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Infineon Technologies CYT4DNJBACQ1BZSGST
- Part No.:
- CYT4DNJBACQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBACQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:3,130
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Product details
Overview
CYT4DNJBACQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880 × 1080 @ 220 MHz), and JPEG decoding for HUD and instrument cluster applications.
For engineers reviewing the CYT4DNJBACQ1BZSGST datasheet, CYT4DNJBACQ1BZSGST pinout, CYT4DNJBACQ1BZSGST application, or CYT4DNJBACQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time execution, ASIL-B functional safety compliance, on-the-fly graphics composition without frame buffers, and hardware-accelerated crypto (AES-128/192/256, SHA-256/512, ECC, RSA) with eSHE/HSM support.
Technical Context
The device implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex®-M7 cores handle primary application and graphics rendering, while the Cortex®-M0+ manages peripheral control, security boot, and isolation-critical tasks via hardware inter-processor communication. Memory subsystem includes RWW flash with dual-bank FOTA support and SECDED ECC on all safety-critical memories (SRAM, TCM, flash).
Graphics pipeline integrates capture engine (MIPI CSI-2 2-/4-lane, ITU656, RGB), composition engine, display engine, drawing engine, and command sequencer - enabling direct video feed-through with overlay and on-the-fly warping for HUD projection. Audio subsystem provides four TDM, two PCM-PWM, five SG interfaces, and dual PCM mixers feeding a dedicated DAC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 6336-KB code-flash with 128-KB work-flash; supports Read-While-Write and dual-bank FOTA |
| SRAM | 640-KB with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering; 4096 KB embedded VRAM; supports on-the-fly warping and frame-bufferless output |
| Video I/O | FPD-Link dual (2880 × 1080 @ 220 MHz); MIPI CSI-2 4-lane (1920 × 720 @ 110 MHz) |
| Crypto Acceleration | AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, GCM, eSHE/HSM compliant |
| Safety Certification | ASIL-B compliant with MPU, SMPU, PPU, SECDED ECC, MCWDT, CSV, LVD/BOD/OVD/OCD |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated input; supports dual BOD thresholds (2.7 V / 3.0 V) for robust analog sensing |
| VDDD | Digital core supply | 1.1-V nominal core rail generated internally from 2.7–5.5 V input; enables wide-input automotive operation |
| ETH_RXD[3:0]/TXD[3:0] | Gigabit Ethernet PHY interface | Supports MII/RMII/RGMII; enables IEEE-1588 PTP and AVB (802.1AS/Qav/Qbb) for time-synchronized audio/video |
| CANFD[3:0]_TX/RX | CAN FD transceiver interface | Four independent CAN FD channels; supports ISO 11898-1:2015 and non-ISO Bosch V1.0 at up to 8 Mbps |
| MIPI_CSI2_CLK/DP/DM | MIPI CSI-2 camera interface | 2- or 4-lane differential pair; enables high-resolution in-cabin camera input up to 2880 × 1080 |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two Cortex®-M7 cores with independent 16-KB I/D caches, 64-KB TCM each, and hardware IPC enable time-critical HUD rendering and safety monitoring in parallel |
| Hardware graphics acceleration | On-the-fly composition and warping eliminate external frame buffer memory and reduce latency for real-time HUD projection |
| FOTA-ready flash architecture | Dual-bank flash with RWW allows seamless firmware updates without system interruption - critical for over-the-air deployment in vehicle ECUs |
| ASIL-B safety mechanisms | Integrated SMPU, PPU, SECDED ECC on SRAM/flash/TCM, and multi-counter watchdog ensure fault containment per ISO 26262 requirements |
| Secure boot & HSM | eSHE-compliant hardware security module performs authenticated boot using digital signatures and accelerates AES/ECC/SHA for secure OTA and key management |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD or OLED dash displays. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant OS, driving graphics engine and CAN FD communication stack. Use Value: Dual Cortex®-M7 cores deliver deterministic frame rates >60 FPS at 1600 × 600 resolution while maintaining ASIL-B safety partitioning. | Use Scenario: Projection of augmented reality overlays onto windshield with geometric correction for driver eye-point alignment. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and video feed-through from camera to optical combiner. Use Value: On-the-fly warping engine eliminates need for external GPU or frame buffer, reducing BOM cost and latency below 16 ms. |
| In-Cabin Camera Processing | Audio Video Bridging Gateway |
