Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CYT4DNJBACQ1BZSGS

Part No.:
CYT4DNJBACQ1BZSGS
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
327-LFBGA
Datasheet:
AetrixCYT4DNJBACQ1BZSGS.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,164

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CYT4DNJBACQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096-KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), and FPD-Link dual output (2880 × 1080 @ 220 MHz), targeting instrument clusters and HUD systems.

For engineers reviewing the CYT4DNJBACQ1BZSGS datasheet, CYT4DNJBACQ1BZSGS pinout, CYT4DNJBACQ1BZSGS application, or CYT4DNJBACQ1BZSGS equivalent, key selection criteria include dual-core deterministic real-time execution, ASIL-B functional safety compliance, on-the-fly JPEG decoding, hardware-accelerated graphics composition, and secure boot with eSHE/HSM support.

Technical Context

The CYT4DNJBACQ1BZSGS implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex®-M7 cores for primary application processing and a dedicated Cortex®-M0+ core for peripheral management and security services. Its system-level safety features include SMPU, PPU, SECDED ECC on all safety-critical memories, and MCWDT.

Graphics subsystem operates at 40-bit internal precision (RGBA 10-bit) with direct capture-to-display video feed, on-the-fly warping, and command-sequenced rendering-enabling HUD-specific real-time distortion correction without frame buffers. The SMIF supports octal SPI, XIP, and on-the-fly encryption for secure external memory access.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+
Flash Memory6336-KB code-flash with RWW, dual-bank FOTA support
SRAM640-KB with configurable retention granularity
Graphics Engine2D/2.5D rendering, 4096-KB embedded VRAM, on-the-fly warping
Video I/OFPD-Link dual (2880×1080 @ 220 MHz), MIPI CSI-2 4-lane (2880×1080)
Networking4× CAN FD (8 Mbps), 1× Gigabit Ethernet MAC (MII/RMII/RGMII), AVB/PTP support
SecurityeSHE/HSM, AES-128/192/256, SHA-512/256/160, RSA/ECC, TRNG
SafetyASIL-B compliant: SECDED ECC, SMPU, PPU, MCWDT, CSV, BOD/OVD/OCD

Pinout & Package

Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDDA_ADCAnalog supply for ADC1.1-V regulated input; enables 12-bit SAR ADC sampling up to 1 Msps with internal temperature/bandgap monitoring
SWDIO/SWCLKSerial Wire Debug interfaceTwo-pin debug path supporting ETM instruction/data trace and secure firmware update via SWD
ETH_RXD[3:0]/TXD[3:0]Gigabit Ethernet PHY interfaceRGMII-compliant 8-bit data lanes for full-duplex 1000BASE-T operation with IEEE-1588 timestamping
CANFD0_TX/RXCAN FD Channel 0 differential pairSupports ISO 11898-1:2015 and non-ISO CAN FD V1.0; 8-Mbps data phase with flexible arbitration
FPDLP0_CLK/CLK_NFPD-Link dual clock differential pair220-MHz differential clock driving dual-channel video output at Wide-HD+ resolution (2880×1080)

Key Features

FeatureDesign Value
Dual-core deterministic executionIndependent M7 cores with 64-KB TCM each enable time-critical HUD rendering and cluster UI logic in parallel
On-the-fly display warpingHardware-accelerated perspective transformation applied during video output-no frame buffer required for HUD optical correction
Secure boot with fast authenticationDigital signature verification using ECC keys and SHA-256 hash ensures trusted firmware launch in <100 ms
ASIL-B hardware safety mechanismsMPU/SMPU/PPU partitioning, SECDED ECC on flash/SRAM/TCM, and dual-clock domain watchdogs meet ISO 26262 requirements
Flexible video capture pipelineSingle capture engine accepts ITU-656, RGB/YUV, or 4-lane MIPI CSI-2 inputs-enables camera-based driver monitoring integration

Applications

Instrument Cluster DisplayHead-Up Display (HUD)

Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, and navigation overlays on TFT-LCD dashboards.

IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant cluster software stack with deterministic graphics composition.

Use Value: Dual M7 cores deliver >300 DMIPS combined performance while VRAM and drawing engine reduce GPU offload dependency.

Use Scenario: Projection of speed, warning icons, and AR navigation onto windshield with optical distortion compensation.

IC Role / Device Role / Timing Role: Graphics subsystem performs on-the-fly perspective warping synchronized to projection timing via hardware-triggered display engine.

Use Value: Eliminates need for external frame buffer memory and reduces latency to <16 ms for motion-synchronized HUD updates.

Camera-Based Driver MonitoringAutomotive Ethernet Gateway

Use Scenario: Capturing and preprocessing cabin-facing camera feeds for drowsiness and distraction detection.

IC Role / Device Role / Timing Role: MIPI CSI-2 4-lane receiver feeding raw YUV frames directly to M0+-managed vision pre-processing pipeline.

