application processing with independent 16-KB I/D caches and TCM, while the Cortex-M0+ manages peripheral offload, security services, and inter-processor communication via hardware mailbox. Memory subsystem includes SECDED ECC on all safety-critical memories (flash, SRAM, TCM) and dual-bank flash supporting FOTA updates.

Its communication stack integrates 10 CAN FD channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, two IEEE-802.3az-compliant Gigabit Ethernet MACs with RGMII/GMII/MII/RMII PHY support, and a V2.1 FlexRay controller configurable for single/dual-channel fault-tolerant operation up to 10 Mbps.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core(s)Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for security/peripheral offload
Flash Memory8384 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA
SRAM1024 KB with selectable retention granularity for low-power mode optimization
CAN FD ChannelsUp to 10 channels; supports 8 Mbps data rate per channel per ISO 11898-1:2015
Ethernet MACTwo 10/100/1000 Mbps IEEE-802.3az-compliant MACs with RGMII/GMII/MII/RMII support
Functional SafetyASIL-B compliant with SMPU, PPU, MCWDT, SECDED ECC on flash/SRAM/TCM, and BOD/OVD/LVD
Cryptography EngineHSM with AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, and GCM mode support

Pinout & Package

This device is packaged in a 320-ball BGA, 17 mm × 17 mm × 1.7 mm max, 0.8-mm ball pitch, with thermal pad and standard JEDEC footprint.

Pin/TerminalCircuit RoleDesign Meaning
VDDAAnalog power supply1.1-V core analog rail; requires separate filtering from digital VDDD for ADC accuracy
VDDDDigital power supply1.1-V digital core rail; decoupled independently to minimize switching noise coupling into analog domains
VCCDDeepSleep regulator inputInput to internal DeepSleep regulator; monitored by 1.1-V BOD threshold for wake-up integrity
XTAL_IN / XTAL_OUTExternal crystal oscillator interfaceSupports 1–50 MHz crystals for precise clock source; used for ECO and WCO configurations
TCK / TMS / TDI / TDOJTAG debug interfaceIEEE-1149.1-compliant boundary-scan and debug access; enables full SWD/JTAG trace capability
RMII_RXD0 / RMII_RXD1 / RMII_CRS_DV / RMII_TX_EN / RMII_TXD0 / RMII_TXD1 / RMII_REF_CLKGigabit Ethernet RMII interfaceDirect connection to RMII PHY; enables 10/100 Mbps operation with minimal pin count and layout simplicity

Key Features

FeatureDesign Value
Dual-bank flash architectureEnables atomic firmware updates without halting real-time execution; critical for OTA reliability in ASIL-B systems
Hardware Security Module (HSM)Offloads cryptographic operations (AES, SHA, ECC) from main CPUs; isolates key storage and secure boot verification
Smart I/O blocks (5 units)Performs Boolean logic on GPIO signals without CPU intervention; reduces latency for safety-critical I/O conditioning
102 TCPWM blocksProvides fine-grained, synchronized PWM generation across motor control and lighting applications with dead-time insertion
Three 12-bit SAR ADCs (99 ch)Supports simultaneous sampling across all ADCs for torque/current sensing in multi-motor systems

Applications

High-End Body Control Module (BCM)Automotive Gateway Controller

Use Scenario: Centralized vehicle body management including door locks, lighting, climate, and seat control with over-the-air update capability.

IC Role / Device Role / Timing Role: Primary application processor with dual Cortex-M7 cores executing real-time body control tasks and M0+ handling CAN FD message filtering and secure boot validation.

Use Value: Dual-bank flash enables safe FOTA updates without system downtime; ASIL-B safety features ensure compliance with ISO 26262 requirements for BCM functions.

Use Scenario: Aggregation and translation of data between CAN FD, LIN, FlexRay, and Ethernet domains in zonal architectures.

IC Role / Device Role / Timing Role: Domain gateway MCU managing protocol bridging, time-synchronized messaging via IEEE-1588 PTP, and firewalling between networks.

Use Value: Two Gigabit Ethernet MACs with RGMII support enable high-bandwidth backhaul to central compute; FlexRay ensures deterministic legacy bus integration.

Electric Power Steering (EPS) Host ControllerAdvanced Lighting Control Unit

Use Scenario: Real-time torque assist calculation, motor position feedback, and fail-safe response in EPS systems.

IC Role / Device Role / Timing Role: Safety-critical host controller running ASIL-B software on Cortex-M7 with hardware ECC on SRAM/flash and watchdog supervision.

Use Value: 15 dedicated 16-bit motor control timers and synchronized ADC sampling ensure precise current loop timing and torque ripple reduction.