Use Scenario: Capturing and preprocessing driver monitoring or occupant detection video via MIPI CSI-2 interface. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver + JPEG decoder + DMA offload to SRAM; feeds processed frames to M7 for AI inference or CAN FD transmission. Use Value: Hardware JPEG decode supports 1920 × 720@30fps with <500 µs latency, enabling low-power vision processing without external codec. | Use Scenario: Time-synchronized routing of audio streams between infotainment head unit, amplifier, and microphone arrays. IC Role / Device Role / Timing Role: Gigabit Ethernet MAC with IEEE-1588 PTP and AVB (802.1AS/Qav) support acts as central timing and traffic shaping node. Use Value: Sub-microsecond clock synchronization across domains ensures lip-sync accuracy and jitter-free multi-channel audio playback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, supports CAN FD & Ethernet but lacks VRAM and JPEG decode | Targeted at body control and gateway ECU roles; not suitable for HUD/instrument cluster graphics rendering | Select when graphics acceleration is unnecessary and ASIL-D functional safety is required beyond ASIL-B |
| Renesas RH850/U2A | Tri-core lockstep (400 MHz), no GPU or JPEG accelerator, 12 MB flash, supports CAN FD and LIN but no Ethernet MAC or MIPI CSI-2 | Optimized for powertrain and chassis control; lacks display/video subsystems entirely | Select for high-integrity motor control where display capability is irrelevant and legacy toolchain compatibility is prioritized |
Compared with S32K344 and RH850/U2A, CYT4DNJBACQ1BZSGST uniquely integrates dual-M7 compute, hardware graphics pipeline, and AVB-compliant Ethernet - making it the only option among the three capable of standalone HUD + instrument cluster convergence without external ASICs.
Availability
CYT4DNJBACQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, Head-Up Displays, in-cabin vision systems, and AVB-based audio gateways requiring stable component supply across extended vehicle production lifecycles.
Supply support for CYT4DNJBACQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CYT4DN belongs to the TRAVEO™ T2G product line, designed specifically for next-generation automotive human-machine interfaces requiring integrated graphics, real-time processing, functional safety, and secure connectivity.
FAQ
What is the maximum display resolution supported by CYT4DNJBACQ1BZSGST?
The device supports dual FPD-Link output at up to 2880 × 1080 pixels @ 220 MHz for Wide-HD HUD projection, and parallel RGB output at 1600 × 600 @ 80 MHz for instrument cluster LCDs. Both interfaces operate simultaneously with independent timing generation and on-the-fly composition.
Does CYT4DNJBACQ1BZSGST support secure boot with cryptographic verification?
Yes - it implements hardware-accelerated secure boot using digital signature verification (RSA/ECC), AES decryption, and SHA-256 hashing via its integrated Crypto Engine and eSHE/HSM modules. Boot image authentication occurs before execution, with tamper-resistant key storage and runtime integrity checks.
How many CAN FD channels does CYT4DNJBACQ1BZSGST integrate?
CYT4DNJBACQ1BZSGST integrates four independent CAN FD controllers, each supporting data rates up to 8 Mbps per ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. All channels support flexible data-rate arbitration and payload lengths up to 64 bytes.
Is Gigabit Ethernet PHY included on-chip?
No - the device includes a full IEEE-802.3az-compliant Gigabit Ethernet MAC with MII/RMII/RGMII interface support, but requires an external PHY chip. It implements IEEE-1588 PTP, AVB (802.1AS/Qav/Qbb), and energy-efficient Ethernet (EEE) features in hardware for precise time synchronization and low-latency streaming.
CYT4DNJBACQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBACQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBACQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBACQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBACQ1BZSGST reliable?
The price and inventory of CYT4DNJBACQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBACQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBACQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBACQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBACQ1BZSGST?
CYT4DNJBACQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBACQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBACQ1BZSGST?
For technical support, including CYT4DNJBACQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBACQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBACQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBACQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBACQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBACQ1BZSGST?
All CYT4DNJBACQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBACQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBACQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBACQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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