Use Value: Integrated capture engine supports 2880×1080 @ 220 MHz, enabling high-resolution facial landmark tracking without external ISP.

Use Scenario: Aggregating CAN FD, LIN, and CXPI messages for time-synchronized routing over Gigabit Ethernet to central domain controller.

IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-1588 PTP and AVB (802.1Qav/Qbb) ensures sub-microsecond time alignment across vehicle networks.

Use Value: Hardware timestamping and traffic shaping eliminate jitter in OTA update delivery and sensor fusion data streams.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive graphics MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, supports CAN FD + Ethernet AVBLacks hardware-accelerated 2D/2.5D rendering and VRAM; requires external GPU for HUDSelect when graphics workload is handled externally or minimal UI complexity suffices
Renesas RH850/U2ADual-lockstep M7 cores, 8 MB flash, ASIL-D capable, no JPEG decoder or FPD-Link interfaceNo native video output interfaces; relies on external SerDes for display connectivitySelect for high-integrity powertrain or chassis control where display is secondary

Compared with S32K344 and RH850/U2A, CYT4DNJBACQ1BZSGS uniquely integrates HUD-optimized graphics acceleration, dual FPD-Link, and on-the-fly JPEG decoding-reducing BOM count and latency in digital cockpit systems requiring simultaneous camera input and multi-display output.

Availability

CYT4DNJBACQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, driver monitoring systems, and Ethernet domain gateways requiring stable component supply across extended production lifecycles.

Supply support for CYT4DNJBACQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT4DN belongs to the TRAVEO™ T2G product line, designed specifically for next-generation automotive digital cockpits requiring integrated graphics, functional safety, and secure connectivity in a single SoC.

FAQ

What is the maximum supported resolution for dual FPD-Link output?

The CYT4DNJBACQ1BZSGS supports dual FPD-Link at up to 2880 × 1080 pixels at 220 MHz pixel clock, enabling Wide-HD+ resolution across two independent displays-verified in the official Infineon datasheet section 3.4 and pin assignment table.

Does this MCU support secure over-the-air (OTA) firmware updates?

Yes. It supports Firmware Update Over The Air (FOTA) via dual-bank flash architecture with Read-While-Write capability, authenticated boot using ECC digital signatures, and AES-GCM encrypted firmware images-features documented in the crypto engine and flash memory sections of the datasheet.

Is the JPEG decoder hardware-accelerated and what formats does it support?

The integrated JPEG decoder is fully hardware-accelerated and conforms to ISO/IEC 10918-1. It supports RGB, YUV (4:4:4/4:2:2/4:1:1/4:2:0), and grayscale color spaces, with image sizes from 1×1 to 16384×16384 pixels-confirmed in the graphics subsystem feature list.

How many CAN FD channels are implemented and what is their data rate capability?

The CYT4DNJBACQ1BZSGS integrates four CAN FD controllers, each supporting up to 8 Mbps data phase rates per ISO 11898-1:2015 and Bosch CAN FD Specification V1.0-validated in the communication interfaces section and electrical specifications table.

CYT4DNJBACQ1BZSGS Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
327-LFBGA
Series:
Traveo™ T2G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 320MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.19MB (6.19M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4DNJBACQ1BZSGS FAQ

1.How can I place an order for CYT4DNJBACQ1BZSGS through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4DNJBACQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4DNJBACQ1BZSGS reliable?

The price and inventory of CYT4DNJBACQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBACQ1BZSGS is usually 5 days.

3.What payment methods are accepted for CYT4DNJBACQ1BZSGS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBACQ1BZSGS transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT4DNJBACQ1BZSGS?

CYT4DNJBACQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4DNJBACQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4DNJBACQ1BZSGS?

For technical support, including CYT4DNJBACQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBACQ1BZSGS requirements.

6.How does Aetrix verify that CYT4DNJBACQ1BZSGS is sourced from the original manufacturer or authorized distributors?

All CYT4DNJBACQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBACQ1BZSGS meets industry standards.

7.What is the process for return or replacement of CYT4DNJBACQ1BZSGS?

All CYT4DNJBACQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBACQ1BZSGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4DNJBACQ1BZSGS part is unused and in its original packaging.

Return procedure for CYT4DNJBACQ1BZSGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYT4DNJBACQ1BZSGS Tags

  • CYT4DNJBACQ1BZSGS
  • CYT4DNJBACQ1BZSGS PDF
  • CYT4DNJBACQ1BZSGS Datasheet
  • CYT4DNJBACQ1BZSGS Specifications
  • CYT4DNJBACQ1BZSGS Images
  • Infineon Technologies
  • Infineon Technologies CYT4DNJBACQ1BZSGS
  • Buy CYT4DNJBACQ1BZSGS
  • CYT4DNJBACQ1BZSGS Price
  • CYT4DNJBACQ1BZSGS Distributor
  • CYT4DNJBACQ1BZSGS Supplier
  • CYT4DNJBACQ1BZSGS Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER