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Infineon Technologies CYT4BFCCJDQ0BZEGS
- Part No.:
- CYT4BFCCJDQ0BZEGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 320-LFBGA
- Datasheet:
-
CYT4BFCCJDQ0BZEGS.pdf
- Description:
- IC MCU 32BT 8.1875MB FLSH 320BGA
- Quantity:
- Payment:
- Shipping:
Inventory:958
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Product details
Overview
CYT4BFCCJDQ0BZEGS from Infineon is a dual-core automotive MCU featuring two 350-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Cortex®-M0+ CPU, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 10 channels), Gigabit Ethernet MAC, and FlexRay interfaces - deployed in high-end body-control units requiring ASIL-B functional safety compliance.
For engineers reviewing the CYT4BFCCJDQ0BZEGS datasheet, CYT4BFCCJDQ0BZEGS pinout, CYT4BFCCJDQ0BZEGS application, or CYT4BFCCJDQ0BZEGS equivalent, this page delivers verified technical context, package mapping, real-world use cases, and validated alternative options for automotive ECU design and FOTA-capable systems.
Technical Context
The CYT4BFCCJDQ0BZEGS implements a heterogeneous multi-CPU architecture: dual M7 cores handle real-time control and signal processing, while the M0+ manages peripheral offload and security services including eSHE/HSM, secure boot, and AES-128/192/256 encryption. Hardware inter-processor communication enables deterministic task partitioning.
It integrates safety-critical subsystems including SECDED ECC on all SRAM/flash/TCM, SMPU/PPU/MPU protection units, MCWDT, BOD at three voltage thresholds (2.7 V, 3.0 V, 1.1 V), and IEEE-1588 PTP support via dual RGMII/MII Ethernet MACs - meeting ISO 26262 ASIL-B requirements out-of-box.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for asymmetric workload distribution |
| Flash Memory | 8384 KB code-flash with RWW, dual-bank mode enabling atomic FOTA updates without runtime interruption |
| SRAM | 1024 KB with selectable retention granularity for low-power sleep state optimization |
| CAN FD Channels | Up to 10 channels supporting 8 Mbps data rate per channel, ISO 11898-1:2015 and Bosch CAN FD v1.0 compliant |
| Ethernet MAC | Two 10/100/1000 Mbps IEEE-802.3az MACs with RGMII/MII/ RMII PHY support and IEEE-1588 PTP timestamping |
| Functional Safety | ASIL-B certified per AEC-Q100; includes SECDED ECC, SMPU, PPU, MCWDT, and dual-threshold BOD |
| Analog Peripherals | Three 12-bit SAR ADCs (99 external channels, 1 Msps max), synchronized sampling for motor-sense applications |
Pinout & Package
CYT4BFCCJDQ0BZEGS is packaged in a 320-ball BGA (17 × 17 × 1.7 mm, 0.8-mm pitch), optimized for automotive ECU thermal and routing density requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog supply input | 1.1-V core analog rail with dedicated regulator; supports precision ADC reference stability |
| VDDD | Digital supply input | 1.1-V digital core rail; decoupled from VDDA to minimize noise coupling into analog subsystems |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–50 MHz crystals for precise clock source; used by ECO for system timing and CAN FD bit-rate accuracy |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Gigabit Ethernet data lanes | RGMII-compliant 4-bit receive/transmit paths enabling 1 Gbps full-duplex operation with hardware timestamping |
| CANFDx_TX / CANFDx_RX | CAN FD transceiver interface | Dedicated differential pairs per channel; supports up to 10 independent CAN FD buses with flexible data-rate arbitration |
| JTAG_TCK / JTAG_TMS / SWDIO / SWCLK | Debug interface signals | IEEE-1149.1 JTAG and Arm SWD ports enable production programming, boundary scan, and real-time trace via ETM |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware update over-the-air (FOTA) with zero downtime - one bank executes while the other is reprogrammed |
| Hardware cryptography engine | Accelerates AES-128/192/256, SHA-256/512, RSA/ECC, and TRNG - offloading security tasks from M7 cores to meet real-time deadlines |
| Smart I/O blocks | Five configurable logic units performing Boolean operations on GPIO_STD signals - enabling hardware-level signal conditioning without CPU intervention |
| Synchronized ADC sampling | Simultaneous start of conversion across all three SAR ADCs for accurate motor phase current measurement and torque estimation |
| Runtime-reconfigurable SCBs | 11 serial communication blocks each switchable between UART/I2C/SPI modes - reducing pin count and simplifying board layout for mixed-protocol ECUs |
Applications
| Body Control Module (BCM) | Advanced Gateway ECU |
|---|---|
Use Scenario: Centralized vehicle power distribution, lighting control, door/window actuation, and climate fan management. IC Role / Device Role / Timing Role: Primary application processor managing CAN FD backbone, LIN subnets, and secure OTA updates. Use Value: Dual M7 cores execute real-time PWM for LED dimming and motor control; M0+ handles LIN protocol stack and secure boot verification independently. | Use Scenario: Aggregating and routing data between CAN FD, FlexRay, Ethernet, and LIN domains in zonal architectures. IC Role / Device Role / Timing Role: High-throughput gateway controller with dual Ethernet MACs for domain controller interconnect and AVB audio streaming. Use Value: IEEE-1588 PTP timestamping ensures sub-microsecond time synchronization across distributed ECUs for coordinated diagnostics and logging. |
| Electric Power Steering (EPS) | Automotive Infotainment Head Unit |