Use Scenario: Adaptive LED matrix control with dynamic beam shaping, thermal monitoring, and diagnostics.

IC Role / Device Role / Timing Role: High-resolution PWM generator and sensor fusion hub using SAR ADCs, TCPWM, and Smart I/O for fast LED dimming and fault detection.

Use Value: 102 TCPWM blocks allow independent control of >100 LED segments; programmable analog inputs monitor LED junction temperature for closed-loop thermal derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single Cortex-M7 core (320 MHz); 4 MB flash; no integrated Ethernet MAC; uses external PHY for 1000BASE-T1Lacks native Gigabit Ethernet; optimized for chassis/safety domains rather than zonal gatewaysSelect when Ethernet is not required and cost-sensitive ASIL-D safety certification is prioritized
Renesas RH850/U2ATri-core (3× RH850-G3M); 12 MB flash; 100-MHz core; no HSM; relies on external security IC for secure bootFocused on powertrain; limited CAN FD channels (6); no FlexRay or Gigabit EthernetSelect for legacy powertrain integration where toolchain continuity and long-term automotive qualification outweigh feature density

Compared with S32K344 and RH850/U2A, CYT4BFCCHDQ0BZSGS uniquely combines dual high-frequency M7 cores, integrated dual Gigabit Ethernet, FlexRay, and hardware-accelerated HSM-making it optimal for next-generation zonal gateways requiring concurrent domain consolidation and cybersecurity.

Availability

CYT4BFCCHDQ0BZSGS is available at Aetrix Electronics and suitable for high-end body-control modules, automotive gateway controllers, electric power steering host systems, and advanced lighting control units requiring stable component supply, long lifecycle support, and ASIL-B certified silicon.

Supply support for CYT4BFCCHDQ0BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global manufacturing and R&D infrastructure.

The TRAVEO™ T2G product line was designed specifically for automotive domain controllers and body/gateway applications demanding ASIL-B functional safety, hardware-based security, and high-bandwidth interconnectivity across CAN FD, Ethernet, and FlexRay.

FAQ

What is the maximum operating frequency of the Cortex-M7 cores in CYT4BFCCHDQ0BZSGS?

The dual Arm® Cortex®-M7 CPUs operate at up to 350 MHz each, with independent 16-KB instruction and data caches, 16-KB TCM, and single-cycle multiply/FPU support. This frequency is sustained under automotive temperature range (−40°C to 125°C) with appropriate voltage and thermal management per Infineon's datasheet specifications.

Does CYT4BFCCHDQ0BZSGS support IEEE-1588 Precision Time Protocol?

Yes, both Gigabit Ethernet MAC interfaces comply with IEEE-1588 PTP for sub-microsecond time synchronization across distributed automotive networks. Hardware timestamping is implemented in the MAC layer, enabling accurate time-aware scheduling and AVB stream alignment without CPU overhead.

How many CAN FD channels does CYT4BFCCHDQ0BZSGS support, and what is the maximum data rate?

CYT4BFCCHDQ0BZSGS supports up to 10 CAN FD channels, each capable of up to 8 Mbps data rate under ISO 11898-1:2015 compliance. Actual achievable rate depends on physical layer topology and transceiver selection, but the controller fully implements Bosch CAN FD v1.0 non-ISO features including flexible data phase length and CRC coverage.

Is external memory encryption supported, and how is it implemented?

Yes, the external memory interface supports on-the-fly AES-128 encryption and decryption for SPI or HYPERBUS™ devices. Encryption keys are stored in protected eFuses or HSM-managed key slots; the crypto engine operates transparently during XIP execution, ensuring confidentiality without software intervention or performance penalty.

CYT4BFCCHDQ0BZSGS Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
320-LFBGA
Series:
Traveo™ T2G
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4BFCCHDQ0BZSGS FAQ

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Please submit a Request for Quotation (RFQ) for CYT4BFCCHDQ0BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CYT4BFCCHDQ0BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFCCHDQ0BZSGS is usually 5 days.

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CYT4BFCCHDQ0BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4BFCCHDQ0BZSGS?

For technical support, including CYT4BFCCHDQ0BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFCCHDQ0BZSGS requirements.

6.How does Aetrix verify that CYT4BFCCHDQ0BZSGS is sourced from the original manufacturer or authorized distributors?

All CYT4BFCCHDQ0BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFCCHDQ0BZSGS meets industry standards.

7.What is the process for return or replacement of CYT4BFCCHDQ0BZSGS?

All CYT4BFCCHDQ0BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFCCHDQ0BZSGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4BFCCHDQ0BZSGS part is unused and in its original packaging.

Return procedure for CYT4BFCCHDQ0BZSGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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