My Inquiry
My Account
Infineon Technologies CYT4BFCCHDQ0BZSGST
- Part No.:
- CYT4BFCCHDQ0BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 320-LFBGA
- Datasheet:
-
CYT4BFCCHDQ0BZSGST.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 320BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,863
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4BFCCHDQ0BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Arm® Cortex®-M0+ CPU, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, FlexRay, and LIN interfaces. It targets high-end body-control units requiring ASIL-B functional safety, secure boot, and hardware cryptography acceleration.
For engineers reviewing the CYT4BFCCHDQ0BZSGST datasheet, CYT4BFCCHDQ0BZSGST pinout, CYT4BFCCHDQ0BZSGST application, or CYT4BFCCHDQ0BZSGST equivalent, key selection criteria include dual-core deterministic real-time execution, on-chip eSHE/HSM security, RWW flash for FOTA updates, and support for IEEE-1588 PTP in automotive networked systems.
Technical Context
The device implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex-M7 cores handle primary control and signal processing, while the Cortex-M0+ manages peripheral offload, security state machine, and inter-processor communication via dedicated hardware mailbox. Memory subsystem includes SECDED ECC on all safety-critical memories (SRAM, flash, TCM) and dual-bank flash for atomic firmware updates.
Clock system integrates IMO, ILO, ECO, WCO, PLL, and FLL with CSV supervision; power management supports five low-power modes (Active, Sleep, Low-power Sleep, DeepSleep, Hibernate) with configurable BOD thresholds (2.7 V/3.0 V on VDDD/VDDA, 1.1 V on VCCD) and wakeup sources including up to 240 GPIOs and RTC alarms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Arm® Cortex®-M0+ |
| Flash Memory | 8384 KB code-flash + 256 KB work-flash; supports Read-While-Write and dual-bank FOTA |
| SRAM | 1024 KB with selectable retention granularity for low-power operation |
| CAN FD Channels | Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0 |
| Ethernet MAC | Two 10/100/1000 Mbps interfaces supporting MII/RMII/GMII/RGMII and IEEE-1588 PTP |
| Functional Safety | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC, MCWDT, and CSV |
| Cryptography | HSM with AES-128/192/256, SHA-512/256/160, RSA/ECC, TRNG, and GCM mode |
Pinout & Package
Package: 320-ball BGA, 17 mm × 17 mm × 1.7 mm max, 0.8-mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog supply input | 2.7–5.5 V analog domain supply with dedicated 3.0 V BOD threshold |
| VDDD | Digital core supply input | 2.7–5.5 V digital domain supply with dual BOD thresholds (2.7 V / 3.0 V) |
| VCCD | Core regulator output | 1.1 V nominal regulated core voltage derived from VDDD |
| XTAL_IN / XTAL_OUT | External crystal oscillator connection | Supports 1–50 MHz crystals for precise clock generation and CSV monitoring |
| TCK / TMS / TDI / TDO / nTRST | JTAG debug interface | IEEE-1149.1-compliant boundary-scan and debug access with ETM trace support |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin Arm® SWD port enabling low-pin-count programming and real-time data trace |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Independent Cortex-M7 cores with 16 KB I/D cache, TCM, and hardware inter-processor messaging enable time-critical task partitioning |
| Secure boot & runtime attestation | eSHE/HSM enforces digital signature verification, fast secure boot, and asymmetric crypto (RSA/ECC) for firmware integrity and identity binding |
| Automotive network integration | 10 CAN FD + 2 Gigabit Ethernet + FlexRay + 20 LIN channels allow consolidated gateway and domain controller deployment without external bridge ICs |
| Functional safety infrastructure | MPU/SMPU/PPU, SECDED ECC on all safety memories, MCWDT, and CSV provide hardware-enforced ASIL-B compliance per ISO 26262 |
| Flexible low-power operation | Five power modes with granular retention control, 240-GPIO wakeup capability, and sub-μA Hibernate current enable extended battery life in always-on modules |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and seat functions in premium vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, CAN FD message routing, and LIN slave coordination across 20+ nodes. Use Value: Dual M7 cores execute safety-critical body functions concurrently with diagnostics and OTA update handling in separate secure partitions. |
Use Scenario: Aggregation and translation between CAN FD, FlexRay, Ethernet, and LIN domains in zonal architectures. IC Role / Device Role / Timing Role: High-throughput network bridge with IEEE-1588 PTP synchronization across domains and hardware-accelerated packet filtering. Use Value: Eliminates need for discrete transceivers and protocol converters by integrating 10 CAN FD, 2 Ethernet MACs, and FlexRay in one die. |
| Advanced Lighting Controller | ADAS Domain Controller Support |
Use Scenario: Dynamic LED matrix headlight control with pixel-level PWM, thermal monitoring, and over-the-air calibration. IC Role / Device Role / Timing Role: Real-time PWM generation using 102 TCPWM blocks, SAR ADC sampling of thermal sensors, and secure firmware update via RWW flash. Use Value: 1 Msps ADC sampling and synchronized multi-channel PWM with dead-time insertion enable precise thermal-aware illumination control. |