Use Scenario: Real-time torque assist calculation, motor position feedback, and fault-tolerant fail-safe response. IC Role / Device Role / Timing Role: Safety-critical controller executing ASIL-B motor control algorithms with synchronized ADC sampling and PWM_DT generation. Use Value: SECDED ECC on TCM/SRAM and dual-threshold BOD ensure deterministic execution under voltage transients during steering maneuvers. | Use Scenario: Multimedia processing hub integrating audio playback, display rendering, and wireless connectivity (Wi-Fi/Bluetooth via external IC). IC Role / Device Role / Timing Role: Application host interfacing with SDHC (eMMC 5.1), I2S audio codecs, and external memory via HYPERBUS™. Use Value: Execute-in-place (XIP) from encrypted external flash reduces boot latency and eliminates SRAM footprint for large firmware images. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single 320-MHz Arm® Cortex®-M7 core; no M0+ companion core; 4 MB flash; supports CAN FD (8 ch), Ethernet (1 MAC) | Lacks dual-M7 parallelism and hardware crypto acceleration for asymmetric key operations; lower FOTA flexibility due to single-bank flash | Preferred for cost-sensitive ASIL-B gateways where dual-core determinism is not required |
| Renesas RH850/U2A | 32-bit proprietary core (not Arm); 16 MB flash; CAN FD (12 ch); no integrated Ethernet MAC; requires external PHY | No native Gigabit Ethernet or PTP support; limited software ecosystem for AUTOSAR Adaptive; higher toolchain licensing cost | Selected when legacy RH850 software reuse or specific Japanese OEM qualification is mandatory |
Compared with NXP S32K344 and Renesas RH850/U2A, CYT4BFCCJDQ0BZEGS uniquely combines dual M7 performance, on-chip Ethernet with PTP, and hardware-accelerated asymmetric cryptography - making it optimal for next-gen zonal controllers requiring concurrent real-time control, secure communication, and time-synchronized networking.
Availability
CYT4BFCCJDQ0BZEGS is available at Aetrix Electronics and suitable for high-end body-control modules, automotive gateways, electric power steering systems, and infotainment head units requiring stable component supply and long-term automotive lifecycle support.
Supply support for CYT4BFCCJDQ0BZEGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line targets ASIL-B automotive ECUs demanding high-performance computing, functional safety, and integrated connectivity - specifically designed for body, gateway, and chassis applications with FOTA and secure boot requirements.
FAQ
What is the maximum CAN FD data rate supported by CYT4BFCCJDQ0BZEGS?
CYT4BFCCJDQ0BZEGS supports up to 8 Mbps per CAN FD channel, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. The actual achievable rate depends on physical layer topology and external transceiver capabilities, not internal controller limitation.
Does CYT4BFCCJDQ0BZEGS include hardware support for IEEE-1588 Precision Time Protocol?
Yes - both integrated Ethernet MACs support IEEE-1588 PTP with hardware timestamping at the MAC layer, enabling sub-microsecond time synchronization across distributed automotive networks without CPU overhead.
How does the dual-bank flash architecture enable FOTA updates?
The 8384 KB code-flash operates in dual-bank mode: one bank runs active firmware while the other receives and validates new firmware. Upon successful CRC and signature verification, the boot vector switches banks atomically - ensuring zero-downtime updates with rollback capability.
What debug interfaces are available on CYT4BFCCJDQ0BZEGS?
CYT4BFCCJDQ0BZEGS provides IEEE-1149.1 JTAG and Arm SWD interfaces, plus Embedded Trace Macrocell (ETM) support for instruction/data trace. It is compatible with GHS MULTI and IAR EWARM development tools for real-time debugging and performance analysis.
CYT4BFCCJDQ0BZEGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 320-LFBGA
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+/M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 240
- Program Memory Size:
- 8.1875MB (8.1875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 114x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4BFCCJDQ0BZEGS FAQ
1.How can I place an order for CYT4BFCCJDQ0BZEGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4BFCCJDQ0BZEGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4BFCCJDQ0BZEGS reliable?
The price and inventory of CYT4BFCCJDQ0BZEGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4BFCCJDQ0BZEGS is usually 5 days.
3.What payment methods are accepted for CYT4BFCCJDQ0BZEGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4BFCCJDQ0BZEGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4BFCCJDQ0BZEGS?
CYT4BFCCJDQ0BZEGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4BFCCJDQ0BZEGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4BFCCJDQ0BZEGS?
For technical support, including CYT4BFCCJDQ0BZEGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4BFCCJDQ0BZEGS requirements.
6.How does Aetrix verify that CYT4BFCCJDQ0BZEGS is sourced from the original manufacturer or authorized distributors?
All CYT4BFCCJDQ0BZEGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4BFCCJDQ0BZEGS meets industry standards.
7.What is the process for return or replacement of CYT4BFCCJDQ0BZEGS?
All CYT4BFCCJDQ0BZEGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4BFCCJDQ0BZEGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4BFCCJDQ0BZEGS part is unused and in its original packaging.
Return procedure for CYT4BFCCJDQ0BZEGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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