Use Scenario: Sensor fusion preprocessing and communication offload for radar/camera ECUs in L2+ systems. IC Role / Device Role / Timing Role: Peripheral co-processor managing Gigabit Ethernet AVB streams, CAN FD sensor data ingestion, and secure HSM-verified boot for safety-critical partitions. Use Value: Offloads time-sensitive networking and cryptographic operations from main ADAS SoC, reducing latency and attack surface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 @ 320 MHz; 8 MB flash; no integrated Ethernet MAC; supports CAN FD (8 ch) and LIN (16 ch) | Lacks native Gigabit Ethernet and FlexRay; requires external PHY and bridge ICs for domain gateway use | Select when Ethernet/FlexRay integration is unnecessary and cost-sensitive BOM optimization is prioritized |
| Renesas RH850/U2A | Dual Cortex-R7 @ 400 MHz; 12 MB flash; no HSM; supports CAN FD (12 ch), Ethernet (1x 1000BASE-T1), no FlexRay | Higher compute throughput but lacks FlexRay and integrated HSM; uses different safety architecture (ASIL-D capable) | Select for high-performance motor control or chassis applications where FlexRay is not required and ASIL-D certification path is needed |
Compared with S32K344 and RH850/U2A, CYT4BFCCHDQ0BZSGST uniquely combines dual M7 cores, integrated FlexRay, dual Gigabit Ethernet MACs with IEEE-1588, and certified HSM-making it optimal for ASIL-B gateways requiring multi-protocol convergence and secure FOTA.
Availability
CYT4BFCCHDQ0BZSGST is available at Aetrix Electronics and suitable for automotive body-control modules, vehicle gateways, advanced lighting controllers, and ADAS domain support systems requiring stable component supply, long lifecycle commitment, and ASIL-B compliance.
Supply support for CYT4BFCCHDQ0BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
CYT4BF belongs to the TRAVEO™ T2G family, designed specifically for automotive domain controllers and body electronics demanding real-time performance, functional safety (ASIL-B), and hardware-enforced security in 40-nm process technology.
FAQ
What is the maximum CAN FD data rate supported by CYT4BFCCHDQ0BZSGST?
The device supports CAN FD up to 8 Mbps, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Actual achievable data rate depends on physical layer topology and transceiver capabilities-not internal controller limitation-and is validated per ISO 16845:2015 conformance testing.
Does CYT4BFCCHDQ0BZSGST support IEEE-1588 Precision Time Protocol?
Yes, both integrated Gigabit Ethernet MAC interfaces support IEEE-1588 PTP with hardware timestamping, enabling sub-microsecond synchronization across automotive networks. The feature operates independently per MAC and supports one-step and two-step clock correction modes.
How is functional safety implemented for memory subsystems?
All safety-critical memories-including SRAM, code-flash, work-flash, and TCM-use SECDED (Single Error Correction, Double Error Detection) ECC. Memory protection is enforced via MPU (per-core), SMPU (shared memory), and PPU (peripheral access control), all verified under ISO 26262 ASIL-B requirements.
Can CYT4BFCCHDQ0BZSGST execute code directly from external HyperBus memory?
Yes, the external memory interface supports Execute-In-Place (XIP) from HyperBus devices, with on-the-fly AES-128 encryption/decryption enabled. XIP operation maintains full CPU performance without instruction fetch bottlenecks, and is configurable per memory region via the memory protection unit.
CYT4BFCCHDQ0BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 320-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 240
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFCCHDQ0BZSGST FAQ
1.How can I place an order for CYT4BFCCHDQ0BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFCCHDQ0BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFCCHDQ0BZSGST reliable?
The price and inventory of CYT4BFCCHDQ0BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFCCHDQ0BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4BFCCHDQ0BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFCCHDQ0BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BFCCHDQ0BZSGST?
CYT4BFCCHDQ0BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFCCHDQ0BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFCCHDQ0BZSGST?
For technical support, including CYT4BFCCHDQ0BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFCCHDQ0BZSGST requirements.
6.How does Aetrix verify that CYT4BFCCHDQ0BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4BFCCHDQ0BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFCCHDQ0BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4BFCCHDQ0BZSGST?
All CYT4BFCCHDQ0BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFCCHDQ0BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFCCHDQ0BZSGST part is unused and in its original packaging.
Return procedure for CYT4BFCCHDQ0BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4BFCCHDQ0BZSGST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
